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Proceedings Papers

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Theodorian Borca Tasciuc, Gang Chen

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 297-303, November 16–21, 1997

Paper No: IMECE1997-0855

DOI: https://doi.org/10.1115/IMECE1997-0855

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Topics: Lasers, Microscopes, Thin films, Laser beams, Thermal diffusivity, Thermocouples, Waves, Bulk solids, Fittings, Glass

Proceedings Papers

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Todd M. Harms, Michael Kazmierczak, Frank M. Gerner, A. Hölke, H. T. Henderson, J. Pilchowski, Karl Baker

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 347-357, November 16–21, 1997

Paper No: IMECE1997-0860

DOI: https://doi.org/10.1115/IMECE1997-0860

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Topics: Heat transfer, Microchannels, Pressure drop, Silicon, Flow (Dynamics), Theoretical analysis, Chemical etching, Fluids, Forced convection, Reynolds number

Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997

Paper No: IMECE1997-1235

DOI: https://doi.org/10.1115/IMECE1997-1235

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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing

Proceedings Papers

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

Ashraf -F. Bastawros, Kyung -S. Kim

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 139-144, November 16–21, 1997

Paper No: IMECE1997-0509

DOI: https://doi.org/10.1115/IMECE1997-0509

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Topics: Damage, Electric current, Fracture (Materials), Heating, Thin films, Aluminum, Electrodes, Temperature, Melting, Coating processes

Proceedings Papers

Acoustic-Wave Liquid Mixer

Xu Zhu, Eun Sok Kim

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 35-38, November 16–21, 1997

Paper No: IMECE1997-0936

DOI: https://doi.org/10.1115/IMECE1997-0936

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Topics: Acoustics, Waves, Temperature, Convection, Flow (Dynamics), Fluids, Resonance, Thin films

Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997

Paper No: IMECE1997-0901

DOI: https://doi.org/10.1115/IMECE1997-0901

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Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design

Proceedings Papers

Periodic Heat Flux-Temperature Phase Difference for Thin Metal Films

Kathy J. Hays-Stang, A. Haji-Sheikh

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 205-212, November 16–21, 1997

Paper No: IMECE1997-0959

DOI: https://doi.org/10.1115/IMECE1997-0959

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Topics: Heat, Metals, Temperature, Electrons, Heat transfer, Phonons, Thin films, Heat capacity, Heat flux, Microscale heat transfer

Proceedings Papers

Characterization of Thin-Film Impact Microactuators

Roger L. Hipwell, Richard S. Muller, Albert P. Pisano

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 87-91, November 16–21, 1997

Paper No: IMECE1997-0944

DOI: https://doi.org/10.1115/IMECE1997-0944

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Topics: Microactuators, Thin films, Actuators, Design, Displacement, Impulse (Physics), Micromachining, Microscale devices, Momentum

Proceedings Papers

Strength and Fracture of Micromachined Silicon Structures

Wan Suwito, Martin L. Dunn, Shawn J. Cunningham

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 99-104, November 16–21, 1997

Paper No: IMECE1997-0946

DOI: https://doi.org/10.1115/IMECE1997-0946

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Topics: Fracture (Materials), Fracture (Process), Micromachining, Silicon, Corners (Structural elements), Design, Anisotropy, Chemical etching, Crystals, Manufacturing

Proceedings Papers

Mechanisms of Heat Transfer Enhancement in a Turbulent Boundary Layer Downstream of a Cylinder-Wall Junction

Donald E. Wroblewski, Qi Xie

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 21-28, November 16–21, 1997

Paper No: IMECE1997-0890

DOI: https://doi.org/10.1115/IMECE1997-0890

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Topics: Boundary layer turbulence, Cylinders, Heat transfer, Junctions, Heat transfer coefficients, Sensors, Boundary layers, Eddies (Fluid dynamics), Flow (Dynamics), Fluids

Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Genetic Algorithm Simulation for Deposited Structure of Atoms

Koji Miyazaki, Kunio Hijikata, Takayoshi Inoue

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 199-204, November 16–21, 1997

Paper No: IMECE1997-0958

DOI: https://doi.org/10.1115/IMECE1997-0958

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Topics: Atoms, Genetic algorithms, Simulation, Molecular dynamics simulation, Potential energy, Temperature, Temperature effects, Thin films

Proceedings Papers

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

David M. Wilt, Donald L. Chubb

Proc. ASME. IMECE97, Advanced Energy Systems, 47-52, November 16–21, 1997

Paper No: IMECE1997-0972

DOI: https://doi.org/10.1115/IMECE1997-0972

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Topics: Energy conversion, NASA, Technology development, Emissions, Design, Photovoltaic cells, Power density, Silicon, Temperature, Aluminum

