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Proceedings Papers

Effects of Yarn Undulation on the Stress and Deformation of Textile Structural Composites

Tsu-Wei Chou, Makoto Ito, Timothy D. Kostar
Proc. ASME. IMECE96, Aerospace, 11-14, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0603
https://doi.org/10.1115/IMECE1996-0603
View Paper titled, Effects of Yarn Undulation on the Stress and Deformation of Textile Structural Composites
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Topics: Composite materials, Deformation, Stress, Textiles, Yarns, Laminates, Failure, Finite element analysis, Boundary-value problems, Elasticity
Proceedings Papers

Tridimensional FE-Analysis of Stable Crack Growth in a CT-Specimen of a Structural Steel

O. Kolednik, G. X. Shan, W.-Y. Yan, F. D. Fischer
Proc. ASME. IMECE96, Aerospace, 209-216, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0630
https://doi.org/10.1115/IMECE1996-0630
View Paper titled, Tridimensional FE-Analysis of Stable Crack Growth in a CT-Specimen of a Structural Steel
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Topics: Finite element analysis, Fracture (Materials), Structural steel, Displacement, Stress, Plane strain, Steady state, Steel, Stress analysis (Engineering), Tension
Proceedings Papers

Stress Analysis and Strength of Joints Combining Adhesives With Bolts Subjected to Torsions

Masahiro Yoneno, Toshiyuki Sawa, Hidekazu Nishijima, Motohiro Matsuo
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 23-29, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0856
https://doi.org/10.1115/IMECE1996-0856
View Paper titled, Stress Analysis and Strength of Joints Combining Adhesives With Bolts Subjected to Torsions
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Topics: Adhesives, Stress analysis (Engineering), Torsion, Stress, Adhesive joints, Bolted joints, Contact mechanics, Cylinders, Elasticity, Strain gages
Proceedings Papers

Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments

Toshiyuki Sawa, Katsuyuki Nakano, Hiroshi To Ratani
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 9-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0854
https://doi.org/10.1115/IMECE1996-0854
View Paper titled, Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments
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Topics: Adhesive joints, Adhesives, Contact mechanics, Elasticity, Strain measurement, Stress, Stress analysis (Engineering), Stress concentration, Stress singularity, Strips
Proceedings Papers

Elasto-Plastic Finite Element Analysis of Isotropic Plates With U-Notches

Nurettin Arslan, Aydın Turgut, Erol Sancaktar
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0859
https://doi.org/10.1115/IMECE1996-0859
View Paper titled, Elasto-Plastic Finite Element Analysis of Isotropic Plates With U-Notches
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Topics: Finite element analysis, Plates (structures), Stress, Finite element methods, Interpolation, Machinery, Mechanical properties, Polynomials, Residual stresses, Steel
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

Finite Element Mesh Generation Using Skeleton-Based Decomposition of Sliced Biomedical Image Data: Application to Limb Prosthetics

Santosh G. Zachariah, Joan E. Sanders, George M. Turkiyyah
Proc. ASME. IMECE96, Advances in Bioengineering, 355-356, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1261
https://doi.org/10.1115/IMECE1996-1261
View Paper titled, Finite Element Mesh Generation Using Skeleton-Based Decomposition of Sliced Biomedical Image Data: Application to Limb Prosthetics
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Topics: Artificial limbs, Biomedicine, Finite element analysis, Mesh generation, B-splines, Cross section (Physics), Knee, Optimization, Stress analysis (Engineering)
Proceedings Papers

Efficient Finite Element Method for Contact Analysis of Articular Joints

James J.-S. Stone, Shen-Haw Ju, Edmund Y. S. Chao, Bernard F. Morrey, Kai-Nan An
Proc. ASME. IMECE96, Advances in Bioengineering, 427-428, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1297
https://doi.org/10.1115/IMECE1996-1297
View Paper titled, Efficient Finite Element Method for Contact Analysis of Articular Joints
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Topics: Finite element methods, Cartilage, Algorithms, Degrees of freedom, Finite element analysis, Pressure, Stress analysis (Engineering), Stress concentration
Proceedings Papers

Stress Analysis and Design Improvement for Commercial Vehicle Frames With Bolted Joints

