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Proceedings Papers

Integration of Printed Circuit Board (PCB) Interface to Quartz Crystal Microbalance (QCM) for Gas Adsorption Testbed

Thi Kieu Ngan Pham, Matthew Nakamura, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A022, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112176
https://doi.org/10.1115/IMECE2023-112176
View Paper titled, Integration of Printed Circuit Board (PCB) Interface to Quartz Crystal Microbalance (QCM) for Gas Adsorption Testbed
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Topics: Distributed power generation, Printed circuit boards, Quartz crystals, Thin films
Proceedings Papers

Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities

Felix Pancheri, Yilun Sun, Christoph August Wilhelm Parhofer, Christoph Rehekampff, Dingzhi Zhang, Tim C. Lueth
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A046, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113510
https://doi.org/10.1115/IMECE2023-113510
View Paper titled, Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities
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Topics: Cooling, Design automation, Printed circuit boards, Heat sinks, Design, Geometry, Additive manufacturing, Electronics, Heat, Matlab
Proceedings Papers

A Method for Selecting Electronic Manufacturing Processes Based on Cost Factors

Sammy G. Shina, Anil Saigal
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 757-769, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0846
https://doi.org/10.1115/IMECE1996-0846
View Paper titled, A Method for Selecting Electronic Manufacturing Processes Based on Cost Factors
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Topics: Manufacturing, Design, Algorithms, Electronic circuits, Integrated circuits, Printed circuit boards, Tooling
Proceedings Papers

An Automated System for Temperature Dependent Mechanical Property Measurements

Yarom Polsky, Charles Ume
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 141-151, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0784
https://doi.org/10.1115/IMECE1996-0784
View Paper titled, An Automated System for Temperature Dependent Mechanical Property Measurements
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Topics: Mechanical properties, Temperature, Data acquisition, Printed circuit boards, Computer software, Computers, Copper foil, Electrical resistance, Laminates, Lasers
Proceedings Papers

Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment

K. Darbha, A. Poddar, C. S. Sealing, C. Ramaswamy, L. Tang, K. Upadhayayula, A. Dasgupta, Y. Joshi
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 153-178, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0785
https://doi.org/10.1115/IMECE1996-0785
View Paper titled, Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment
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Topics: Process simulation, Surface mount packaging, Manufacturing, Solders, Design, Geometry, Modeling, Cycles, Solder joints, Warping
Proceedings Papers

CAE Durability Simulation of Vibration Sweep Tests

J. M. Hu, G. Garfinkel
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 47-53, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0889
https://doi.org/10.1115/IMECE1996-0889
View Paper titled, CAE Durability Simulation of Vibration Sweep Tests
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Topics: Computer-aided engineering, Durability, Simulation, Vibration, Stress, Aluminum, Computational methods, Failure, Fatigue damage, Finite element analysis
Proceedings Papers

Thermal Management of Flip Chips on Printed Circuit Boards

Ron Zhang, Darrel Peugh, Bruce Myers
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 73-79, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0892
https://doi.org/10.1115/IMECE1996-0892
View Paper titled, Thermal Management of Flip Chips on Printed Circuit Boards
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Topics: Flip-chip devices, Printed circuit boards, Thermal management, Ceramics, Electronics, Energy dissipation, Power density, Reliability, Shrinkage (Materials)
Proceedings Papers

Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models

Chiayu Fu, I. Charles Ume, David L. McDowell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
https://doi.org/10.1115/IMECE1996-0891
View Paper titled, Thermomechanical Stress Analyses of Plated-Through Holes in PWB Using Internal State Variable Constitutive Models
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Topics: Constitutive equations, Printed circuit boards, Stress analysis (Engineering), Thermomechanics, Fatigue, Fatigue cracks, Stress, Temperature, Thermal stresses, Copper
Proceedings Papers

