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Proceedings Papers

Isothermalization of an IGBT Power Electronic Chip

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Peng Wang, F. Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 5-15, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-41019
https://doi.org/10.1115/IMECE2010-41019
View Paper titled, Isothermalization of an IGBT Power Electronic Chip
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Topics: Cooling, Cooling systems, Design, Electronics, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Hybrid electric vehicles, Microchannels
Proceedings Papers

A Reliability Study of a Novel Type of Solder-Less Interconnection

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Raymond T. Lueg, James W. Rose, James E. Simpson
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 463-468, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37680
https://doi.org/10.1115/IMECE2010-37680
View Paper titled, A Reliability Study of a Novel Type of Solder-Less Interconnection
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Topics: Reliability, Solders, Adhesives, Metals, Cycles, Temperature, Adhesion, Anisotropy, Bonding, Displacement
Proceedings Papers

Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly

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Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 317-324, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37181
https://doi.org/10.1115/IMECE2010-37181
View Paper titled, Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly
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Topics: Manufacturing, Modeling, Optoelectronic devices, Solders, Wetting
Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

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Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40914
https://doi.org/10.1115/IMECE2010-40914
View Paper titled, Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance
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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)
Proceedings Papers

Conjugate Effect of Hygro and Thermo-Mechanical Behavior in MEMS Packages

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Seungbae Park, Jae Kwak, Haojun Zhang, Xin Zhang, Siu-Lung Ng
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 365-373, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39756
https://doi.org/10.1115/IMECE2010-39756
View Paper titled, Conjugate Effect of Hygro and Thermo-Mechanical Behavior in MEMS Packages
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Topics: MEMS packages, Thermomechanics, Temperature, Stress, Weight (Mass), Curve fitting, Diffusion (Physics), High temperature, Numerical analysis, Warping
Proceedings Papers

Characteristic Analysis of Anti-Reflective Subwavelength Cross Gratings Fabricated With Holographic Technique

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Fengmei Zhao, Xiangsu Zhang, Shou Liu, Xuechang Ren
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 1-4, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37974
https://doi.org/10.1115/IMECE2010-37974
View Paper titled, Characteristic Analysis of Anti-Reflective Subwavelength Cross Gratings Fabricated With Holographic Technique
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Topics: Diffraction gratings, Reflection, Refractive index
Proceedings Papers

Thermoelectric Coolers for Thermal Gradient Management on Chip

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Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 187-195, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38184
https://doi.org/10.1115/IMECE2010-38184
View Paper titled, Thermoelectric Coolers for Thermal Gradient Management on Chip
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Topics: Temperature gradient, Thermoelectric coolers, Cooling, Temperature, Transients (Dynamics), Electronic packages, Flat heat pipes, Shapes
Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

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Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37028
https://doi.org/10.1115/IMECE2010-37028
View Paper titled, Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment
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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection
Proceedings Papers

Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources

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Jing He, Anthony M. Jacobi
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 23-30, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40471
https://doi.org/10.1115/IMECE2010-40471
View Paper titled, Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources
Open the PDF for Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources in another window
Topics: Channel flow, Heat, Heat conduction, Heat transfer, Mixed convection, Radiation (Physics)
Proceedings Papers

Organic Monolayers for Low Temperature Copper – Gold Bonding

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X. F. Ang, H. J. Lu, J. Wei, H. J. Zhang, C. C. Wong
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 281-284, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38552
https://doi.org/10.1115/IMECE2010-38552
View Paper titled, Organic Monolayers for Low Temperature Copper – Gold Bonding
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Topics: Bonding, Copper, Low temperature, Bond strength, Chain, Coating processes, Coatings, Temperature
Proceedings Papers

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

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I. Charles Ume, Jie Gong, Razid Ahmad, Abel Valdes
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 507-516, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39970
https://doi.org/10.1115/IMECE2010-39970
View Paper titled, Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference
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Topics: Flip-chip packages, Inspection, Lasers, Solders, Signals, Vibration, Flip-chip devices, Interferometers, Manufacturing industry, Silicon
Proceedings Papers

