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Proceedings Papers

Investigating the Impact of PVD Process Parameters on Residual Stress Distribution: A Multiscale Numerical Analysis Approach

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Shazia Gul Jan, Abba Abdulhamid Abubakar, Abul Fazal M. Arif, Mohammad Shariful Islam Chowdhury, Syed Sohail Akhtar, Bipasha Bose, Khaled Al-Athel
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A056, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145902
https://doi.org/10.1115/IMECE2024-145902
View Paper titled, Investigating the Impact of PVD Process Parameters on Residual Stress Distribution: A Multiscale Numerical Analysis Approach
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Topics: Coatings, Finite element analysis, Numerical analysis, Stress, Stress concentration, Thermal stresses, Computer simulation, Design, Elastic moduli, Modeling
Proceedings Papers

Effect of Soaking Time on the Thermomechanical Response of Sintered NiTi Shape Memory Alloy

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Fares Alawwa, Rashid K. Abu Al-Rub, Bashar El-Khasawneh, Wael Zaki
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A022, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145198
https://doi.org/10.1115/IMECE2024-145198
View Paper titled, Effect of Soaking Time on the Thermomechanical Response of Sintered NiTi Shape Memory Alloy
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Topics: Metals, Nickel titanium alloys, Sintering, Thermomechanics
Proceedings Papers

Comparative Numerical Analysis of Tool Tilt Effects in Friction Stir Processing of AZ91: Exploring SPH Applications

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Roshan Vijay Marode, Tamiru Alemu Lemma, Srinivasa Rao Pedapati, Nabihah Sallih, Mokhtar Awang, Adeel Hassan
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A051, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-143537
https://doi.org/10.1115/IMECE2024-143537
View Paper titled, Comparative Numerical Analysis of Tool Tilt Effects in Friction Stir Processing of AZ91: Exploring SPH Applications
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Topics: Flow (Dynamics), Friction, Numerical analysis, Temperature, Microhardness, Mechanical properties, Temperature distribution, Computer simulation, Grain boundaries, Hydrodynamics
Proceedings Papers

Investigating the Effect of Single-Phase Liquid Immersion Cooling on TG-400 Substrate Core’s Thermomechanical Characteristics

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Rohit Suthar, Pratik Bansode, Venkateshwar Vishnu Tirupati Venkatachalam, Naga Tejesh Ede, Akshay Lakshminarayana, Rabin Bhandari, Akiilessh Sivakumar, Dereje Agonafer
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T12A037, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-146014
https://doi.org/10.1115/IMECE2024-146014
View Paper titled, Investigating the Effect of Single-Phase Liquid Immersion Cooling on TG-400 Substrate Core’s Thermomechanical Characteristics
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Topics: Cooling, Thermomechanics
Proceedings Papers

Bison Verification and Validation Activities for TRISO

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Aysenur Toptan, Jason D. Hales, Wen Jiang
Proc. ASME. IMECE2023, Volume 7: Energy, V007T08A083, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111271
https://doi.org/10.1115/IMECE2023-111271
View Paper titled, Bison Verification and Validation Activities for TRISO
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Topics: Carbon reinforced plastics, Computer simulation, Computer software, Errors, Fast neutron reactors, Finite element methods, Fuels, High temperature, Light water reactors, Nuclear fuels
Proceedings Papers

A Numerical and Experimental Analysis of Compression-Induced Cracking in Epoxy Composite Grout Under Thermo-Mechanical Loading

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Nahri S. Waseetuddin, Abba A. Abubakar, Khaled S. Al-Athel, Syed S. Akhtar
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A003, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112962
https://doi.org/10.1115/IMECE2023-112962
View Paper titled, A Numerical and Experimental Analysis of Compression-Induced Cracking in Epoxy Composite Grout Under Thermo-Mechanical Loading
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Topics: Composite materials, Compression, Epoxy adhesives, Epoxy resins, Experimental analysis, Fracture (Process), High temperature, Thermomechanics
Proceedings Papers

A Numerical and Experimental Investigation About Tensile Fracture in Epoxy Composite Grout Under Thermo-Mechanical Load

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Nahri S. Waseetuddin, Abba A. Abubakar
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A004, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112979
https://doi.org/10.1115/IMECE2023-112979
View Paper titled, A Numerical and Experimental Investigation About Tensile Fracture in Epoxy Composite Grout Under Thermo-Mechanical Load
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Fracture (Materials), Fracture (Process), High temperature, Stress, Thermomechanics
Proceedings Papers

Effect of Internal Structure on Warpage in a Large-Scale Additive Manufacturing Process With Bio-Derived Composites

