1-20 of 74
Tin
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Experimental Investigation, Characterization, and Microstructural Enhancement of Laser Cladded Al-Si-Sn-Cu/Ti-6Al-4V Composite Coatings

Olawale Samuel Fatoba, Tien-Chien Jen
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A003, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112906
https://doi.org/10.1115/IMECE2023-112906
View Paper titled, Experimental Investigation, Characterization, and Microstructural Enhancement of Laser Cladded Al-Si-Sn-Cu/Ti-6Al-4V Composite Coatings
Open the PDF for Experimental Investigation, Characterization, and Microstructural Enhancement of Laser Cladded Al-Si-Sn-Cu/Ti-6Al-4V Composite Coatings in another window
Topics: Coatings, Composite materials, Lasers, Tin
Proceedings Papers

A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys

Cemal Basaran
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 149-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0729
https://doi.org/10.1115/IMECE1996-0729
View Paper titled, A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
Open the PDF for A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys in another window
Topics: Alloys, Constitutive equations, Solders, Tin, Deformation, Plasticity, Modeling, Thermomechanics, Viscoplasticity
Proceedings Papers

The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages

Zhenfeng Guo, Thomas J. Gher, Cynthia T. Sarafids, George K. Lucey
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 179-198, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0786
https://doi.org/10.1115/IMECE1996-0786
View Paper titled, The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages
Open the PDF for The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages in another window
Topics: Electronic packages, Solders, Tin, Creep, Deformation, Alloys, Atoms, Electrons, Indium alloys, Shear (Mechanics)
Proceedings Papers

An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages

Zhenfeng Guo
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 199-220, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0787
https://doi.org/10.1115/IMECE1996-0787
View Paper titled, An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages
Open the PDF for An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages in another window
Topics: Electronic packages, Fatigue, Solder joints, Fracture (Process), Temperature, Tin, Failure, Failure mechanisms, Fatigue cracks, Fatigue failure
Proceedings Papers

Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling

Bor Zen Hong, Tsorng-Dih Yuan, Lloyd G. Burrell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 39-46, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0888
https://doi.org/10.1115/IMECE1996-0888
View Paper titled, Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling
Open the PDF for Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling in another window
Topics: Fatigue analysis, Solder joints, Fatigue, Temperature, Air flow, Alloys, Ball-Grid-Array packaging, Ceramics, Cycles, Deformation
Proceedings Papers

Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads

Tsung-Yu Pan, Howard D. Blair, David Mitlin, Gary M. Crosbie, John M. Nicholson, Jon Hangas
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 115-124, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0898
https://doi.org/10.1115/IMECE1996-0898
View Paper titled, Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads
Open the PDF for Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads in another window
Topics: Reliability, Soldering, Thick films, Solders, Tin, Displacement, Adhesives, Circuits, Diffusion (Physics), Failure
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1237
https://doi.org/10.1115/IMECE1997-1237
View Paper titled, Thermal Mechanical Properties of Two Solder Alloys
Open the PDF for Thermal Mechanical Properties of Two Solder Alloys in another window
Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Prediction of Phase Segregation During Mold Filling of Semi-Solid Slurries

Mahmut D. Mat, Olusegun J. Ilegbusi
Proc. ASME. IMECE99, The Science, Automation, and Control of Material Processes Involving Coupled Transport and Rheology Changes, 79-88, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1257
https://doi.org/10.1115/IMECE1999-1257
View Paper titled, Prediction of Phase Segregation During Mold Filling of Semi-Solid Slurries
Open the PDF for Prediction of Phase Segregation During Mold Filling of Semi-Solid Slurries in another window
Topics: Slurries, Geometry, Heat transfer, Particulate matter, Non-Newtonian fluids, Numerical analysis, Tin
Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24728
https://doi.org/10.1115/IMECE2001/EPP-24728
View Paper titled, Creep Behavior of PB-Free Solders
Open the PDF for Creep Behavior of PB-Free Solders in another window
Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds
Proceedings Papers

Novel Resistive Point Heater for MEMS Remote Solder Self-Assembly

Paul E. Kladitis, Victor M. Bright
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 161-167, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1087
https://doi.org/10.1115/IMECE2000-1087
View Paper titled, Novel Resistive Point Heater for MEMS Remote Solder Self-Assembly
Open the PDF for Novel Resistive Point Heater for MEMS Remote Solder Self-Assembly in another window
Topics: Microelectromechanical systems, Self-assembly, Solders, Drops, Nitrogen, Vapors, Manufacturing, Ceramics, Crystals, Design
Proceedings Papers

