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Proceedings Papers

On the Micromechanical Properties of Conventional and 3D-Printed Rebar

Seyed M. Allameh, Alexis Eckart, Jose Fonseca Lopez, Roger Miller, Avery Lenihan, Hadi Allameh

Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A029, October 30–November 3, 2022

Paper No: IMECE2022-94651

DOI: https://doi.org/10.1115/IMECE2022-94651

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Topics: Additive manufacturing, Reinforced concrete, Reliability, Welding, Concretes, Steel, Construction, Fatigue properties, Gages, Structures

Proceedings Papers

Mechanics of Polishing

Vispi H. Bulsara, Yoomin Ahn, Srinivasan Chandrasekar, Thomas N. Farris

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 225-233, November 16–21, 1997

Paper No: IMECE1997-1096

DOI: https://doi.org/10.1115/IMECE1997-1096

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Topics: Polishing, Particulate matter, Particle size, Manganese (Metal), Microhardness, Stress

Proceedings Papers

Residual Stresses and Workpiece Deformation due to Polishing and Plating of Computer Hard Disk Substrates

Barney E. Klamecki

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 235-244, November 16–21, 1997

Paper No: IMECE1997-1097

DOI: https://doi.org/10.1115/IMECE1997-1097

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Topics: Computers, Deformation, Disks, Plating, Polishing, Residual stresses, Stress, Aluminum alloys, Displacement, Model development

Proceedings Papers

Self-Assembled Microslider for Microjoinery

L.-S. Huang, B. Sridharan, C.-J. Kim, S. D. Collins, C. González, R. L. Smith

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 499-504, November 15–20, 1998

Paper No: IMECE1998-1291

DOI: https://doi.org/10.1115/IMECE1998-1291

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Topics: Self-assembly, Manufacturing, Semiconductor wafers, Bonding, Etching, Anisotropy, Clearances (Engineering), Friction, Micromachining, Polishing

Proceedings Papers

Current Status of 300 mm Silicon Wafer Characterization

Troy Messina, Chi Au, Steven Shih, Zach Yang, Randy Goodall, Howard Huff

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 825-837, November 15–20, 1998

Paper No: IMECE1998-1098

DOI: https://doi.org/10.1115/IMECE1998-1098

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Topics: Semiconductor wafers, Contamination, Metrology, Oxygen, Particulate matter, Polishing, Silicon

Proceedings Papers

Effect of Surface Finish on Flow Boiling Heat Transfer

Satish G. Kandlikar, Paul H. Spiesman

Proc. ASME. IMECE98, Heat Transfer: Volume 1 — Heat Transfer in Flowing Systems, 157-163, November 15–20, 1998

Paper No: IMECE1998-0592

DOI: https://doi.org/10.1115/IMECE1998-0592

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Topics: Boiling, Finishes, Flow (Dynamics), Heat transfer, Cavities, Computer software, Heat flux, Image processing, Microscopes, Nucleate boiling

Proceedings Papers

An Analytical Aspect of the Preston Equation

H. Hocheng, H. Y. Tsai

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 33-36, November 15–20, 1998

Paper No: IMECE1998-1012

DOI: https://doi.org/10.1115/IMECE1998-1012

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Topics: Glass grinding and polishing, Mechanical properties, Polishing, Pressure, Semiconductor wafers

Proceedings Papers

Dimensional Stability of Composite in a Space Thermal Environment

Ran Y. Kim, Allan S. Crasto, Gregory A. Schoeppner

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 193-194, November 15–20, 1998

Paper No: IMECE1998-1169

DOI: https://doi.org/10.1115/IMECE1998-1169

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Topics: Composite materials, Stability, Laminates, Cycles, Density, Fracture (Materials), Space frame structures, Strain gages, Temperature, Anisotropy

Proceedings Papers

The Effect of Cement Thickness & Surface Roughness on the Strength of the Metal-Cement Interface

Thomas A. Gruen, Darryl Shockley, Timothy L. Norman

Proc. ASME. IMECE98, Advances in Bioengineering, 351-352, November 15–20, 1998

Paper No: IMECE1998-0169

DOI: https://doi.org/10.1115/IMECE1998-0169

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Topics: Cements (Adhesives), Metals, Surface roughness, Polishing, Temperature, Arthroplasty, Bone, Cavities, Failure, Hip joint prostheses

Proceedings Papers

Prediction of Glide Avalanche Based on Composite Roughness

Shoji Suzuki

Proc. ASME. IMECE98, 9th International Symposium on Information Storage and Processing Systems, 23-30, November 15–20, 1998

Paper No: IMECE1998-0205

DOI: https://doi.org/10.1115/IMECE1998-0205

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Topics: Composite materials, Surface roughness, Disks, Surface topography, Finishes, Contamination, Lasers, Polishing

Proceedings Papers

On the Fatigue Properties of 3D Steel Structures Welded Onto Ceramics

Seyed M. Allameh, Douglas Alexander, Roger Miller, Avery Lenihan, Hadi Allameh

Proc. ASME. IMECE2021, Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications, V003T03A036, November 1–5, 2021

Paper No: IMECE2021-72572

DOI: https://doi.org/10.1115/IMECE2021-72572

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Topics: Ceramics, Fatigue properties, Steel, Metals, Stress, Welding, Reliability, Testing, Additive manufacturing, Base metals

Proceedings Papers

Improved Correlation for Natural Convection Heat Transfer From Inclined Cylinders Having Different Emissivities

Jeffrey C. Stewart, William S. Janna

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 133-143, November 14–19, 1999