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Eonyeon Jo, Katie Copenhaver, Deepak Kumar Pokkalla, Tyler Smith, Uday Vaidya, Vlastimil Kunc, Soydan Ozcan, Seokpum Kim
Proc. ASME. IMECE2023, Volume 3: Advanced Manufacturing, V003T03A056, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114142
https://doi.org/10.1115/IMECE2023-114142
View Paper titled, Effect of Internal Structure on Warpage in a Large-Scale Additive Manufacturing Process With Bio-Derived Composites
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Topics: Additive manufacturing, Composite materials, Thermomechanics, Warping
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

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Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
Open the PDF for A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep in another window
Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

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M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Singular Solutions of Interfacial Stresses in Multilayered Structures

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Wan-Lee Yin
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 59-65, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0723
https://doi.org/10.1115/IMECE1996-0723
View Paper titled, Singular Solutions of Interfacial Stresses in Multilayered Structures
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Topics: Stress, Elasticity, Eigenfunctions, Boundary-value problems, Finite element analysis, Temperature, Thermomechanics, Traction, Variational techniques
Proceedings Papers

A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys

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Cemal Basaran
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 149-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0729
https://doi.org/10.1115/IMECE1996-0729
View Paper titled, A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
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Topics: Alloys, Constitutive equations, Solders, Tin, Deformation, Plasticity, Modeling, Thermomechanics, Viscoplasticity
Proceedings Papers

Performance Simulation of High-Temperature Polymeric Composite Materials Using MRLife

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Scott Case, Ari Caliskan, Nirmal Iyengar, Kenneth Reifsnider
Proc. ASME. IMECE96, Aerospace, 375-380, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0647
https://doi.org/10.1115/IMECE1996-0647
View Paper titled, Performance Simulation of High-Temperature Polymeric Composite Materials Using MRLife
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Topics: High temperature, Polymer composites, Simulation, Composite materials, Cracking (Materials), Creep, Cycles, Damage, Fatigue, Fracture (Process)
Proceedings Papers

Thin Film Shape Memory Alloy Microactuators

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P. Krulevitch, A. P. Lee, P. B. Ramsey, J. Trevino, M. A. Northrup
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 301-306, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1365
https://doi.org/10.1115/IMECE1996-1365
View Paper titled, Thin Film Shape Memory Alloy Microactuators
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Topics: Microactuators, Shape memory thin films, Shapes, Stress, Cycles, Design, Dimensions, Fatigue, Temperature, Thermomechanics
Proceedings Papers

Nanojoule Thermal Transfer in Micromechanical Heterostructures

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Rüdiger Berger, Christoph Gerber, James K. Gimzewski, Ernst Meyer, Hans-Joachim Güntherodt
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 49-53, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1335
https://doi.org/10.1115/IMECE1996-1335
View Paper titled, Nanojoule Thermal Transfer in Micromechanical Heterostructures
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Topics: Ethanol, Heat losses, Heat transfer, Heating, Lasers, Nanoscale phenomena, Phase transitions, Silicon nitride ceramics, Thermomechanics, Vacuum
Proceedings Papers

Thermoelastoplastic Stresses in a Rotating Disk of Temperature Dependent Properties With Temperature Gradient

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Shahriar Jahanian
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 67-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0861
https://doi.org/10.1115/IMECE1996-0861
View Paper titled, Thermoelastoplastic Stresses in a Rotating Disk of Temperature Dependent Properties With Temperature Gradient
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Topics: Rotating disks, Stress, Temperature, Temperature gradient, Deformation, Numerical analysis, Collapse, Cooling, Disks, Steady state
Proceedings Papers

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials

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Minfu Lu, Sheng Liu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 87-92, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0894
https://doi.org/10.1115/IMECE1996-0894
View Paper titled, A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
Open the PDF for A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials in another window
Topics: Electronic packaging, Fatigue, Thermomechanics, Alloys, Calibration, Copper, Lead-free solders, Machinery, Testing, Wire
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

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Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

Structural Response of Oxidation Resistant Carbon-Carbon Composites

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T. H. Ashley, O. O. Ochoa
Proc. ASME. IMECE96, Aerospace and Materials, 211-220, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0478
https://doi.org/10.1115/IMECE1996-0478
View Paper titled, Structural Response of Oxidation Resistant Carbon-Carbon Composites
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Topics: Carbon, Composite materials, Oxidation, Laminates, Materials properties, Boron, Chemical vapor deposition, Finite element analysis, Particulate matter, Satin
Proceedings Papers

Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites

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Philip V. D. McLaughlin, Jr., Henry A. McShane, Roland Cochran, Eileen Armstrong-Carroll
Proc. ASME. IMECE96, Aerospace and Materials, 427-441, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0495
https://doi.org/10.1115/IMECE1996-0495
View Paper titled, Effects of High Heat on the Strength and Fatigue Life of Unidirectional Polymer-Matrix Composites
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Topics: Composite materials, Fatigue life, Heat, Polymers, Temperature, Epoxy adhesives, Epoxy resins, Damage, Fibers, Graphite