1-20 of 41
Nanotechnology
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermal Finite Difference Analysis of Threshold Heating for Nanoscale Machining

Chris A. Trinkle, Phil Smith, R. Ryan Vallance, Basil T. Wong, M. Pinar Mengu¨c¸
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 507-513, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39377
https://doi.org/10.1115/IMECE2002-39377
View Paper titled, Thermal Finite Difference Analysis of Threshold Heating for Nanoscale Machining
Open the PDF for Thermal Finite Difference Analysis of Threshold Heating for Nanoscale Machining in another window
Topics: Heating, Machining, Nanoscale phenomena, Absorption, Atoms, Electron emission, Electrons, Heat, Heat conduction, Laser beams
Proceedings Papers

Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations

Derek C. Tretheway, Luoding Zhu, Linda Petzold, Carl D. Meinhart
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 551-556, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33704
https://doi.org/10.1115/IMECE2002-33704
View Paper titled, Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations
Open the PDF for Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations in another window
Topics: Boundary-value problems, Engineering simulation, Lattice Boltzmann methods, Simulation, Probability, Channel flow, Shear rate, Computer simulation, Flow (Dynamics), Fluids
Proceedings Papers

Ultrasonic Rapid Manufacturing: Implementation and Thermo-Mechanical Analysis

Shailendra Yadav, Charalabos Doumanidis
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 515-521, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39378
https://doi.org/10.1115/IMECE2002-39378
View Paper titled, Ultrasonic Rapid Manufacturing: Implementation and Thermo-Mechanical Analysis
Open the PDF for Ultrasonic Rapid Manufacturing: Implementation and Thermo-Mechanical Analysis in another window
Topics: Manufacturing, Thermomechanics, Metals, Ultrasonic welding, Composite materials, Cycles, Heat, Temperature effects, Welding
Proceedings Papers

To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels

Chang-Hwan Choi, K. Johan A. Westin, Kenneth S. Breuer
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 557-564, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33707
https://doi.org/10.1115/IMECE2002-33707
View Paper titled, To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels
Open the PDF for To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels in another window
Topics: Flow (Dynamics), Microchannels, Water, Shear rate, Borosilicate glasses, Coating processes, Coatings, Manufacturing, Pressure, Self-assembly
Proceedings Papers

Analysis of the Possibility to Simulate a 3D Single-Roll Burnishing Process Using FEA

Sorin Neagu-Ventzel, Liviu C. Luca, Sorin Cioc, Ioan Marinescu
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 523-528, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39380
https://doi.org/10.1115/IMECE2002-39380
View Paper titled, Analysis of the Possibility to Simulate a 3D Single-Roll Burnishing Process Using FEA
Open the PDF for Analysis of the Possibility to Simulate a 3D Single-Roll Burnishing Process Using FEA in another window
Topics: Computer software, Finite element analysis, Finite element methods, Finite element model, Shapes, Simulation, Stress
Proceedings Papers

Comparison of Methods for Simulating Gas Forces on Moving Microbeams

J. R. Torczynski, M. A. Gallis, E. S. Piekos
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 565-570, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33788
https://doi.org/10.1115/IMECE2002-33788
View Paper titled, Comparison of Methods for Simulating Gas Forces on Moving Microbeams
Open the PDF for Comparison of Methods for Simulating Gas Forces on Moving Microbeams in another window
Topics: Microbeams, Boundary-value problems, Navier-Stokes equations, Simulation, Damping, Gasdynamics, Pressure
Proceedings Papers

Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing

Chad B. O’Neil, Ajay P. Malshe, Kumar Virwani, William F. Schmidt
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 529-534, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39381
https://doi.org/10.1115/IMECE2002-39381
View Paper titled, Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing
Open the PDF for Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing in another window
Topics: Design, Microelectromechanical systems, Modeling, Nanomanufacturing, Tolerance analysis
Proceedings Papers