Thermal and Structural Response of Pin Fins for Different Interface Conditions

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Abul Fazal M. Arif, Sulaman Pashah, Syed M. Zubair, M. Inam
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 375-384, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39972
https://doi.org/10.1115/IMECE2010-39972
View Paper titled, Thermal and Structural Response of Pin Fins for Different Interface Conditions
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Topics: Adhesives, Design, Electronic products, Energy dissipation, Finite element methods, Finite element model, Fins, Heat, Heat sinks, Heat transfer
Proceedings Papers

Thermally Based Design Optimization of Telecommunication Shelter

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Venkata Naga Poornima Mynampati, Feroz Ahamed Iqbal Mariam, Bharathkrishnan Muralidharan, Abhilash Ramachandran Menon, Dereje Agonafer, Mark Hendrix
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 421-426, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40949
https://doi.org/10.1115/IMECE2010-40949
View Paper titled, Thermally Based Design Optimization of Telecommunication Shelter
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Topics: Design, Optimization, Telecommunications, Temperature, Computational fluid dynamics, Electronics, Heat, HVAC equipment, Modular construction, Thermal analysis
Proceedings Papers

Interfacial Delamination Between Through Silicon Vias (TSVs) and Silicon Matrix

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Kuan Hsun Lu, Suk-Kyu Ryu, Qiu Zhao, Rui Huang, Paul S. Ho
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 105-112, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40015
https://doi.org/10.1115/IMECE2010-40015
View Paper titled, Interfacial Delamination Between Through Silicon Vias (TSVs) and Silicon Matrix
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Topics: Delamination, Silicon, Fracture (Materials), Cycles, Finite element analysis, Reliability, Steady state, Cooling, Heating, Metals
Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

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Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37988
https://doi.org/10.1115/IMECE2010-37988
View Paper titled, Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
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Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology
Proceedings Papers

Modeling of Two-Phase Micro-Channel Flow for Thermal Management of Electronic Systems

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Siyi Zhou, Bahgat G. Sammakia
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 325-333, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37219
https://doi.org/10.1115/IMECE2010-37219
View Paper titled, Modeling of Two-Phase Micro-Channel Flow for Thermal Management of Electronic Systems
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Topics: Boiling, Bubbles, Bubbly flow, Cavities, Circuits, Computer software, Critical heat flux, Electronic systems, Flow (Dynamics), Fluctuations (Physics)
Proceedings Papers

Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices

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Andojo Ongkodjojo, Alexis R. Abramson, Norman C. Tien
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 235-244, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40427
https://doi.org/10.1115/IMECE2010-40427
View Paper titled, Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices
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Topics: Cooling, Corona discharge, Design, Electrohydrodynamics, Heat, Modeling, Optimization, Pumps, Wind
Proceedings Papers

Multiscale Thermal Transport Across Solid-Solid Interfaces

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Ganesh Balasubramanian, Ravi Kappiyoor, Ishwar K. Puri
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 197-201, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38766
https://doi.org/10.1115/IMECE2010-38766
View Paper titled, Multiscale Thermal Transport Across Solid-Solid Interfaces
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Topics: Boundary-value problems, Electromagnetic scattering, Flux (Metallurgy), Hydrodynamics, Molecular dynamics, Molecular dynamics simulation, Particulate matter, Phonons, Radiation scattering, Scattering (Physics)
Proceedings Papers

Heat Transfer Enhancement by Helium Gas Filled in a Hard Disk Drive Enclosure

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Jiaping Yang, Cheng Peng Tan, Eng Hong Ong
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 155-159, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37622
https://doi.org/10.1115/IMECE2010-37622
View Paper titled, Heat Transfer Enhancement by Helium Gas Filled in a Hard Disk Drive Enclosure
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Topics: Disks, Heat transfer, Helium
Proceedings Papers

Stabilization Effect of Surfactant and Functional Group on Highly Concentrated Carbon Nanotube Conductive Ink

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H. Tantang, J. Wei
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 285-288, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38562
https://doi.org/10.1115/IMECE2010-38562
View Paper titled, Stabilization Effect of Surfactant and Functional Group on Highly Concentrated Carbon Nanotube Conductive Ink
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Topics: Carbon nanotubes, Inks, Surfactants, Stability, Electrical conductivity, Ions, Thermal conductivity, Spectra (Spectroscopy), Thin films, Ultraviolet radiation