Proceedings Papers

Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields

C. W. Wu, H. Conrad

Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 185-196, November 16–21, 1997

Paper No: IMECE1997-0486

DOI: https://doi.org/10.1115/IMECE1997-0486

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Topics: Electrorheological fluids, Particulate matter, Current density, Design, Electrical conductivity, Fluids, Shear (Mechanics), Thermal conductivity, Thin films, Yield strength

Proceedings Papers

On the Thermal Runaway in Solid Foams

Igor Goldfarb, Vladimir Goldshtein, Grigory Kuzmenko

Proc. ASME. IMECE97, Heat Transfer: Volume 2, 169-177, November 16–21, 1997

Paper No: IMECE1997-0879

DOI: https://doi.org/10.1115/IMECE1997-0879

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Topics: Delays, Dynamics (Mechanics), Explosions, Fire, Fluids, Foams (Chemistry), Insulation, Manifolds, System dynamics, Thin films

Proceedings Papers

Multi-Chamber, Real-Time DNA Analysis in the Field Using Microfabricated Silicon Chambers

P. Belgrader, W. Benett, R. Frattaroli, D. Hadley, R. Langlois, S. Lehew, R. Mariella, Jr., F. Milanovich, S. Nasarabadi, M. A. Northrup, J. Richards, P. Stratton, K. S. Venkateswaran, G. Long, W. Nelson

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 279-283, November 15–20, 1998

Paper No: IMECE1998-1255

DOI: https://doi.org/10.1115/IMECE1998-1255

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Topics: DNA, Microfabrication, Silicon, Emissions, Probes, Chain, Computer software, Cooling, Cycles, Design

Proceedings Papers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Haruna Tada, Ioannis N. Miaoulis, Peter Y. Wong

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 37-44, November 15–20, 1998

Paper No: IMECE1998-1221

DOI: https://doi.org/10.1115/IMECE1998-1221

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Topics: Computer simulation, Microcantilevers, Semiconductor wafers, Etching, Temperature gradient, Emissivity, Separation (Technology), Temperature, Thin films, Design

Proceedings Papers

Pressure and Power Generation During Explosive Vaporization on a Thin-Film Microheater

Z. Zhao, D. Poulikakos, S. Glod

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 45-57, November 15–20, 1998

Paper No: IMECE1998-1222

DOI: https://doi.org/10.1115/IMECE1998-1222

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Topics: Energy generation, Explosives, Pressure, Thin films, Vapors, Phase transition temperature, Sound pressure, Temperature, Water, Acoustic emissions

Proceedings Papers

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Krishnan Nandakumar, Allen G. Parr, Geon Hahm, Michael A. Huff, Stephen M. Phillips

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 139-143, November 15–20, 1998

Paper No: IMECE1998-1234

DOI: https://doi.org/10.1115/IMECE1998-1234

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Topics: Feedback, Shape memory alloys, Valves, Flow (Dynamics), Flow sensors, Micromachining, Air flow, Control equipment, Electronics, Fluids

Proceedings Papers

Thin Film Microresonator for Vacuum Sensing

F. Yuan, C. L. Tom, C. H. Mastrangelo, J. Martin, R. Pfenninger

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 241-246, November 15–20, 1998

Paper No: IMECE1998-1248

DOI: https://doi.org/10.1115/IMECE1998-1248

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Topics: Micromechanical resonators, Thin films, Vacuum, Semiconductor wafers, Silicon, Borosilicate glasses, Glass, Manufacturing, Micromachining, Pressure

2 3 4 5

NARROW

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Experimental Investigation of Heat Transfer and Pressure Drop Through Deep Microchannels in a (110) Silicon Substrate

Advances in Tensile Testing of Polysilicon Thin Films

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

Acoustic-Wave Liquid Mixer

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Periodic Heat Flux-Temperature Phase Difference for Thin Metal Films

Characterization of Thin-Film Impact Microactuators

Strength and Fracture of Micromachined Silicon Structures

Mechanisms of Heat Transfer Enhancement in a Turbulent Boundary Layer Downstream of a Cylinder-Wall Junction

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Genetic Algorithm Simulation for Deposited Structure of Atoms

Thermophotovoltaic Energy Conversion Technology Development at NASA Lewis Research Center

Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields

On the Thermal Runaway in Solid Foams

Multi-Chamber, Real-Time DNA Analysis in the Field Using Microfabricated Silicon Chambers

Numerical Simulation of Radiant Thermal Processing of Bilayer Microcantilevers

Pressure and Power Generation During Explosive Vaporization on a Thin-Film Microheater

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Thin Film Microresonator for Vacuum Sensing

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