A Unified Model for Shear Driven Gas Micro Flows

P. Bahukudumbi, Ali Beskok
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 541-549, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33699
https://doi.org/10.1115/IMECE2002-33699
View Paper titled, A Unified Model for Shear Driven Gas Micro Flows
Open the PDF for A Unified Model for Shear Driven Gas Micro Flows in another window
Topics: Flow (Dynamics), Shear (Mechanics), Microelectromechanical systems, Shear stress, Compressible flow, Modeling, Rarefied fluid dynamics, Simulation
Proceedings Papers

Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering

T. Sonoda, A. Watazu, J. Zhu, W. Shi, A. Kamiya, K. Kato, T. Asahina
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 535-537, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39382
https://doi.org/10.1115/IMECE2002-39382
View Paper titled, Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering
Open the PDF for Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering in another window
Topics: Aluminum alloys, Carbon, Coatings, Sputtering (Irradiation), Titanium, Alloys, Abrasion, Adhesion, Adhesives, Ceramic coatings
Proceedings Papers

Transmission Microscopic Moire´ Interferometry for Nanoscale Deformation Measurements

C. W. Han, S. Cho, B. Han
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 869-870, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42221
https://doi.org/10.1115/IMECE2003-42221
View Paper titled, Transmission Microscopic Moire´ Interferometry for Nanoscale Deformation Measurements
Open the PDF for Transmission Microscopic Moire´ Interferometry for Nanoscale Deformation Measurements in another window
Topics: Deformation, Interferometry, Nanoscale phenomena, Displacement, Resolution (Optics)
Proceedings Papers

Forces That Drive Self-Assembly of Ternary Epilayer on a Solid Surface

Wei Lu, Dongchoul Kim
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 803-807, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41024
https://doi.org/10.1115/IMECE2003-41024
View Paper titled, Forces That Drive Self-Assembly of Ternary Epilayer on a Solid Surface
Open the PDF for Forces That Drive Self-Assembly of Ternary Epilayer on a Solid Surface in another window
Topics: Self-assembly, Stress
Proceedings Papers

Electroplated Si 3 N 4 Reinforced Metal Matrix Nanocomposites

Xiaochun Li, Zhiwei Li
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 809-813, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41104
https://doi.org/10.1115/IMECE2003-41104
View Paper titled, Electroplated Si 3 N 4 Reinforced Metal Matrix Nanocomposites
Open the PDF for Electroplated Si 3 N 4 Reinforced Metal Matrix Nanocomposites in another window
Topics: Metals, Nanocomposites, Particulate matter, Microhardness, Copper, Electrolytes, Electroplating, Polymers, Scanning electron microscopy
Proceedings Papers

Nanoscale Modeling and Simulation of Interfacial Bonding of Single-Walled Nanotube Reinforced Composites

Jihua Gou, Shunliang Jiang, Bob Minaie, Zhiyong Liang, Chuck Zhang, Ben Wang
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 815-819, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41138
https://doi.org/10.1115/IMECE2003-41138
View Paper titled, Nanoscale Modeling and Simulation of Interfacial Bonding of Single-Walled Nanotube Reinforced Composites
Open the PDF for Nanoscale Modeling and Simulation of Interfacial Bonding of Single-Walled Nanotube Reinforced Composites in another window
Topics: Bonding, Composite materials, Modeling, Molecular dynamics simulation, Nanoscale phenomena, Simulation, Single-walled nanotubes
Proceedings Papers

3-Dimensional Hybrid Continuum-Atomistic Simulations for Multiscale Hydrodynamics

H. S. Wijesinghe, R. Hornung, A. L. Garcia, N. G. Hadjiconstantinou
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 821-830, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41251
https://doi.org/10.1115/IMECE2003-41251
View Paper titled, 3-Dimensional Hybrid Continuum-Atomistic Simulations for Multiscale Hydrodynamics
Open the PDF for 3-Dimensional Hybrid Continuum-Atomistic Simulations for Multiscale Hydrodynamics in another window
Topics: Hydrodynamics, Simulation, Algorithms, Fluids, Flow (Dynamics), Flux (Metallurgy), Interpolation, Modeling, Resolution (Optics)
Proceedings Papers

