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Proceedings Papers

Finite Element Analysis and Fatigue Life Prediction of a Laterally Conducting GaN-Based Power Package Under Thermal Cycling

Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A021, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111682
https://doi.org/10.1115/IMECE2023-111682
View Paper titled, Finite Element Analysis and Fatigue Life Prediction of a Laterally Conducting GaN-Based Power Package Under Thermal Cycling
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Topics: Fatigue life, Finite element analysis, Gallium nitride, Reliability, Solders, Constitutive equations, Cycles, Durability, Failure, Fatigue
Proceedings Papers

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 155-167, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0730
https://doi.org/10.1115/IMECE1996-0730
View Paper titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment

K. Darbha, A. Poddar, C. S. Sealing, C. Ramaswamy, L. Tang, K. Upadhayayula, A. Dasgupta, Y. Joshi
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 153-178, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0785
https://doi.org/10.1115/IMECE1996-0785
View Paper titled, Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment
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Topics: Process simulation, Surface mount packaging, Manufacturing, Solders, Design, Geometry, Modeling, Cycles, Solder joints, Warping
Proceedings Papers

The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages

Zhenfeng Guo, Thomas J. Gher, Cynthia T. Sarafids, George K. Lucey
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 179-198, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0786
https://doi.org/10.1115/IMECE1996-0786
View Paper titled, The Strengthening and Dragging Characteristics of Dilute Sn Solders Designed for Electronic Packages
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Topics: Electronic packages, Solders, Tin, Creep, Deformation, Alloys, Atoms, Electrons, Indium alloys, Shear (Mechanics)
Proceedings Papers

An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages

Zhenfeng Guo
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 199-220, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0787
https://doi.org/10.1115/IMECE1996-0787
View Paper titled, An Introduction to Predict the Fatigue Lifetime and Strengthening Directions of Solder Joint in Electronic Packages
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Topics: Electronic packages, Fatigue, Solder joints, Fracture (Process), Temperature, Tin, Failure, Failure mechanisms, Fatigue cracks, Fatigue failure
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling

Bor Zen Hong, Tsorng-Dih Yuan, Lloyd G. Burrell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 39-46, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0888
https://doi.org/10.1115/IMECE1996-0888
View Paper titled, Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling
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Topics: Fatigue analysis, Solder joints, Fatigue, Temperature, Air flow, Alloys, Ball-Grid-Array packaging, Ceramics, Cycles, Deformation
Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure
Proceedings Papers

Optimization of Solder Joint Fatigue Life Using Product Model-Based Analysis Models

Selçuk Cimtalay, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 47-53, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1001
https://doi.org/10.1115/IMECE1996-1001
View Paper titled, Optimization of Solder Joint Fatigue Life Using Product Model-Based Analysis Models
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Topics: Fatigue life, Optimization, Solder joints, Design, Fatigue, Finite element analysis, Linkages
Proceedings Papers

On the Routinization of Analysis for Physical Design

Russell S. Peak, Andrew J. Scholand, Robert E. Fulton
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 73-82, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1005
https://doi.org/10.1115/IMECE1996-1005
View Paper titled, On the Routinization of Analysis for Physical Design
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Topics: Design, Electronic packaging, Catalysts, Deformation, Fatigue, Finite element analysis, Printed circuit boards, Product design, Solder joints, Warping
Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1116
https://doi.org/10.1115/IMECE1997-1116
View Paper titled, Prediction of the Solder Joint Configuration Under Various Geometric Parameters
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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)
Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1120
https://doi.org/10.1115/IMECE1997-1120
View Paper titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design
Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1115
https://doi.org/10.1115/IMECE1997-1115
View Paper titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1110
https://doi.org/10.1115/IMECE1997-1110
View Paper titled, On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints
Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0500
https://doi.org/10.1115/IMECE1997-0500
View Paper titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0494
https://doi.org/10.1115/IMECE1997-0494
View Paper titled, Reliability of Underfill-Encapsulated Flip-Chip Packages
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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0508
https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0502
https://doi.org/10.1115/IMECE1997-0502
View Paper titled, The Effect of Underfill Delamination on the Reliability of Flip Chip Modules
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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress