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Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Chi-Te Chin, James N. Fordemwalt, Jong-I Mou

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 53-58, November 15–20, 1998

Paper No: IMECE1998-1015

DOI: https://doi.org/10.1115/IMECE1998-1015

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Topics: Circuits, Complementary metal oxide semiconductors, Computer-aided design, Delays, Diffusion (Physics), Gates (Closures), Integrated circuits, Junctions, Manufacturing, Metal oxide semiconductors

Proceedings Papers

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Ozan Atalay, Murat Gultekin, Sertac Cadirci

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A055, November 1–5, 2021

Paper No: IMECE2021-70472

DOI: https://doi.org/10.1115/IMECE2021-70472

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Topics: Computational fluid dynamics, Heat sinks, Heat transfer, Design, Modeling, Convection, Cooling, Electric vehicles, Electronic components, Energy consumption

Proceedings Papers

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Akira Kano, Tomoko Monda, Tomoyuki Suzuki, Hideaki Uehara, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A028, November 1–5, 2021

Paper No: IMECE2021-70783

DOI: https://doi.org/10.1115/IMECE2021-70783

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Topics: Artificial neural networks, Fatigue, Fatigue failure, Finite element analysis, Fatigue life, Stress, Reliability, Cycles, Maintenance, Solder joints

Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999

Paper No: IMECE1999-1061

DOI: https://doi.org/10.1115/IMECE1999-1061

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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path

Proceedings Papers

Development and Testing of a Planar, Silicon Mini-Capillary Pumped Loop

Kenneth Pettigrew, Brian Smith, Kirk Yerkes, Carol Gamlen, Dorian Liepmann

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 93-98, November 11–16, 2001

Paper No: IMECE2001/MEMS-23814

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23814

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Topics: Microelectromechanical systems, Silicon, Testing, Condensers (steam plant), Temperature, Heat, Reservoirs, Cooling, Design, Dynamics (Mechanics)

Proceedings Papers

Non-Equilibrium Thermal Effects in Power Transistors

Ashok Raman, D. G. Walker, T. S. Fisher

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 253-259, November 11–16, 2001

Paper No: IMECE2001/HTD-24402

DOI: https://doi.org/10.1115/IMECE2001/HTD-24402

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Topics: Equilibrium (Physics), Temperature effects, Transistors, Phonons, Silicon-on-insulator, Temperature, Acoustics, Simulation, Electrons, Heat

Proceedings Papers

Small Heat Source Effects in Sub-Micron Heat Conduction

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 237-238, November 11–16, 2001

Paper No: IMECE2001/HTD-24399

DOI: https://doi.org/10.1115/IMECE2001/HTD-24399

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Topics: Heat, Heat conduction, Phonons, Dimensions, Mean free path, Approximation, Electric fields, Electromagnetic scattering, Failure, Finite volume methods

Proceedings Papers

Photosensitivity of Monolayer Graphene-Base Field Effect Transistor

Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A013, November 9–15, 2018

Paper No: IMECE2018-87245

DOI: https://doi.org/10.1115/IMECE2018-87245

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Topics: Graphene, Transistors, Temperature, Chemical vapor deposition, Silicon, Brightness (Photometry), Cathode ray oscilloscopes, Copper foil, Electrodes, Electron beams

Proceedings Papers

Solution-Gated Ion-Sensitive Field Effect Transistor With Polymer Selective Membrane for Nitrate Detection

Jungyoon Kim, Qingyuan Liu, Tianhong Cui

Proc. ASME. IMECE2018, Volume 2: Advanced Manufacturing, V002T02A089, November 9–15, 2018

Paper No: IMECE2018-87918

DOI: https://doi.org/10.1115/IMECE2018-87918

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Topics: Membranes, Polymers, Transistors, Graphene, Sensors, Spin coating, Water

Proceedings Papers

Biosensor Based on Layer by Layer Deposited Phosphorene Nanoparticles for Liver Cancer Detection

Jungyoon Kim, Shota Sando, Tianhong Cui

Proc. ASME. IMECE2017, Volume 2: Advanced Manufacturing, V002T02A072, November 3–9, 2017

Paper No: IMECE2017-71022

DOI: https://doi.org/10.1115/IMECE2017-71022

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Topics: Biosensors, Cancer, Liver, Nanoparticles, Energy gap, Transistors

Proceedings Papers

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

Chang-Nian Chen, Ji-Tian Han, Wei-Ping Gong, Tien-Chien Jen

Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A085, November 11–17, 2016

Paper No: IMECE2016-66717

DOI: https://doi.org/10.1115/IMECE2016-66717

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Topics: Cooling, Flat plates, Heat flux, Heat sinks, Heat transfer, Water, Flow (Dynamics), Temperature, Flux (Metallurgy), Heat

Proceedings Papers

A MoS 2 Field-Effect Transistor With a Liquid Back Gate

Kabin Lin, Zhishan Yuan, Yu Yu, Kun Li, Haojie Yang, Pinyao He, Jian Ma, Jingjie Sha, Yunfei Chen

