1-20 of 783
Silicon
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Multi-Physics Simulation Study of 3-D Bi-Continuous Silicon Anode for Li-Ion Batteries

Parth Bansal, Yumeng Li
Proc. ASME. IMECE2024, Volume 6: Energy, V006T08A053, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145633
https://doi.org/10.1115/IMECE2024-145633
View Paper titled, Multi-Physics Simulation Study of 3-D Bi-Continuous Silicon Anode for Li-Ion Batteries
Open the PDF for Multi-Physics Simulation Study of 3-D Bi-Continuous Silicon Anode for Li-Ion Batteries in another window
Topics: Anodes, Lithium-ion batteries, Physics, Silicon, Simulation, Stress, Triply periodic minimal surfaces
Proceedings Papers

Multiscale Modeling and Simulation of Silicon Anode

Parth Bansal, Yumeng Li
Proc. ASME. IMECE2024, Volume 6: Energy, V006T08A052, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145553
https://doi.org/10.1115/IMECE2024-145553
View Paper titled, Multiscale Modeling and Simulation of Silicon Anode
Open the PDF for Multiscale Modeling and Simulation of Silicon Anode in another window
Topics: Anodes, Lithium-ion batteries, Multiscale modeling, Silicon, Simulation
Proceedings Papers

Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires

Aninda Dey, Nafis Sadik Zim, A. K. M. Monjur Morshed, Titan C. Paul
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A040, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145893
https://doi.org/10.1115/IMECE2024-145893
View Paper titled, Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires
Open the PDF for Comparative Analysis of Different Void Shapes on Thermal Conductivity of Silicon Nanowires in another window
Topics: Nanowires, Shapes, Silicon, Thermal conductivity
Proceedings Papers

Microcracking Simulation of Silicon-Based Anode Sheet in Lithium-Ion Battery (LiB) Using Finite Element Method

Yuzuki Kawashima, Kazuma Ogata, Yuto Shibayama, Aoi Takagi, Akio Yonezu
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A009, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144007
https://doi.org/10.1115/IMECE2024-144007
View Paper titled, Microcracking Simulation of Silicon-Based Anode Sheet in Lithium-Ion Battery (LiB) Using Finite Element Method
Open the PDF for Microcracking Simulation of Silicon-Based Anode Sheet in Lithium-Ion Battery (LiB) Using Finite Element Method in another window
Topics: Anodes, Binders (Materials), Finite element methods, Lithium-ion batteries, Silicon, Simulation
Proceedings Papers

Lamb Wave-Based Inspection of Solar Cell Arrays

Mattie Green, Fadhel Alsaffar, Ajit Mal, Christoph Schaal
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A013, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145068
https://doi.org/10.1115/IMECE2024-145068
View Paper titled, Lamb Wave-Based Inspection of Solar Cell Arrays
Open the PDF for Lamb Wave-Based Inspection of Solar Cell Arrays in another window
Topics: Inspection, Nondestructive evaluation, Solar cell arrays, Waves, Solar cells, Adhesives, Damage, Failure, Errors, Finite element analysis
Proceedings Papers

Design of a Novel Thermal Energy Storage Residential Cooking Stove

Gavin Dickinson, Christopher Relken, Carlos Fernandez-Aballi, Christopher Oshman
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A044, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145860
https://doi.org/10.1115/IMECE2024-145860
View Paper titled, Design of a Novel Thermal Energy Storage Residential Cooking Stove
Open the PDF for Design of a Novel Thermal Energy Storage Residential Cooking Stove in another window
Topics: Design, Thermal energy storage, Valves, Carbon dioxide, Heat, Heat pipes, Heat transfer, Thermal energy, Alloys, Aluminum
Proceedings Papers

Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging

Rahul Adhikari, Nathan Jackson
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144963
https://doi.org/10.1115/IMECE2024-144963
View Paper titled, Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging
Open the PDF for Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging in another window
Topics: MEMS packaging, Microelectronic devices, Packaging, Microelectromechanical systems, Testing, Silicon, Silicones, Additive manufacturing, Biomedicine, Cavities
Proceedings Papers

Multiphysics-Informed Machine Learning for Mechanical-Induced Degradation of Silicon Anode

Parth Bansal, Yumeng Li
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A008, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113404
https://doi.org/10.1115/IMECE2023-113404
View Paper titled, Multiphysics-Informed Machine Learning for Mechanical-Induced Degradation of Silicon Anode
Open the PDF for Multiphysics-Informed Machine Learning for Mechanical-Induced Degradation of Silicon Anode in another window
Topics: Anodes, Cracking (Materials), Delamination, Fracture (Process), Lithium-ion batteries, Machine learning, Silicon
Proceedings Papers

Passive Frequency Tuning Using Liquid Distributed Load

Rahul Adhikari, Vahid Karimi, Nathan Jackson
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A024, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113197
https://doi.org/10.1115/IMECE2023-113197
View Paper titled, Passive Frequency Tuning Using Liquid Distributed Load
Open the PDF for Passive Frequency Tuning Using Liquid Distributed Load in another window
Topics: Energy harvesting, Stress, Cavities, Microelectromechanical systems, Manufacturing, Additive manufacturing, Internet of things, Kinetic energy, Piezoelectric materials, Resolution (Optics)
Proceedings Papers

Dielectric and Mechanical Characteristics of Polyamide-Silicon Dioxide Nanocomposites

Nicholas R. Mahon, Jared Ericksen, Sean F. Lawton, Max P. Coraggio, John P. Terifay, Michael Smith, Diana Martinez-Castro, Paul M. Maienza, Wei Xue
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A002, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113011
https://doi.org/10.1115/IMECE2023-113011
View Paper titled, Dielectric and Mechanical Characteristics of Polyamide-Silicon Dioxide Nanocomposites
Open the PDF for Dielectric and Mechanical Characteristics of Polyamide-Silicon Dioxide Nanocomposites in another window
Topics: Dielectric materials, Mechanical properties, Nanocomposites, Silicon, Sol-gel processing, Temperature, Composite materials, High temperature, Imaging, Low temperature
Proceedings Papers

Ultrasonic MEMS Device for Fluid Pumping and Mixing

Richard M. White
Proc. ASME. IMECE96, Aerospace, 743-750, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0690
https://doi.org/10.1115/IMECE1996-0690
View Paper titled, Ultrasonic MEMS Device for Fluid Pumping and Mixing
Open the PDF for Ultrasonic MEMS Device for Fluid Pumping and Mixing in another window
Topics: Fluids, Microelectromechanical systems, Membranes, Pumps, Waves, Acoustic intensity, Acoustics, Gases, Micromachining, Silicon
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
Open the PDF for Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner in another window
Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Tension-Tension Fatigue of Copper Thin Films

David T. Read
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 175-180, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0732
https://doi.org/10.1115/IMECE1996-0732
View Paper titled, Tension-Tension Fatigue of Copper Thin Films
Open the PDF for Tension-Tension Fatigue of Copper Thin Films in another window
Topics: Copper, Fatigue, Tension, Thin films, Stress, Cycles, Electrons, Fatigue testing, Feedback, Piezoelectric actuators
Proceedings Papers

An Investigation of Microstructure and Microdynamics of Fluid Flow in MEMS

Ann-Marie Lanzillotto, Tzong-Shyng Leu, Michael Amabile, Richard Wildes, John Dunsmuir
Proc. ASME. IMECE96, Aerospace, 789-796, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0695
https://doi.org/10.1115/IMECE1996-0695
View Paper titled, An Investigation of Microstructure and Microdynamics of Fluid Flow in MEMS
Open the PDF for An Investigation of Microstructure and Microdynamics of Fluid Flow in MEMS in another window
Topics: Fluid dynamics, Microelectromechanical systems, Flow (Dynamics), Fluids, Microchannels, Capillarity, Computers, Displacement, Drops, Emulsions
Proceedings Papers

Combustors for Micro-Gas Turbine Engines

Ian A. Waitz, Gautam Gauba, Yang-Sheng Tzeng
Proc. ASME. IMECE96, Aerospace, 777-788, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0694
https://doi.org/10.1115/IMECE1996-0694
View Paper titled, Combustors for Micro-Gas Turbine Engines
Open the PDF for Combustors for Micro-Gas Turbine Engines in another window
Topics: Combustion chambers, Gas turbines, Combustion, Hydrogen, Ceramics, Cooling, Design, Flames, Fossil fuels, Heat transfer
Proceedings Papers

Silicon Bulk Micromachining in Tohoku University

Kazuyuki Minami, Masayoshi Esashi
Proc. ASME. IMECE96, Aerospace, 769-775, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0693
https://doi.org/10.1115/IMECE1996-0693
View Paper titled, Silicon Bulk Micromachining in Tohoku University
Open the PDF for Silicon Bulk Micromachining in Tohoku University in another window
Topics: Micromachining, Silicon, Microelectromechanical systems, Sensors, Blood vessels, Catheters, Electric fields, Evaporation, Inertia (Mechanics), Manufacturing
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
Open the PDF for Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates in another window
Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure

X. Y. Zheng, S. Z. Li, M. Chen, K. L. Wang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 93-98, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1341
https://doi.org/10.1115/IMECE1996-1341
View Paper titled, Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure
Open the PDF for Giant Reduction in Lateral Thermal Conductivity of Thin Nitride/Silicon/Oxide Membrane Measured With a Suspended Micro Structure in another window
Topics: Membranes, Silicon, Thermal conductivity, Bridges (Structures), Circuits, Polysilicon, Signals, Silicon nitride ceramics, Temperature sensors
Proceedings Papers

Experiments and Simulations on a Micro-Mixer Fabricated Using a Planar Silicon/Glass Technology

Jens Peter Krog, Jens Branebjerg, Claus Rye Nielsen, Peter Gravesen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 177-182, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1350
https://doi.org/10.1115/IMECE1996-1350
View Paper titled, Experiments and Simulations on a Micro-Mixer Fabricated Using a Planar Silicon/Glass Technology
Open the PDF for Experiments and Simulations on a Micro-Mixer Fabricated Using a Planar Silicon/Glass Technology in another window
Topics: Engineering simulation, Glass, Silicon, Simulation, Flow (Dynamics), Computer simulation, Design, Diffusion (Physics), Experimental characterization, Fluids
Proceedings Papers

A Bimetallic Thermally Actuated Micropump

Yue Yang, Zhaoying Zhou, Xiongying Ye, Xiaoning Jiang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 351-354, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1373
https://doi.org/10.1115/IMECE1996-1373
View Paper titled, A Bimetallic Thermally Actuated Micropump
Open the PDF for A Bimetallic Thermally Actuated Micropump in another window
Topics: Micropumps, Pumps, Flow (Dynamics), Actuators, Membranes, Micromachining, Silicon, Valves