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Proceedings Papers

Mechanical Property Evaluation of Sublimation Agents on Nanostructure Stability in Semiconductor

Yosuke Hanawa, Jianliang Zhang, Yuta Sasaki, Koichi Sawada, Junichi Yoshida, Minghan Xu, Mohammaderfan Mohit, Agus P. Sasmito, Atsushi Sakuma
Proc. ASME. IMECE2024, Volume 9: Heat Transfer and Thermal Engineering, V009T11A017, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-143402
https://doi.org/10.1115/IMECE2024-143402
View Paper titled, Mechanical Property Evaluation of Sublimation Agents on Nanostructure Stability in Semiconductor
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Topics: Collapse, Drying, Mechanical properties, Semiconductors (Materials), Stability, Nanostructures , Stress, Integrated circuit fabrication, Solidification, Thin films
Proceedings Papers

Engineered Substrates for Controlling Cell-Cell Interactions

Sangeeta N. Bhatia, Martin L. Yarmush, Mehmet Toner
Proc. ASME. IMECE97, Advances in Heat and Mass Transfer in Biotechnology, 99-103, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1319
https://doi.org/10.1115/IMECE1997-1319
View Paper titled, Engineered Substrates for Controlling Cell-Cell Interactions
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Topics: Biological tissues, Biology, Biomaterials, Borosilicate glasses, Diseases, Liver, Microfabrication, Permeability, Physiology, Semiconductors (Materials)
Proceedings Papers

Fracture Mechanics of Tetragraphene Under Mixed Mode Loading

Elnaz Haddadi, Alireza Tabarraei
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A015, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111443
https://doi.org/10.1115/IMECE2023-111443
View Paper titled, Fracture Mechanics of Tetragraphene Under Mixed Mode Loading
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Topics: Fracture mechanics, Molecular dynamics, Carbon, Stress, Temperature, Crack propagation, Graphene, Energy gap, Engineering simulation, Fracture toughness
Proceedings Papers

Procedure for CAD Assessment of Thermal Management Performance in a Diode Laser Structure

Rajesh R. Kamath, Patricia F. Mead
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 213-216, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0736
https://doi.org/10.1115/IMECE1996-0736
View Paper titled, Procedure for CAD Assessment of Thermal Management Performance in a Diode Laser Structure
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Topics: Computer-aided design, Lasers, Thermal management, Finite element analysis, Steady state, Heat sinks, Heat transfer, Operating temperature, Design, Energy dissipation
Proceedings Papers

High Performance Power Converters: An Engineering Systems Approach

Edward L. Bartlett, Jr.
Proc. ASME. IMECE96, Engineering Systems, 63-69, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0877
https://doi.org/10.1115/IMECE1996-0877
View Paper titled, High Performance Power Converters: An Engineering Systems Approach
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Topics: Engineering systems and industry applications, Gates (Closures), Power converters, Semiconductors (Materials), Silicon, Transistors
Proceedings Papers

Semiconductor Deposition Profile Simulation Using Direct Simulation Monte Carlo Method

Masato Ikegawa, Jun’ichi Kobayashi, Morihisa Maruko
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 235-242, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1051
https://doi.org/10.1115/IMECE1996-1051
View Paper titled, Semiconductor Deposition Profile Simulation Using Direct Simulation Monte Carlo Method
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Topics: Monte Carlo methods, Semiconductors (Materials), Simulation, Boundary-value problems, Pressure, Sputter deposition, Chemical vapor deposition, Collisions (Physics), Dimensions, Gas flow
Proceedings Papers

Investigation of Emission Reduction and Power Generation on Electrochemical Catalytic Membranes With the Addition of Perovskite Nanocrystals

Aliza M. Willsey, Kassidy Fields, Thomas S. Welles, Hanjie Lin, Weiwei Zheng, Jeongmin Ahn
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A038, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95571
https://doi.org/10.1115/IMECE2022-95571
View Paper titled, Investigation of Emission Reduction and Power Generation on Electrochemical Catalytic Membranes With the Addition of Perovskite Nanocrystals
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Topics: Emissions, Energy generation, Exhaust systems, Membranes, Nanocrystals, Semiconductors (Materials)
Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0956
https://doi.org/10.1115/IMECE1997-0956
View Paper titled, Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films
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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Challenging Issues in Microelectromechanical Systems

K. Komvopoulos
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 261-264, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1251
https://doi.org/10.1115/IMECE1998-1251
View Paper titled, Challenging Issues in Microelectromechanical Systems
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Topics: Microelectromechanical systems, Manufacturing, Design, Semiconductors (Materials), Surface science
Proceedings Papers

Thermo-Solutal Issues in Very Large Diameter Silicon Crystal Growth

T. Zhang, G.-X. Wang, F. Ladeinde, V. Prasad
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 797-806, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1094
https://doi.org/10.1115/IMECE1998-1094
View Paper titled, Thermo-Solutal Issues in Very Large Diameter Silicon Crystal Growth
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Topics: Silicon crystals, Crystals, Semiconductor wafers, Turbulence, Dynamics (Mechanics), Flow (Dynamics), Heat, Heat transfer, Oxygen, Semiconductors (Materials)
Proceedings Papers

Computational Optimization of Biomedical Devices

J. M. Siegel, Jr., V. B. Makhijani
Proc. ASME. IMECE98, Advances in Bioengineering, 85-86, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0042
https://doi.org/10.1115/IMECE1998-0042
View Paper titled, Computational Optimization of Biomedical Devices
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Topics: Biomedicine, Optimization, Design, Computers, Aerospace industry, Engineering prototypes, Equipment performance, Materials processing, Semiconductors (Materials), Simulation
Proceedings Papers

Thermal and Carrier Transport in Laser Photo-Etching of n-GaAs Semiconductor Thin Films

X. Zhang, J. Wen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 241-248, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0710
https://doi.org/10.1115/IMECE1998-0710
View Paper titled, Thermal and Carrier Transport in Laser Photo-Etching of n-GaAs Semiconductor Thin Films
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Topics: Etching, Gallium arsenide, Lasers, Semiconductors (Materials), Thin films, Heating, Joules, Diffusion (Physics), Electrons, Photons
Proceedings Papers

Depth of Thermal Penetration in the Fast Transient Process of Heat Transport

D. Y. Tzou, Kevin K. S. Chiu, Jorge E. Beraun, J. K. Chen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 137-143, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0699
https://doi.org/10.1115/IMECE1998-0699
View Paper titled, Depth of Thermal Penetration in the Fast Transient Process of Heat Transport
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Topics: Heat, Transients (Dynamics), Relaxation (Physics), Diffusion (Physics), Temperature, Electromagnetic scattering, Electron-phonon interactions, Failure, Heat flux, Phonons
Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70172
https://doi.org/10.1115/IMECE2021-70172
View Paper titled, Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules
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Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties
Proceedings Papers

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Milind Bhagavat, Imin Kao
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 21-30, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0913
https://doi.org/10.1115/IMECE1999-0913
View Paper titled, Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw
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Topics: Abrasive machining, Brittleness, Computer simulation, Silicon, Abrasives, Cutting, Finite element analysis, Fracture (Materials), Abrasion, Machining
Proceedings Papers

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

V. S. Travkin
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 101-112, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24383
https://doi.org/10.1115/IMECE2001/HTD-24383
View Paper titled, Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals
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Topics: Design, Heat sinks, Semiconductors (Materials), Simulation, Temperature, Flow (Dynamics), Heat exchangers, Heat flux, Heat transfer, Weight (Mass)
Proceedings Papers

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

V. S. Travkin, E. D. Sergievsky, E. V. Krinitsky, I. Catton
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 75-80, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24380
https://doi.org/10.1115/IMECE2001/HTD-24380
View Paper titled, Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties
Open the PDF for Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties in another window
Topics: Design, Heat sinks, Modeling, Semiconductors (Materials), Simulation
Proceedings Papers

Real Time Sub-Micron Thermal Imaging Using Thermoreflectance

James Christofferson, Daryoosh Vashaee, Ali Shakouri, Philip Melese
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 231-235, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24398
https://doi.org/10.1115/IMECE2001/HTD-24398
View Paper titled, Real Time Sub-Micron Thermal Imaging Using Thermoreflectance
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Topics: Imaging, Thermoreflectance, Resolution (Optics), Semiconductors (Materials), Diffraction, Emissions, Excitation, Filtration, Microcoolers, Optoelectronic devices
Proceedings Papers

Compliant Wafer Level Package

Chirag Patel, Kevin P. Martin, James D. Meindl
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 53-61, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24706
https://doi.org/10.1115/IMECE2001/EPP-24706
View Paper titled, Compliant Wafer Level Package
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Topics: Semiconductor wafers, Manufacturing, Density, Electronic products, Integrated circuits, Packaging, Semiconductors (Materials)