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 11–17, 2016

Paper No: IMECE2016-66544

DOI: https://doi.org/10.1115/IMECE2016-66544

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Topics: Gates (Closures), Transistors, Biomedicine, Flexible electronics, Hydrogen storage, Instrumentation, Lithium, Microelectronic devices, Molybdenum, Nanotribology

Proceedings Papers

Characterization of the Electronic Properties and Strain Sensitivity of Graphene Formed by C 2 H 2 Chemical Vapor Deposition

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A036, November 13–19, 2015

Paper No: IMECE2015-53313

DOI: https://doi.org/10.1115/IMECE2015-53313

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Topics: Chemical vapor deposition, Graphene, Density, Nucleation (Physics), Reactive-ion etching, Copper foil, Gages, Grain size, Photolithography, Plasma desorption mass spectrometry

Proceedings Papers

Numerical Analysis on Cooling Performance for FET Heat Sink

Kyung Min Jang, Jun Young Kim, Cholongi Eum, KwangSun Kim

Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A023, November 14–20, 2014

Paper No: IMECE2014-39220

DOI: https://doi.org/10.1115/IMECE2014-39220

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Topics: Cooling, Heat sinks, Numerical analysis, Design, Heat, Temperature, Aluminum, Automobiles, Circuits, Durability

Proceedings Papers

Modeling and Control of the Electrical Actuation System of an Active Hydromagnetic Journal Bearing (AHJB)

Michael G. Farmakopoulos, Eleftherios K. Loghis, Pantelis G. Nikolakopoulos, Nikolaos I. Xiros, Chris A. Papadopoulos

Proc. ASME. IMECE2014, Volume 4B: Dynamics, Vibration, and Control, V04BT04A043, November 14–20, 2014

Paper No: IMECE2014-38346

DOI: https://doi.org/10.1115/IMECE2014-38346

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Topics: Bearings, Bridges (Structures), Circuits, Control modeling, Design, Electromagnetic induction, Electromagnets, Electronics, Engines, Friction

Proceedings Papers

The Effect of Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A020, November 14–20, 2014

Paper No: IMECE2014-39635

DOI: https://doi.org/10.1115/IMECE2014-39635

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Topics: Graphene, Deformation, Energy gap, Electrical conductivity, Stress, Tension, Thermal conductivity, Approximation, Density functional theory, Electron configuration

Proceedings Papers

A Reduced-Order Model of a Microfluidic Transistor

Joseph Bakarji, Khoudor Keniar, Mohammad Cheikh, Issam Lakkis

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A025, November 15–21, 2013

Paper No: IMECE2013-63711

DOI: https://doi.org/10.1115/IMECE2013-63711

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Topics: Microfluidics, Transistors, Membranes, Pressure, Computer simulation, Flow (Dynamics), Fluids, Inertia (Mechanics), Microchannels, Momentum

Proceedings Papers

A Novel Additive Manufacturing File Format for Printed Electronics

Neeraj Panhalkar, Ratnadeep Paul, Sam Anand

Proc. ASME. IMECE2013, Volume 2A: Advanced Manufacturing, V02AT02A010, November 15–21, 2013

Paper No: IMECE2013-64678

DOI: https://doi.org/10.1115/IMECE2013-64678

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Topics: Additive manufacturing, Electronics, Electronic components, Manufacturing, Algorithms, Computer-aided design, Machinery, Capacitors, Geometry, Glass

Proceedings Papers

Wireless ISFET pH Sensor Network for Offshore Microalgae Cultivation

John Malinowski, Patrick Wiley, Jonathan Trent, Emil J. Geiger

Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 53-57, November 9–15, 2012

Paper No: IMECE2012-89605

DOI: https://doi.org/10.1115/IMECE2012-89605

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Topics: Ocean engineering, Sensor networks, Sensors, Electrodes, Fuels, Glass, NASA, Circuits, Membranes, Monitoring systems

NARROW

Advances in Stress Test Chips

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Development and Testing of a Planar, Silicon Mini-Capillary Pumped Loop

Non-Equilibrium Thermal Effects in Power Transistors

Small Heat Source Effects in Sub-Micron Heat Conduction

Photosensitivity of Monolayer Graphene-Base Field Effect Transistor

Solution-Gated Ion-Sensitive Field Effect Transistor With Polymer Selective Membrane for Nitrate Detection

Biosensor Based on Layer by Layer Deposited Phosphorene Nanoparticles for Liver Cancer Detection

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

A MoS 2 Field-Effect Transistor With a Liquid Back Gate

Characterization of the Electronic Properties and Strain Sensitivity of Graphene Formed by C 2 H 2 Chemical Vapor Deposition

Numerical Analysis on Cooling Performance for FET Heat Sink

Modeling and Control of the Electrical Actuation System of an Active Hydromagnetic Journal Bearing (AHJB)

The Effect of Strain on the Electronic Properties of Graphene Nanoribbons

A Reduced-Order Model of a Microfluidic Transistor

A Novel Additive Manufacturing File Format for Printed Electronics

Wireless ISFET pH Sensor Network for Offshore Microalgae Cultivation

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