1-20 of 836
Thermal conductivity
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Investigation of Thermal Conductivity of Partial Periodic Si/Ge Superlattice in Si Nanowire

Available to Purchase

Kamrul Hasan Rafi, Azmir Hasan Mojumder, A. K. M. Monjur Morshed, Titan C. Paul
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A002, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145862
https://doi.org/10.1115/IMECE2024-145862
View Paper titled, Investigation of Thermal Conductivity of Partial Periodic Si/Ge Superlattice in Si Nanowire
Open the PDF for Investigation of Thermal Conductivity of Partial Periodic Si/Ge Superlattice in Si Nanowire in another window
Topics: Molecular dynamics simulation, Nanowires, Superlattices, Thermal conductivity
Proceedings Papers

Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires

Available to Purchase

Aninda Dey, Nafis Sadik Zim, A. K. M. Monjur Morshed, Titan C. Paul
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A040, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145893
https://doi.org/10.1115/IMECE2024-145893
View Paper titled, Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires
Open the PDF for Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires in another window
Topics: Nanowires, Shapes, Silicon, Thermal conductivity
Proceedings Papers

Preliminary Design of an Additively Manufactured Bio-Inspired Thermosyphon for Thermal Energy Storage

Available to Purchase

Ryan Spence, Gavin Hazlett, John Nuszkowski, Stephen Stagon, Christopher Oshman
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A003, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145430
https://doi.org/10.1115/IMECE2024-145430
View Paper titled, Preliminary Design of an Additively Manufactured Bio-Inspired Thermosyphon for Thermal Energy Storage
Open the PDF for Preliminary Design of an Additively Manufactured Bio-Inspired Thermosyphon for Thermal Energy Storage in another window
Topics: Additive manufacturing, Biomimetics, Design, Thermal energy storage, Pressure, Heat, Fractals, Geometry, Phase change materials, Analytical methods
Proceedings Papers

In Situ Thermal Measurement of Polymers

Available to Purchase

Carson Powers, Simon Bratescu, Peter Bearden, Fahim Dorsey, Jessica Trinh, Dal Hyung Kim, Jungkyu Park
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A012, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145513
https://doi.org/10.1115/IMECE2024-145513
View Paper titled, In Situ Thermal Measurement of Polymers
Open the PDF for In Situ Thermal Measurement of Polymers in another window
Topics: Polymers, Thermal conductivity, Elastomers, Polymer chains, Fillers (Materials), Flexible electronics, Phonons, Deformation, Electromagnetic scattering, Mechanical testing
Proceedings Papers

Experimental Evaluation of the Thermal Conductivity of 3D-Printed Polylactic Acid Composite Materials

Available to Purchase

Noah MacFarland, Gerardo Carbajal, Edwar Romero-Ramirez, Christian Stanfill
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A005, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-147410
https://doi.org/10.1115/IMECE2024-147410
View Paper titled, Experimental Evaluation of the Thermal Conductivity of 3D-Printed Polylactic Acid Composite Materials
Open the PDF for Experimental Evaluation of the Thermal Conductivity of 3D-Printed Polylactic Acid Composite Materials in another window
Topics: Additive manufacturing, Composite materials, Heat transfer, Thermal conductivity
Proceedings Papers

Distributed Real-Time Soil Saturation Assessment in Levees Using a Network of Wireless Sensor Packages With Conductivity Probes

Available to Purchase

Puja Chowdhury, James Crews, Ayman Mokhtar, Sai Durga Rithvik Oruganti, Ryan Van Wyk, Austin R. J. Downey, Malichi Flemming, Jason D. Bakos, Jasim Imran, Sadik Khan
Proc. ASME. IMECE2024, Volume 11: Safety Engineering, Risk and Reliability Analysis; Research Posters, V011T14A034, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145950
https://doi.org/10.1115/IMECE2024-145950
View Paper titled, Distributed Real-Time Soil Saturation Assessment in Levees Using a Network of Wireless Sensor Packages With Conductivity Probes
Open the PDF for Distributed Real-Time Soil Saturation Assessment in Levees Using a Network of Wireless Sensor Packages With Conductivity Probes in another window
Topics: Electrical conductivity, Levees, Probes, Sensors, Soil, Thermal conductivity, Flow (Dynamics), Unmanned aerial vehicles, Water, Climate change
Proceedings Papers

