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Proceedings Papers

Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations

Simon Bratescu, Jungkyu Park
Proc. ASME. IMECE2023, Volume 7: Energy, V007T08A086, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112656
https://doi.org/10.1115/IMECE2023-112656
View Paper titled, Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations
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Topics: Algorithms, Density, Fuels, Heat flux, Molecular dynamics, Molecular dynamics simulation, Molten salt reactors, Phonons, Simulation, Temperature
Proceedings Papers

Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities

Felix Pancheri, Yilun Sun, Christoph August Wilhelm Parhofer, Christoph Rehekampff, Dingzhi Zhang, Tim C. Lueth
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A046, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113510
https://doi.org/10.1115/IMECE2023-113510
View Paper titled, Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities
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Topics: Cooling, Design automation, Printed circuit boards, Heat sinks, Design, Geometry, Additive manufacturing, Electronics, Heat, Matlab
Proceedings Papers

Controlling Thermal Conductivity of Composite Material – Few Large and Many Small Approach

Meghana Athadkar, Sylvie Lorente
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A054, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112595
https://doi.org/10.1115/IMECE2023-112595
View Paper titled, Controlling Thermal Conductivity of Composite Material – Few Large and Many Small Approach
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Topics: Composite materials, Metal foams, Thermal conductivity
Proceedings Papers

Developing a Low-Cost Instrumented Heat Transfer Apparatus for Measuring Thermal Conductivity Using Steady-State Methods

Brandon Bunt, Kamau Wright, Benjamin Davis
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A062, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114015
https://doi.org/10.1115/IMECE2023-114015
View Paper titled, Developing a Low-Cost Instrumented Heat Transfer Apparatus for Measuring Thermal Conductivity Using Steady-State Methods
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Topics: Heat conduction, Heat transfer, Steady state, Thermal conductivity, Brass (Metal), Aluminum, Composite materials, Metals, Testing, Thermal conductivity measurement
Proceedings Papers

Graphene Aerogels to Enhance the Effective Thermal Conductivity of Phase Change Materials

Jinho Park, John Hankinson, Hyun Ju, Comas Haynes
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A025, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114998
https://doi.org/10.1115/IMECE2023-114998
View Paper titled, Graphene Aerogels to Enhance the Effective Thermal Conductivity of Phase Change Materials
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Topics: Graphene, Phase change materials, Thermal conductivity, Weight (Mass), Thermal loads, Energy storage, Heat transfer, Phase transition temperature, Testing, Transients (Dynamics)
Proceedings Papers

Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat

Spencer Miesner, Gabriella Shibata, Neyda Bautista, Kieran Wolk, Ben Furst, Takuro Daimaru, Eric Sunada, Scott Roberts, John Bellardo, Jim Kuo
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A014, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114220
https://doi.org/10.1115/IMECE2023-114220
View Paper titled, Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat
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Topics: Additive manufacturing, Heat pipes, Oscillations, Space vehicles, Temperature, Engineering simulation, Simulation, Electronics, Design, Heat
Proceedings Papers

Thermal Characterization of Functionalized Nanodiamond Enhanced Phase Change Materials for Fast Response to Demand

Jared Oliver, Ethan Languri, Jim Davidson, Lino Costa, David Kerns
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A056, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113540
https://doi.org/10.1115/IMECE2023-113540
View Paper titled, Thermal Characterization of Functionalized Nanodiamond Enhanced Phase Change Materials for Fast Response to Demand
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Topics: Phase change materials, Thermal characterization, Thermal energy storage, Thermal conductivity, Diamonds, Particulate matter, Electricity (Physics), Energy storage, Fuels, Heat of fusion
Proceedings Papers

Air-Aluminum Foam Applications for Cooling Systems With Heat Generation

Gerardo Carbajal
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A005, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-117196
https://doi.org/10.1115/IMECE2023-117196
View Paper titled, Air-Aluminum Foam Applications for Cooling Systems With Heat Generation
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Topics: Aluminum, Cooling systems, Heat, Thermal conductivity
Proceedings Papers

Rapid Cross-Plane Thermal Conductivity Characterization From Data Automation and System Miniaturization

Matthew Nakamura, Kailer Okura, Andrea Murillo, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A053, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111923
https://doi.org/10.1115/IMECE2023-111923
View Paper titled, Rapid Cross-Plane Thermal Conductivity Characterization From Data Automation and System Miniaturization
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Topics: Thermal conductivity, Heat, Microelectromechanical systems, Flowmeters, Measurement systems, Sensors, Testing, ASTM International, Coatings, Cutting
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures

G. Chen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 13-24, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1331
https://doi.org/10.1115/IMECE1996-1331
View Paper titled, Heat Transport in the Perpendicular Direction of Superlattices and Periodic Thin-Film Structures
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Topics: Heat, Superlattices, Thin films, Interfacial thermal resistance, Boundary-value problems, Electromagnetic scattering, First law of thermodynamics, Heat transfer, Integral equations, Mean free path
Proceedings Papers

Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure

X. Y. Zheng, S. Z. Li, M. Chen, K. L. Wang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 93-98, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1341
https://doi.org/10.1115/IMECE1996-1341
View Paper titled, Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure
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Topics: Membranes, Silicon, Thermal conductivity, Bridges (Structures), Circuits, Polysilicon, Signals, Silicon nitride ceramics, Temperature sensors
Proceedings Papers

A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices

X. Y. Huang, C. Y. Liu, K. C. Toh
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 37-47, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1334
https://doi.org/10.1115/IMECE1996-1334
View Paper titled, A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices
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Topics: Heat pipes, Semiconductor devices, Three-dimensional models, Transients (Dynamics), Heat, Semiconductor wafers, Switches, Temperature, Thermal conductivity
Proceedings Papers

Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joint in Steady Temperature State

Fumito Nakagawa, Toshiyuki Sawa, Yuichi Nakano, Masahide Katsuo
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 17-22, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0855
https://doi.org/10.1115/IMECE1996-0855
View Paper titled, Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joint in Steady Temperature State
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Topics: Adhesive joints, Finite element analysis, Temperature, Thermal stresses, Adhesives, Finite element methods, Epoxy resins, Resins, Thermal conductivity
Proceedings Papers

Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System

Edward S. Kolesar, Rocky R. Reston
Proc. ASME. IMECE96, Engineering Systems, 11-17, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0869
https://doi.org/10.1115/IMECE1996-0869
View Paper titled, Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System
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Topics: Design, Gas chromatography, Manufacturing, Micromachining, Silicon, Nitrogen, Sensors, Circuits, Ejectors, Borosilicate glasses
Proceedings Papers

Simultaneous Determination of Temperature-Dependent Thermal Conductivity and Volumetric Heat Capacity by an Inverse Technique

Keith A. Woodbury, Charles G. Boohaker
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 269-274, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0053
https://doi.org/10.1115/IMECE1996-0053
View Paper titled, Simultaneous Determination of Temperature-Dependent Thermal Conductivity and Volumetric Heat Capacity by an Inverse Technique
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Topics: Heat capacity, Temperature, Thermal conductivity, Thermal properties, Bearings, Excitation, Heating, Sands
Proceedings Papers

Numerical Algorithms for Parameter Estimation

Xinglai Zhuang, Jianping Zhu
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 263-268, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0052
https://doi.org/10.1115/IMECE1996-0052
View Paper titled, Numerical Algorithms for Parameter Estimation
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Topics: Algorithms, Parameter estimation, Engineering simulation, Heat, Simulation, Temperature measurement, Thermal conductivity
Proceedings Papers

Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals

M. A. Lambert, L. S. Fletcher
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 207-215, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0045
https://doi.org/10.1115/IMECE1996-0045
View Paper titled, Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals
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Topics: Contact resistance, Metals, Surface roughness, Electrical conductance, Coatings, Cooling, Electrical conductivity, Electronic packaging, Flight, Gas turbines
Proceedings Papers

Periodic Temperature Field and its Application to Thermophysical Property Measurement

A. Haji-Sheikh, Y. S. Hong, S. M. You, J. V. Beck
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 229-238, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0048
https://doi.org/10.1115/IMECE1996-0048
View Paper titled, Periodic Temperature Field and its Application to Thermophysical Property Measurement
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Topics: Temperature, Thermal diffusivity, Boundary-value problems, Errors, Heat flux, Phase shift, Sensitivity analysis, Stainless steel, Thermal conductivity
Proceedings Papers

Thermal Contact Conductance of a Paper/Elastomer Interface

J. W. Mohr, J. Seyed-Yagoobi, J. W. Wirtz, D. C. Price
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 217-222, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0046
https://doi.org/10.1115/IMECE1996-0046
View Paper titled, Thermal Contact Conductance of a Paper/Elastomer Interface
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Topics: Contact resistance, Elastomers, Pressure, Printing, Rollers, Design, Heat transfer, Heating, Thermal conductivity