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Peter Haswell, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 181-187, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2261
https://doi.org/10.1115/IMECE2000-2261
View Paper titled, Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy
Open the PDF for Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy in another window
Topics: Alloys, Durability, Solders, Damage, Failure, Cycles, Displacement, Shear (Mechanics), Temperature, Tin
Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2260
https://doi.org/10.1115/IMECE2000-2260
View Paper titled, Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
Open the PDF for Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling in another window
Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage
Proceedings Papers

Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials

Marwan K. Khraisheh
Proc. ASME. IMECE2000, Recent Trends in Constitutive Modeling of Advanced Materials, 79-94, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1196
https://doi.org/10.1115/IMECE2000-1196
View Paper titled, Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials
Open the PDF for Constitutive Modeling of Multiaxial Deformation and Induced Anisotropy in Superplastic Materials in another window
Topics: Anisotropy, Deformation, Modeling, Superplasticity, Particle spin, Rotation, Spin (Aerodynamics), Alloys, Stress, Tin
Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-12109
https://doi.org/10.1115/IMECE2019-12109
View Paper titled, Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material
Open the PDF for Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material in another window
Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components
Proceedings Papers

Flexible Strain Sensor Using Additive Manufacturing and Conductive Liquid Metal: Design, Fabrication, and Characterization

Austin Smith, Hamzeh Bardaweel
Proc. ASME. IMECE2018, Volume 2: Advanced Manufacturing, V002T02A066, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-88753
https://doi.org/10.1115/IMECE2018-88753
View Paper titled, Flexible Strain Sensor Using Additive Manufacturing and Conductive Liquid Metal: Design, Fabrication, and Characterization
Open the PDF for Flexible Strain Sensor Using Additive Manufacturing and Conductive Liquid Metal: Design, Fabrication, and Characterization in another window
Topics: Additive manufacturing, Design, Liquid metals, Manufacturing, Strain sensors, Sensors, Deformation, Dimensions, Electrical resistance, Elongation
Proceedings Papers

Creep Behavior of a Solder Paste With Bi Addition

Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros, José C. Teixeira
Proc. ASME. IMECE2017, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T11A020, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-71532
https://doi.org/10.1115/IMECE2017-71532
View Paper titled, Creep Behavior of a Solder Paste With Bi Addition
Open the PDF for Creep Behavior of a Solder Paste With Bi Addition in another window
Topics: Creep, Solders, Solder joints, Temperature, Cycles, Fatigue life, Stress, Copper, Damage, Failure mechanisms
Proceedings Papers

Applicability of Heat Mirrors in Reducing Thermal Losses in Concentrating Solar Collectors

Prashant Mahendra, Vikrant Khullar, Madhup Mittal
Proc. ASME. IMECE2016, Volume 6B: Energy, V06BT08A052, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66565
https://doi.org/10.1115/IMECE2016-66565
View Paper titled, Applicability of Heat Mirrors in Reducing Thermal Losses in Concentrating Solar Collectors
Open the PDF for Applicability of Heat Mirrors in Reducing Thermal Losses in Concentrating Solar Collectors in another window
Topics: Heat, Mirrors, Solar collectors, Parabolic troughs, Solar energy, Solar radiation, Glass, Heat transfer, Thermal efficiency, Tin
Proceedings Papers

Solar Selective Volumetric Receivers for Harnessing Solar Thermal Energy

Vikrant Khullar, Himanshu Tyagi, Todd P. Otanicar, Yasitha L. Hewakuruppu, Robert A. Taylor
Proc. ASME. IMECE2016, Volume 6B: Energy, V06BT08A053, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66599
https://doi.org/10.1115/IMECE2016-66599
View Paper titled, Solar Selective Volumetric Receivers for Harnessing Solar Thermal Energy
Open the PDF for Solar Selective Volumetric Receivers for Harnessing Solar Thermal Energy in another window
Topics: Solar energy, Solar thermal power, Absorption, Cermets, Thermal efficiency, Borosilicate glasses, Emissions, Heat, Mirrors, Nanoparticles
Proceedings Papers

Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis

Bao-Hsin Liu, Yu-Liang Chen, Quang-Cherng Hsu
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A022, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66773
https://doi.org/10.1115/IMECE2016-66773
View Paper titled, Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis
Open the PDF for Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis in another window
Topics: Ball-Grid-Array packaging, Bonding, Nanoscale phenomena, Probes, Shear (Mechanics), Shear flow, Solder joints, Tin, Atoms, Crystal structure
Proceedings Papers

Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A056, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40196
https://doi.org/10.1115/IMECE2014-40196
View Paper titled, Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic
Open the PDF for Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic in another window
Topics: Anisotropy, Intermetallic compounds, Tin, Solder joints, Bonding, Crystals, Electron backscatter diffraction, Grain size, Nanoindentation, Reliability