Experimental Studies of the Heat Exchange in Paired Vessels Using the Rat Spinotrapezius Muscle

Available to Purchase

Ji Song, Lisa X. Xu, Daniel E. Lemons, Sheldon Weinbaum
Proc. ASME. IMECE97, Advances in Heat and Mass Transfer in Biotechnology, 151-153, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1327
https://doi.org/10.1115/IMECE1997-1327
View Paper titled, Experimental Studies of the Heat Exchange in Paired Vessels Using the Rat Spinotrapezius Muscle
Open the PDF for Experimental Studies of the Heat Exchange in Paired Vessels Using the Rat Spinotrapezius Muscle in another window
Topics: Heat, Muscle, Vessels, Heat transfer, Biological tissues, Blood, Blood flow, Bioheat transfer, Geometry, Thermal conductivity
Proceedings Papers

Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations

Available to Purchase

Simon Bratescu, Jungkyu Park
Proc. ASME. IMECE2023, Volume 7: Energy, V007T08A086, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112656
https://doi.org/10.1115/IMECE2023-112656
View Paper titled, Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations
Open the PDF for Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations in another window
Topics: Algorithms, Density, Fuels, Heat flux, Molecular dynamics, Molecular dynamics simulation, Molten salt reactors, Phonons, Simulation, Temperature
Proceedings Papers

Controlling Thermal Conductivity of Composite Material – Few Large and Many Small Approach

Available to Purchase

Meghana Athadkar, Sylvie Lorente
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A054, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112595
https://doi.org/10.1115/IMECE2023-112595
View Paper titled, Controlling Thermal Conductivity of Composite Material – Few Large and Many Small Approach
Open the PDF for Controlling Thermal Conductivity of Composite Material – Few Large and Many Small Approach in another window
Topics: Composite materials, Metal foams, Thermal conductivity
Proceedings Papers

Developing a Low-Cost Instrumented Heat Transfer Apparatus for Measuring Thermal Conductivity Using Steady-State Methods

Available to Purchase

Brandon Bunt, Kamau Wright, Benjamin Davis
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A062, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114015
https://doi.org/10.1115/IMECE2023-114015
View Paper titled, Developing a Low-Cost Instrumented Heat Transfer Apparatus for Measuring Thermal Conductivity Using Steady-State Methods
Open the PDF for Developing a Low-Cost Instrumented Heat Transfer Apparatus for Measuring Thermal Conductivity Using Steady-State Methods in another window
Topics: Heat conduction, Heat transfer, Steady state, Thermal conductivity, Brass (Metal), Aluminum, Composite materials, Metals, Testing, Thermal conductivity measurement
Proceedings Papers

Graphene Aerogels to Enhance the Effective Thermal Conductivity of Phase Change Materials

Available to Purchase

Jinho Park, John Hankinson, Hyun Ju, Comas Haynes
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A025, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114998
https://doi.org/10.1115/IMECE2023-114998
View Paper titled, Graphene Aerogels to Enhance the Effective Thermal Conductivity of Phase Change Materials
Open the PDF for Graphene Aerogels to Enhance the Effective Thermal Conductivity of Phase Change Materials in another window
Topics: Graphene, Phase change materials, Thermal conductivity, Weight (Mass), Thermal loads, Energy storage, Heat transfer, Phase transition temperature, Testing, Transients (Dynamics)
Proceedings Papers

Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat

Available to Purchase

Spencer Miesner, Gabriella Shibata, Neyda Bautista, Kieran Wolk, Ben Furst, Takuro Daimaru, Eric Sunada, Scott Roberts, John Bellardo, Jim Kuo
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A014, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114220
https://doi.org/10.1115/IMECE2023-114220
View Paper titled, Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat
Open the PDF for Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat in another window
Topics: Additive manufacturing, Heat pipes, Oscillations, Space vehicles, Temperature, Engineering simulation, Simulation, Electronics, Design, Heat
Proceedings Papers