Nanofluidic Channel Fabrication and Characterization by Micromachining

Wan-Sik Kim, Junghoon Lee, Rodney S. Ruoff
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 841-846, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41588
https://doi.org/10.1115/IMECE2003-41588
View Paper titled, Nanofluidic Channel Fabrication and Characterization by Micromachining
Open the PDF for Nanofluidic Channel Fabrication and Characterization by Micromachining in another window
Topics: Bonding, Manufacturing, Micromachining, Nanofluidics, Oxidation, Semiconductor wafers, Atomic force microscopy, Resolution (Optics), Silicon, Collapse
Proceedings Papers

Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures

M. Asheghi, K. E. Goodson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 847-853, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41623
https://doi.org/10.1115/IMECE2003-41623
View Paper titled, Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures
Open the PDF for Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperatures in another window
Topics: High temperature, Silicon, Thermal conductivity, Silicon-on-insulator, Temperature, Algebra, Heat conduction, Semiconductors (Materials), Simulation, Size effect
Proceedings Papers

Thermal Property Measurement of Thin Aluminum Oxide Layers for Giant Magnetoresistive (GMR) Head Applications

Bahareh Behkam, Yizhang Yang, Mehdi Asheghi
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 855-860, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41626
https://doi.org/10.1115/IMECE2003-41626
View Paper titled, Thermal Property Measurement of Thin Aluminum Oxide Layers for Giant Magnetoresistive (GMR) Head Applications
Open the PDF for Thermal Property Measurement of Thin Aluminum Oxide Layers for Giant Magnetoresistive (GMR) Head Applications in another window
Topics: Aluminum, Damage, Density, Dimensions, Disks, Electrical resistance, Failure, Heating, Joules, Magnetic recording
Proceedings Papers

Numerical Simulation of Hydrocarbon-Hydrogen Reaction Chemistry in a CVD Reactor

R. K. Garg, J. P. Gore, T. S. Fisher
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 861-867, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42076
https://doi.org/10.1115/IMECE2003-42076
View Paper titled, Numerical Simulation of Hydrocarbon-Hydrogen Reaction Chemistry in a CVD Reactor
Open the PDF for Numerical Simulation of Hydrocarbon-Hydrogen Reaction Chemistry in a CVD Reactor in another window
Topics: Chemical vapor deposition, Chemistry, Computer simulation, Hydrogen
Proceedings Papers

Use of High Intensity Milling and Equal Channel Angular Extrusion to Produce and Consolidate Nanostructured Titanium Silicide

Xhemal Kaculi, Malur N. Srinivasan, K. Ted Hartwig
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 871-877, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42229
https://doi.org/10.1115/IMECE2003-42229
View Paper titled, Use of High Intensity Milling and Equal Channel Angular Extrusion to Produce and Consolidate Nanostructured Titanium Silicide
Open the PDF for Use of High Intensity Milling and Equal Channel Angular Extrusion to Produce and Consolidate Nanostructured Titanium Silicide in another window
Topics: Extruding, Milling, Titanium
Proceedings Papers

The Nanomechanics of Tetrahedral Amorphous Diamond-Like Carbon (ta-C) MEMS

I. Chasiotis, S. W. Cho, T. A. Friedmann, J. P. Sullivan
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 879-883, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43370
https://doi.org/10.1115/IMECE2003-43370
View Paper titled, The Nanomechanics of Tetrahedral Amorphous Diamond-Like Carbon (ta-C) MEMS
Open the PDF for The Nanomechanics of Tetrahedral Amorphous Diamond-Like Carbon (ta-C) MEMS in another window
Topics: Carbon, Diamonds, Microelectromechanical systems, Tension, Atomic force microscopy, Failure, Deformation, Dimensions, Elastic moduli, Electromagnetic scattering