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Proceedings Papers

Eddy Current Flaw Imaging Using Micro-Sensor Arrays

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Jianhua Xue, S. Ramalingam, Zheng Shi
Proc. ASME. IMECE97, Emerging Technologies for Machinery Health Monitoring and Prognosis, 13-18, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1265
https://doi.org/10.1115/IMECE1997-1265
View Paper titled, Eddy Current Flaw Imaging Using Micro-Sensor Arrays
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Topics: Eddies (Fluid dynamics), Eddy currents (Electricity), Imaging, Microsensors, Resolution (Optics), Sensors, Flaw detection, Dry etching, Fatigue cracks, Inspection
Proceedings Papers

Error Budget of Wafer Bonding Alignment System Based on Machine Vision

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Rui Wang, Sen Lu, Kaiming Yang, Yu Zhu
Proc. ASME. IMECE2023, Volume 3: Advanced Manufacturing, V003T03A090, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112938
https://doi.org/10.1115/IMECE2023-112938
View Paper titled, Error Budget of Wafer Bonding Alignment System Based on Machine Vision
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Topics: Bonding, Errors, Machinery, Semiconductor wafers
Proceedings Papers

A Hybrid Time-Varying Integrator-Gain Control Strategy for an Ultra-Precision Wafer Stage

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Tao Liu, Kaiming Yang, Yu Zhu
Proc. ASME. IMECE2023, Volume 6: Dynamics, Vibration, and Control, V006T07A005, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111839
https://doi.org/10.1115/IMECE2023-111839
View Paper titled, A Hybrid Time-Varying Integrator-Gain Control Strategy for an Ultra-Precision Wafer Stage
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Topics: Semiconductor wafers
Proceedings Papers

Multi-Level Polysilicon Surface-Micromachining Technology: Applications and Issues

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Jeffry J. Sniegowski
Proc. ASME. IMECE96, Aerospace, 751-759, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0691
https://doi.org/10.1115/IMECE1996-0691
View Paper titled, Multi-Level Polysilicon Surface-Micromachining Technology: Applications and Issues
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Topics: Micromachining, Polysilicon, Manufacturing, Microelectromechanical systems, Circuits, Etching, Polishing, Semiconductor wafers
Proceedings Papers

Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates

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M. Asheghi, M. N. Touzelbaev, K. E. Goodson, Y. K. Leung, S. S. Wong
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 83-91, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1340
https://doi.org/10.1115/IMECE1996-1340
View Paper titled, Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
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Topics: Crystals, Silicon, Silicon-on-insulator, Temperature, Thermal conductivity, Semiconductor wafers, Phonons, Transistors, Cantilevers, Electromagnetic scattering
Proceedings Papers

Temperature Measurement by Thermoreflectance at Near Grazing Angles

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Anthony S. Lee, John L. Hostetler, Pamela M. Norris
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 77-81, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1339
https://doi.org/10.1115/IMECE1996-1339
View Paper titled, Temperature Measurement by Thermoreflectance at Near Grazing Angles
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Topics: Temperature measurement, Thermoreflectance, Temperature, Furnaces, Semiconductor wafers, Laser beams, Polarization (Electricity), Polarization (Light), Polarization (Waves), Polishing
Proceedings Papers

A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices

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X. Y. Huang, C. Y. Liu, K. C. Toh
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 37-47, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1334
https://doi.org/10.1115/IMECE1996-1334
View Paper titled, A Transient Three-Dimensional Model of Micro Heat Pipes Used As an Integral Part of Semiconductor Devices
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Topics: Heat pipes, Semiconductor devices, Three-dimensional models, Transients (Dynamics), Heat, Semiconductor wafers, Switches, Temperature, Thermal conductivity
Proceedings Papers

A Methodology to Study Wafer Level Response of Silicon Microstructures to Mechanical Shock

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David G. McIntyre, Shawn J. Cunningham, Judd S. Carper, Paul D. Jaramillo, William C. Tang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 435-439, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1386
https://doi.org/10.1115/IMECE1996-1386
View Paper titled, A Methodology to Study Wafer Level Response of Silicon Microstructures to Mechanical Shock
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Topics: Semiconductor wafers, Shock (Mechanics), Silicon, Reliability, Explosives, Innovation, Microelectromechanical systems, Sensors, Stress
Proceedings Papers

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

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R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 131-140, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0783
https://doi.org/10.1115/IMECE1996-0783
View Paper titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Control algorithms, Finishes, Finite element methods, Fracture (Materials), Fracture (Process), Microelectronic devices
Proceedings Papers

Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System

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Edward S. Kolesar, Rocky R. Reston
Proc. ASME. IMECE96, Engineering Systems, 11-17, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0869
https://doi.org/10.1115/IMECE1996-0869
View Paper titled, Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System
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Topics: Design, Gas chromatography, Manufacturing, Micromachining, Silicon, Nitrogen, Sensors, Circuits, Ejectors, Borosilicate glasses
Proceedings Papers

ℋ ∞ Controller Design for Wing/Store Flutter Suppression

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Prasad V. N. Gade, Daniel J. Inman
Proc. ASME. IMECE96, Active Control of Vibration and Noise, 91-99, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0909
https://doi.org/10.1115/IMECE1996-0909
View Paper titled, ℋ ∞ Controller Design for Wing/Store Flutter Suppression
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Topics: Control equipment, Design, Flutter (Aerodynamics), Wings, Airfoils, Approximation, Closed loop systems, Control algorithms, Control theory, Dampers
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

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Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

Projection Micromachining of Polyimide Thin Films by an Excimer Laser

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X. Zhang, C. P. Grigoropoulos, D. J. Krajnovich, A. C. Tam
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 45-54, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1029
https://doi.org/10.1115/IMECE1996-1029
View Paper titled, Projection Micromachining of Polyimide Thin Films by an Excimer Laser
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Topics: Excimer lasers, Micromachining, Thin films, Etching, Ablation (Vaporization technology), Lasers, Atomic force microscopy, Fluence (Radiation measurement), Resolution (Optics), Absorption
Proceedings Papers

The Dynamics of Particle Formation During SiH 4 :O 2 Chemical Vapor Deposition: Implications for Materials Processing

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Evan Whitby, Masakazu Hoshino, Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 215-219, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1048
https://doi.org/10.1115/IMECE1996-1048
View Paper titled, The Dynamics of Particle Formation During SiH 4 :O 2 Chemical Vapor Deposition: Implications for Materials Processing
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Topics: Chemical vapor deposition, Dynamics (Mechanics), Materials processing, Particulate matter, Computer simulation, Pressure, Chemical reactions, Fluid dynamics, Heat transfer, Particle size
Proceedings Papers

Development of Mesoscale Actuation Device

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Jinghui Zhu, Donny Wang, Chang-Jin Kim, Greg P. Carman
Proc. ASME. IMECE96, Aerospace, 649-654, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0679
https://doi.org/10.1115/IMECE1996-0679
View Paper titled, Development of Mesoscale Actuation Device
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Topics: Actuators, Bearings, Displacement, Machining, Manufacturing, Microelectromechanical systems, Micromachining, Microscale devices, Microscopes, Semiconductor wafers
Proceedings Papers

Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process

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Pallavi Sharma, Matthias Pleil, Nathan Jackson
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A012, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-92967
https://doi.org/10.1115/IMECE2022-92967
View Paper titled, Effect of SF 6 and C 4 F 8 Flow Rate on Etched Surface Profile and Grass Formation in Deep Reactive Ion Etching Process
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Topics: Etching, Flow (Dynamics), Reactive-ion etching, Silicon, Cooling, Cycles, Corners (Structural elements), Energy dissipation, Gas flow, Heat
Proceedings Papers

Multichannel Electromechanical Impedance Structural Diagnostics in Plate Specimens

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Funmilola Nwokocha, Andrei Zagrai, David Hunter
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A008, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95937
https://doi.org/10.1115/IMECE2022-95937
View Paper titled, Multichannel Electromechanical Impedance Structural Diagnostics in Plate Specimens
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Topics: Actuators, Computer software, Damage, Electromagnetic spectrum, Finite element analysis, Modeling, Plates (structures), Safety, Semiconductor wafers, Sensors
Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

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Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1121
https://doi.org/10.1115/IMECE1997-1121
View Paper titled, Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Wafer Surface Measurements Using Shadow Moiré With Talbot Effect

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S. Wu, S. Wei, I. Kao, F. P. Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 369-376, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1112
https://doi.org/10.1115/IMECE1997-1112
View Paper titled, Wafer Surface Measurements Using Shadow Moiré With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows
Proceedings Papers

Transient Temperature Measurements in a Simulated RTCVD Reactor

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J. F. Horton, J. E. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 217-224, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0912
https://doi.org/10.1115/IMECE1997-0912
View Paper titled, Transient Temperature Measurements in a Simulated RTCVD Reactor
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Topics: Temperature measurement, Transients (Dynamics), Temperature, Buoyancy, Density, Semiconductor wafers, Uncertainty, Chemical vapor deposition, Flow (Dynamics), Flow visualization