Thermal Characterization of Functionalized Nanodiamond Enhanced Phase Change Materials for Fast Response to Demand

Available to Purchase

Jared Oliver, Ethan Languri, Jim Davidson, Lino Costa, David Kerns
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A056, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113540
https://doi.org/10.1115/IMECE2023-113540
View Paper titled, Thermal Characterization of Functionalized Nanodiamond Enhanced Phase Change Materials for Fast Response to Demand
Open the PDF for Thermal Characterization of Functionalized Nanodiamond Enhanced Phase Change Materials for Fast Response to Demand in another window
Topics: Phase change materials, Thermal characterization, Thermal energy storage, Thermal conductivity, Diamonds, Particulate matter, Electricity (Physics), Energy storage, Fuels, Heat of fusion
Proceedings Papers

Air-Aluminum Foam Applications for Cooling Systems With Heat Generation

Available to Purchase

Gerardo Carbajal
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A005, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-117196
https://doi.org/10.1115/IMECE2023-117196
View Paper titled, Air-Aluminum Foam Applications for Cooling Systems With Heat Generation
Open the PDF for Air-Aluminum Foam Applications for Cooling Systems With Heat Generation in another window
Topics: Aluminum, Cooling systems, Heat, Thermal conductivity
Proceedings Papers

Rapid Cross-Plane Thermal Conductivity Characterization From Data Automation and System Miniaturization

Available to Purchase

Matthew Nakamura, Kailer Okura, Andrea Murillo, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A053, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111923
https://doi.org/10.1115/IMECE2023-111923
View Paper titled, Rapid Cross-Plane Thermal Conductivity Characterization From Data Automation and System Miniaturization
Open the PDF for Rapid Cross-Plane Thermal Conductivity Characterization From Data Automation and System Miniaturization in another window
Topics: Thermal conductivity, Heat, Microelectromechanical systems, Flowmeters, Measurement systems, Sensors, Testing, ASTM International, Coatings, Cutting
Proceedings Papers

Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities

Available to Purchase

Felix Pancheri, Yilun Sun, Christoph August Wilhelm Parhofer, Christoph Rehekampff, Dingzhi Zhang, Tim C. Lueth
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A046, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113510
https://doi.org/10.1115/IMECE2023-113510
View Paper titled, Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities
Open the PDF for Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities in another window
Topics: Cooling, Design automation, Printed circuit boards, Heat sinks, Design, Geometry, Additive manufacturing, Electronics, Heat, Matlab
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

Available to Purchase

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
Open the PDF for Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates in another window
Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures

Available to Purchase

G. Chen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 13-24, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1331
https://doi.org/10.1115/IMECE1996-1331
View Paper titled, Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures
Open the PDF for Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures in another window
Topics: Heat, Superlattices, Thin films, Interfacial thermal resistance, Boundary-value problems, Electromagnetic scattering, First law of thermodynamics, Heat transfer, Integral equations, Mean free path
Proceedings Papers

Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure

Available to Purchase

X. Y. Zheng, S. Z. Li, M. Chen, K. L. Wang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 93-98, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1341
https://doi.org/10.1115/IMECE1996-1341
View Paper titled, Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure
Open the PDF for Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure in another window
Topics: Membranes, Silicon, Thermal conductivity, Bridges (Structures), Circuits, Polysilicon, Signals, Silicon nitride ceramics, Temperature sensors
Proceedings Papers

A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices

Available to Purchase

X. Y. Huang, C. Y. Liu, K. C. Toh
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 37-47, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1334
https://doi.org/10.1115/IMECE1996-1334
View Paper titled, A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices
Open the PDF for A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices in another window
Topics: Heat pipes, Semiconductor devices, Three-dimensional models, Transients (Dynamics), Heat, Semiconductor wafers, Switches, Temperature, Thermal conductivity