Paper No: IMECE1999-0979

DOI: https://doi.org/10.1115/IMECE1999-0979

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Topics: Cylinders, Heat transfer, Natural convection, Heat transfer coefficients, Aluminum, Copper, Finishes, Geometry, Heat flux, Polishing

Proceedings Papers

A Method for Measuring Short Crack R-Curve Behavior of Ferroelectric Ceramic

Wei Chen, Christopher S. Lynch, Doru Lupascu

Proc. ASME. IMECE99, Adaptive Structures and Material Systems, 119-124, November 14–19, 1999

Paper No: IMECE1999-0535

DOI: https://doi.org/10.1115/IMECE1999-0535

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Topics: Ferroelectric ceramics, Fracture (Materials), Fracture toughness, Surface cracks, Damage, Lanthanum, Polishing

Proceedings Papers

Silicon Carbide Wafer Polishing With Gas Cluster Ion Beams

V. DiFilippo, J. A. Bennett, D. B. Fenner, J. K. Hirvonen, L. C. Feldman, A. Saigal

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 117-122, November 11–16, 2001

Paper No: IMECE2001/EPP-24714

DOI: https://doi.org/10.1115/IMECE2001/EPP-24714

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Topics: Polishing, Semiconductor wafers, Silicon, Surface roughness, Atomic force microscopy, Atoms, Condensation, Crystals, Gases, High pressure (Physics)

Proceedings Papers

A Neural-Taguchi Based Quasi Time-Optimal Control Strategy for Chemical-Mechanical Polishing Processes

Gou-Jen Wang, Meng-Hsian Chou

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 129-134, November 11–16, 2001

Paper No: IMECE2001/EPP-24716

DOI: https://doi.org/10.1115/IMECE2001/EPP-24716

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Topics: Polishing, Time optimal control, Semiconductor wafers, Artificial neural networks, Pressure

Proceedings Papers

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics

Jhy-Cherng Tsai, Charls Liu, Ming-Hsih Tsai, Bao-Tong Dai

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001

Paper No: IMECE2001/EPP-24717

DOI: https://doi.org/10.1115/IMECE2001/EPP-24717

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Topics: Dielectric materials, Electrical conductivity, Polishing, Pressure, Semiconductor wafers, Thermal conductivity

Proceedings Papers

Using Textile Topography to Analyze X-Ray CT Data of Composite Microstructure

Richard S. Parnas, Martine Wevers, Ignaas Verpoest

Proc. ASME. IMECE2001, Heat Transfer: Volume 6 — Heat Transfer in Materials Processing, 271-278, November 11–16, 2001

Paper No: IMECE2001/HTD-24360

DOI: https://doi.org/10.1115/IMECE2001/HTD-24360

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Topics: Composite materials, Computerized tomography, Textiles, Yarns, Cross section (Physics), Optical microscopy, Polishing, Signal to noise ratio, X-rays

Proceedings Papers

Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization

Jhy-Cherng Tsai, Mingyi Tsai

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 221-226, November 5–10, 2000

Paper No: IMECE2000-2267

DOI: https://doi.org/10.1115/IMECE2000-2267

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Topics: Polishing, Pressure, Wear

Proceedings Papers

Abrasion of Steel by Diamondlike Carbon Coatings

Stephen J. Harris

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 73, November 5–10, 2000

Paper No: IMECE2000-2680

DOI: https://doi.org/10.1115/IMECE2000-2680

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Topics: Abrasion, Carbon films, Steel, Coatings, Nanoscale phenomena, Stress, Surface roughness, Bearings, Boron, Carbon

Proceedings Papers

Microstructural Characterization of Micro-Textured Titanium Surfaces

W. O. Soboyejo, C. Mercer, S. Allameh, B. Nemetski, N. Marcantonio, J. Ricci

Proc. ASME. IMECE2000, Materials: Book of Abstracts, 61, November 5–10, 2000

Paper No: IMECE2000-2674

DOI: https://doi.org/10.1115/IMECE2000-2674

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Topics: Atomic force microscopy, Biomedicine, Blasting, Dislocations, Lasers, Manufacturing, Nanoscale phenomena, Optical microscopy, Optimization, Polishing

2 3 4 5

NARROW

On the Micromechanical Properties of Conventional and 3D-Printed Rebar

Mechanics of Polishing

Residual Stresses and Workpiece Deformation due to Polishing and Plating of Computer Hard Disk Substrates

Self-Assembled Microslider for Microjoinery

Current Status of 300 mm Silicon Wafer Characterization

Effect of Surface Finish on Flow Boiling Heat Transfer

An Analytical Aspect of the Preston Equation

Dimensional Stability of Composite in a Space Thermal Environment

The Effect of Cement Thickness & Surface Roughness on the Strength of the Metal-Cement Interface

Prediction of Glide Avalanche Based on Composite Roughness

On the Fatigue Properties of 3D Steel Structures Welded Onto Ceramics

Improved Correlation for Natural Convection Heat Transfer From Inclined Cylinders Having Different Emissivities

A Method for Measuring Short Crack R-Curve Behavior of Ferroelectric Ceramic

Silicon Carbide Wafer Polishing With Gas Cluster Ion Beams

A Neural-Taguchi Based Quasi Time-Optimal Control Strategy for Chemical-Mechanical Polishing Processes

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics

Using Textile Topography to Analyze X-Ray CT Data of Composite Microstructure

Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization

Abrasion of Steel by Diamondlike Carbon Coatings

Microstructural Characterization of Micro-Textured Titanium Surfaces

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