Conjugate Mixed Convective Heat Transfer in Electronic Equipment

Prashant Gadepalli, Muhammad M. Rahman
Proc. ASME. IMECE96, Heat Transfer: Volume 2 — Heat Transfer in Turbulent Flows; Fundamentals of Convection Heat Transfer; Fundamentals of Natural Convection in Laminar and Turbulent Flows; Natural Circulation, 219-229, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0073
https://doi.org/10.1115/IMECE1996-0073
View Paper titled, Conjugate Mixed Convective Heat Transfer in Electronic Equipment
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Topics: Boundary layers, Convection, Cooling, Cross-flow, Electronic components, Electronic equipment, Flow (Dynamics), Forced convection, Heat, Heat transfer
Proceedings Papers

Thermal Analysis of Compact Electronic Equipment With Cooling Fan

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Sadao Makita
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 89-92.1, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1007
https://doi.org/10.1115/IMECE1996-1007
View Paper titled, Thermal Analysis of Compact Electronic Equipment With Cooling Fan
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Topics: Cooling, Electronic equipment, Thermal analysis, Heat conduction, Numerical analysis, Air flow, Computer simulation, Computers, Finite volume methods, Printed circuit boards
Proceedings Papers

On the Routinization of Analysis for Physical Design

Russell S. Peak, Andrew J. Scholand, Robert E. Fulton
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 73-82, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1005
https://doi.org/10.1115/IMECE1996-1005
View Paper titled, On the Routinization of Analysis for Physical Design
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Topics: Design, Electronic packaging, Catalysts, Deformation, Fatigue, Finite element analysis, Printed circuit boards, Product design, Solder joints, Warping
Proceedings Papers

Design of Low-Level Hardware for a Multi-Layered Control Architecture

Madeline Kogelis, Zachary J. Fuge, Connor W. Herron, Bhaben Kalita, Alexander Leonessa
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A015, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94614
https://doi.org/10.1115/IMECE2022-94614
View Paper titled, Design of Low-Level Hardware for a Multi-Layered Control Architecture
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Topics: Actuators, Design, Hardware, Motors, Sensors, Control equipment, Filters, Robotics, Circuits, Computer software
Proceedings Papers

Assembly Automation Using an Industrial Robot

Timofey Dragun, Seth Mascaro, Jonathan Blanchard, Vedang Chauhan
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A056, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94986
https://doi.org/10.1115/IMECE2022-94986
View Paper titled, Assembly Automation Using an Industrial Robot
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Topics: Manufacturing, Robotics, Robots, Simulation, Computer software, Additive manufacturing, Mechatronics, Printed circuit boards
Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0815
https://doi.org/10.1115/IMECE1997-0815
View Paper titled, Low Cost Plastic Packaging of the Network Interface Unit
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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature
Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0821
https://doi.org/10.1115/IMECE1997-0821
View Paper titled, Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip
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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization
Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0824
https://doi.org/10.1115/IMECE1997-0824
View Paper titled, Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs
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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Hyunjae Park, Nicholas Nigro, Abdel Elkouh, Neil Gollhardt, Ping Lee
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 315-324, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0857
https://doi.org/10.1115/IMECE1997-0857
View Paper titled, Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards
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Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution
Proceedings Papers

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Jagannath Raghavan, Muhammad M. Rahman
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 337-346, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0859
https://doi.org/10.1115/IMECE1997-0859
View Paper titled, Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board
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Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction
Proceedings Papers

Batch Fabrication of Pneumatic Valve Arrays by Combining MEMS With Printed Circuit Board Technology

Patrick Cheung, Andrew A. Berlin, David K. Biegelsen, Warren B. Jackson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 39-46, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0937
https://doi.org/10.1115/IMECE1997-0937
View Paper titled, Batch Fabrication of Pneumatic Valve Arrays by Combining MEMS With Printed Circuit Board Technology
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Topics: Manufacturing, Microelectromechanical systems, Pneumatic valves, Printed circuit boards, Valves, Actuators, Air flow, Air jets, Design, Flow (Dynamics)