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Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Challenging Issues in Microelectromechanical Systems

K. Komvopoulos

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 261-264, November 15–20, 1998

Paper No: IMECE1998-1251

DOI: https://doi.org/10.1115/IMECE1998-1251

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Topics: Microelectromechanical systems, Manufacturing, Design, Semiconductors (Materials), Surface science

Proceedings Papers

Thermo-Solutal Issues in Very Large Diameter Silicon Crystal Growth

T. Zhang, G.-X. Wang, F. Ladeinde, V. Prasad

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 797-806, November 15–20, 1998

Paper No: IMECE1998-1094

DOI: https://doi.org/10.1115/IMECE1998-1094

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Topics: Silicon crystals, Crystals, Semiconductor wafers, Turbulence, Dynamics (Mechanics), Flow (Dynamics), Heat, Heat transfer, Oxygen, Semiconductors (Materials)

Proceedings Papers

Thermal and Carrier Transport in Laser Photo-Etching of n-GaAs Semiconductor Thin Films

X. Zhang, J. Wen

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 241-248, November 15–20, 1998

Paper No: IMECE1998-0710

DOI: https://doi.org/10.1115/IMECE1998-0710

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Topics: Etching, Gallium arsenide, Lasers, Semiconductors (Materials), Thin films, Heating, Joules, Diffusion (Physics), Electrons, Photons

Proceedings Papers

Depth of Thermal Penetration in the Fast Transient Process of Heat Transport

D. Y. Tzou, Kevin K. S. Chiu, Jorge E. Beraun, J. K. Chen

Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 137-143, November 15–20, 1998

Paper No: IMECE1998-0699

DOI: https://doi.org/10.1115/IMECE1998-0699

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Topics: Heat, Transients (Dynamics), Relaxation (Physics), Diffusion (Physics), Temperature, Electromagnetic scattering, Electron-phonon interactions, Failure, Heat flux, Phonons

Proceedings Papers

Computational Optimization of Biomedical Devices

J. M. Siegel, Jr., V. B. Makhijani

Proc. ASME. IMECE98, Advances in Bioengineering, 85-86, November 15–20, 1998

Paper No: IMECE1998-0042

DOI: https://doi.org/10.1115/IMECE1998-0042

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Topics: Biomedicine, Optimization, Design, Computers, Aerospace industry, Engineering prototypes, Equipment performance, Materials processing, Semiconductors (Materials), Simulation

Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura

Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021

Paper No: IMECE2021-70172

DOI: https://doi.org/10.1115/IMECE2021-70172

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Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties

Proceedings Papers

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Milind Bhagavat, Imin Kao

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 21-30, November 14–19, 1999

Paper No: IMECE1999-0913

DOI: https://doi.org/10.1115/IMECE1999-0913

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Topics: Abrasive machining, Brittleness, Computer simulation, Silicon, Abrasives, Cutting, Finite element analysis, Fracture (Materials), Abrasion, Machining

Proceedings Papers

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

V. S. Travkin

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 101-112, November 11–16, 2001

Paper No: IMECE2001/HTD-24383

DOI: https://doi.org/10.1115/IMECE2001/HTD-24383

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Topics: Design, Heat sinks, Semiconductors (Materials), Simulation, Temperature, Flow (Dynamics), Heat exchangers, Heat flux, Heat transfer, Weight (Mass)

Proceedings Papers

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

V. S. Travkin, E. D. Sergievsky, E. V. Krinitsky, I. Catton

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 75-80, November 11–16, 2001

Paper No: IMECE2001/HTD-24380

DOI: https://doi.org/10.1115/IMECE2001/HTD-24380

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Topics: Design, Heat sinks, Modeling, Semiconductors (Materials), Simulation

Proceedings Papers

Real Time Sub-Micron Thermal Imaging Using Thermoreflectance

James Christofferson, Daryoosh Vashaee, Ali Shakouri, Philip Melese

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 231-235, November 11–16, 2001

Paper No: IMECE2001/HTD-24398

DOI: https://doi.org/10.1115/IMECE2001/HTD-24398

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Topics: Imaging, Thermoreflectance, Resolution (Optics), Semiconductors (Materials), Diffraction, Emissions, Excitation, Filtration, Microcoolers, Optoelectronic devices

Proceedings Papers

Compliant Wafer Level Package

Chirag Patel, Kevin P. Martin, James D. Meindl

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 53-61, November 11–16, 2001

Paper No: IMECE2001/EPP-24706

DOI: https://doi.org/10.1115/IMECE2001/EPP-24706

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Topics: Semiconductor wafers, Manufacturing, Density, Electronic products, Integrated circuits, Packaging, Semiconductors (Materials)

Proceedings Papers

High-Temperature Electron Emission From Diamond Films

S. H. Shin, T. S. Fisher, D. G. Walker, A. M. Strauss, W. P. Kang, J. L. Davidson

Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 361-365, November 11–16, 2001

Paper No: IMECE2001/HTD-24277

DOI: https://doi.org/10.1115/IMECE2001/HTD-24277

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Topics: Diamond films, Electron emission, High temperature, Diamonds, Temperature, Electron field emission, Energy conversion, Electrons, Emissions, Energy / power systems

Proceedings Papers

Noncontact Physical Removal of Nano-Scale Particles From Surfaces

Ahmed A. Busnaina, Hong Lin

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 827-830, November 11–16, 2001

Paper No: IMECE2001/MEMS-23918

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23918

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Topics: Acoustics, Microelectromechanical systems, Nanoscale phenomena, Particulate matter, Fluctuations (Physics), Integrated circuit fabrication, Nanoparticles, Pressure, Semiconductor wafers, Semiconductors (Materials)

Proceedings Papers

Creation of Nanometer-Sized Features in Polysilicon Using Fusing

Jeremy A. Levitan, Dan Good, Michael J. Sinclair, Joseph M. Jacobson

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 397-402, November 11–16, 2001

Paper No: IMECE2001/MEMS-23858

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23858

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Topics: Microelectromechanical systems, Polysilicon, Microfabrication, Manufacturing, Resolution (Optics), Dimensions, Electrons, Lithography, Melting, Semiconductors (Materials)

Proceedings Papers

Numerical Studies of Semiconductor Materials Solidification With Applied Electric and Magnetic Fields

Peng Zhang, Lili Zheng, Gerald Iseler, David Bliss

Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 115-122, November 11–16, 2001

Paper No: IMECE2001/HTD-24293

DOI: https://doi.org/10.1115/IMECE2001/HTD-24293

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Topics: Magnetic fields, Semiconductors (Materials), Solidification, Convection, Crystal growth, Joules, Magnetohydrodynamics, Physics, Shapes

Proceedings Papers

Direct Refrigeration by Electron Field Emission From Diamond Microtips

T. S. Fisher, D. G. Walker

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 325-330, November 5–10, 2000

Paper No: IMECE2000-1443

DOI: https://doi.org/10.1115/IMECE2000-1443

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Topics: Diamonds, Electron field emission, Refrigeration, Electrons, Emissions, Energy conversion, Cooling, Current density, Density, Electric current

Proceedings Papers

Transferred-Substrate InGaAsP-Based Thermionic Emission Coolers

Christopher J. LaBounty, Gerry Robinson, Patrick Abraham, Ali Shakouri, John E. Bowers

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 339-343, November 5–10, 2000

Paper No: IMECE2000-1445

DOI: https://doi.org/10.1115/IMECE2000-1445

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Topics: Coolers, Thermionic emission, Cooling, Copper, Optoelectronic devices, Thermal resistance, Thin films, Diamonds, Electrons, Engineering simulation

Proceedings Papers

Segregation During Magnetically-Stabilized Liquid-Encapsulated Growth of Compound Semiconductor Crystals

Nancy Ma, David F. Bliss, George G. Bryant

Proc. ASME. IMECE2000, Fluids Engineering, 215-221, November 5–10, 2000

Paper No: IMECE2000-2070

DOI: https://doi.org/10.1115/IMECE2000-2070

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Topics: Crystals, Semiconductors (Materials), Magnetic fields, Flow (Dynamics), Solidification

2 3 4 5

NARROW

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Challenging Issues in Microelectromechanical Systems

Thermo-Solutal Issues in Very Large Diameter Silicon Crystal Growth

Thermal and Carrier Transport in Laser Photo-Etching of n-GaAs Semiconductor Thin Films

Depth of Thermal Penetration in the Fast Transient Process of Heat Transport

Computational Optimization of Biomedical Devices

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

Integrated Heterogeneous Design of Semiconductor Heat Sink via Scaled Direct Micro-Modeling, Upper Scale VAT Simulation and Experiment: Comparison and Verification of Properties

Real Time Sub-Micron Thermal Imaging Using Thermoreflectance

Compliant Wafer Level Package

High-Temperature Electron Emission From Diamond Films

Noncontact Physical Removal of Nano-Scale Particles From Surfaces

Creation of Nanometer-Sized Features in Polysilicon Using Fusing

Numerical Studies of Semiconductor Materials Solidification With Applied Electric and Magnetic Fields

Direct Refrigeration by Electron Field Emission From Diamond Microtips

Transferred-Substrate InGaAsP-Based Thermionic Emission Coolers

Segregation During Magnetically-Stabilized Liquid-Encapsulated Growth of Compound Semiconductor Crystals

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