Yoon Young Kim, Jin Gon Kim, Seok Hwan Choi
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 95-102, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0150
https://doi.org/10.1115/IMECE1996-0150
View Paper titled, Stress Analysis and Design Improvement for Commercial Vehicle Frames With Bolted Joints
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Topics: Bolted joints, Design, Stress analysis (Engineering), Vehicles, Modeling, Finite element analysis, Fracture (Materials), Stiffness, Stress concentration, Structural failures
Proceedings Papers

Modeling of Inelastic Metal Matrix Composite Response Under Multiaxial Loading

Jalees Ahmad, Theodore Nicholas
Proc. ASME. IMECE96, Aerospace and Materials, 311-323, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0487
https://doi.org/10.1115/IMECE1996-0487
View Paper titled, Modeling of Inelastic Metal Matrix Composite Response Under Multiaxial Loading
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Topics: Composite materials, Deformation, Flow (Dynamics), Metal matrix composites, Metals, Modeling, Stress analysis (Engineering)
Proceedings Papers

Damage in Oxidized Titanium Metal Matrix Composites

Dimitris C. Lagoudas, Shouze Xu, David Miller, David H. Allen
Proc. ASME. IMECE96, Aerospace and Materials, 225-237, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0480
https://doi.org/10.1115/IMECE1996-0480
View Paper titled, Damage in Oxidized Titanium Metal Matrix Composites
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Topics: Damage, Metal matrix composites, Titanium, Surface cracks, Fracture (Materials), Laminates, Stress, Density, Oxidation, Phase transitions
Proceedings Papers

Weight Saving Plastic Design of Pressure Vessels

Janek S. Porowski, William J. O’Donnell, Robert H. Reid
Proc. ASME. IMECE96, Development, Validation, and Application of Inelastic Methods for Structural Analysis and Design, 25-33, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0555
https://doi.org/10.1115/IMECE1996-0555
View Paper titled, Weight Saving Plastic Design of Pressure Vessels
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Topics: Design, Pressure vessels, Weight (Mass), Stress, Equilibrium (Physics), Finite element analysis, Inelastic analysis, ASME Standards, Pressure, Analytical methods
Proceedings Papers

Recycling of Campus Solid Wastes Into a Low-Cost Green Instructional Equipment

Ronald M. Galindo, Jun-Jun A. Obiso, Aian Rey A. Caladcad, Edgar U. Tibay
Proc. ASME. IMECE2022, Volume 7: Engineering Education, V007T09A037, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94991
https://doi.org/10.1115/IMECE2022-94991
View Paper titled, Recycling of Campus Solid Wastes Into a Low-Cost Green Instructional Equipment
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Topics: Green technology, Recycling, Solid wastes, Economics , Engineering teachers, Glass, Stress, Stress analysis (Engineering), Teaching, Wheels
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Finite Element Study of the Human Cervical Spine

Srirangam Kumaresan, Narayan Yoganandan, Frank A. Pintar
Proc. ASME. IMECE97, Advances in Bioengineering, 207-208, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0301
https://doi.org/10.1115/IMECE1997-0301
View Paper titled, Finite Element Study of the Human Cervical Spine
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Topics: Cervical spine, Finite element analysis, Biomechanics, Lumbar spine, Modeling, Stress analysis (Engineering)
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0502
https://doi.org/10.1115/IMECE1997-0502
View Paper titled, The Effect of Underfill Delamination on the Reliability of Flip Chip Modules
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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

Evaluation of Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)

Mark C. Roberts, Thomas J. Mackin
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 205-211, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0666
https://doi.org/10.1115/IMECE1997-0666
View Paper titled, Evaluation of Stress Redistribution and Notch Sensitivity in Ceramic Matrix Composites (CMCs)
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Topics: Ceramic matrix composites, Stress, Damage, Composite materials, Coatings, Ductility, Fibers, Infrared imaging, Shear (Mechanics), Stress analysis (Engineering)
Proceedings Papers

Thermal Residual Stress Analyses of Nextel 440/Aluminum Composite

Hamid Nayeb-Hashemi, Yimin Yang
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 319-330, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0678
https://doi.org/10.1115/IMECE1997-0678
View Paper titled, Thermal Residual Stress Analyses of Nextel 440/Aluminum Composite
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Topics: Aluminum, Composite materials, Stress analysis (Engineering), Fibers, Residual stresses, Compressive stress, Geometry, Stress, Tension, Boundary-value problems
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0825
https://doi.org/10.1115/IMECE1997-0825
View Paper titled, Structural Integrity of Optical Fibers in Connectors
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip