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Proceedings Papers

Finite Element Analysis and Fatigue Life Prediction of a Laterally Conducting GaN-Based Power Package Under Thermal Cycling

Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A021, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111682
https://doi.org/10.1115/IMECE2023-111682
View Paper titled, Finite Element Analysis and Fatigue Life Prediction of a Laterally Conducting GaN-Based Power Package Under Thermal Cycling
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Topics: Fatigue life, Finite element analysis, Gallium nitride, Reliability, Solders, Constitutive equations, Cycles, Durability, Failure, Fatigue
Proceedings Papers

Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study

Sadib Fardin, Md. Jawarul Moresalein, Mohammad Motalab
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A019, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114426
https://doi.org/10.1115/IMECE2023-114426
View Paper titled, Effects of Cooling Rate on the Stress-Strain Behavior of SAC305 Solder: An Atomistic Study
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Topics: Cooling, Solders, Stress
Proceedings Papers

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 155-167, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0730
https://doi.org/10.1115/IMECE1996-0730
View Paper titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
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Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys

Cemal Basaran
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 149-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0729
https://doi.org/10.1115/IMECE1996-0729
View Paper titled, A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
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Topics: Alloys, Constitutive equations, Solders, Tin, Deformation, Plasticity, Modeling, Thermomechanics, Viscoplasticity
Proceedings Papers

Analysis of Tombstoning Phenomenon During Reflow

Quan Qi, Roop L. Mahajan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 105-118, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0781
https://doi.org/10.1115/IMECE1996-0781
View Paper titled, Analysis of Tombstoning Phenomenon During Reflow
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Topics: Algebra, Dynamic models, Equations of motion, Geometry, Gravity (Force), Solders
Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment

K. Darbha, A. Poddar, C. S. Sealing, C. Ramaswamy, L. Tang, K. Upadhayayula, A. Dasgupta, Y. Joshi
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 153-178, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0785
https://doi.org/10.1115/IMECE1996-0785
View Paper titled, Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment
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Topics: Process simulation, Surface mount packaging, Manufacturing, Solders, Design, Geometry, Modeling, Cycles, Solder joints, Warping
Proceedings Papers

The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages

Zhenfeng Guo, Thomas J. Gher, Cynthia T. Sarafids, George K. Lucey
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 179-198, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0786
https://doi.org/10.1115/IMECE1996-0786
View Paper titled, The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages
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Topics: Electronic packages, Solders, Tin, Creep, Deformation, Alloys, Atoms, Electrons, Indium alloys, Shear (Mechanics)
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads

Tsung-Yu Pan, Howard D. Blair, David Mitlin, Gary M. Crosbie, John M. Nicholson, Jon Hangas
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 115-124, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0898
https://doi.org/10.1115/IMECE1996-0898
View Paper titled, Step Soldering Factors Affecting the Reliability of Ag-Pd Thick Film Conductor Pads
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Topics: Reliability, Soldering, Thick films, Solders, Tin, Displacement, Adhesives, Circuits, Diffusion (Physics), Failure
Proceedings Papers

Cure Kinetics for Conductive Adhesives

Yuhai Mei, Sean Wu, Chao-pin Yeh
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 23-27, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0886
https://doi.org/10.1115/IMECE1996-0886
View Paper titled, Cure Kinetics for Conductive Adhesives
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Topics: Adhesives, Chemical kinetics, Cycles, Mechanical properties, Modeling, Solders, Temperature
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates

B. Chandran, W. F. Schmidt, M. H. Gordon, R. Djkaria
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 61-66, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1003
https://doi.org/10.1115/IMECE1996-1003
View Paper titled, The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates
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Topics: Creep, Diamonds, Gallium arsenide, Solders, Bonding, Cooling, Stress, Fracture (Process), Relaxation (Physics), Fracture toughness
Proceedings Papers

2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting

Nelson Rodrigues, Inês Teixeira, Violeta Carvalho, Duarte Santos, Joao Velosa, Ana Ferreira, Delfim Soares, José Teixeira, Senhorinha Teixeira
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A008, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95960
https://doi.org/10.1115/IMECE2022-95960
View Paper titled, 2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting
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Topics: Melting, Printing, Simulation, Solders
Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1230
https://doi.org/10.1115/IMECE1997-1230
View Paper titled, Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields
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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1236
https://doi.org/10.1115/IMECE1997-1236
View Paper titled, The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1237
https://doi.org/10.1115/IMECE1997-1237
View Paper titled, Thermal Mechanical Properties of Two Solder Alloys
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing