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Proceedings Papers

A Domain Decomposition Algorithm for Thermal Analysis in X-Ray Lithography With Cylindrical Geometry

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Weizhong Dai, Raja Nassar
Proc. ASME. IMECE98, Fluids Engineering, 95-100, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0991
https://doi.org/10.1115/IMECE1998-0991
View Paper titled, A Domain Decomposition Algorithm for Thermal Analysis in X-Ray Lithography With Cylindrical Geometry
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Topics: Algorithms, Geometry, Thermal analysis, X-ray lithography, Photoresists, X-rays, Irradiation (Radiation exposure), Linear systems, Microfabrication, Numerical analysis
Proceedings Papers

The Fabrication of Thin Film NiTi Shape Memory Alloy Micro Actuator for MEMS Application

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John J. Gill, Ken Ho, Gregory P. Carman
Proc. ASME. IMECE99, Adaptive Structures and Material Systems, 125-131, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0536
https://doi.org/10.1115/IMECE1999-0536
View Paper titled, The Fabrication of Thin Film NiTi Shape Memory Alloy Micro Actuator for MEMS Application
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Topics: Manufacturing, Microactuators, Microelectromechanical systems, Nickel titanium alloys, Thin films, Temperature, Shapes, Membranes, Actuators, Finishes
Proceedings Papers

Fabrication of High-Index Refractive Microlenses for Near-Field Optics

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D. A. Fletcher, K. B. Crozier, G. S. Kino, C. F. Quate, K. E. Goodson
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 289-294, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0282
https://doi.org/10.1115/IMECE1999-0282
View Paper titled, Fabrication of High-Index Refractive Microlenses for Near-Field Optics
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Topics: Manufacturing, Optics, Resolution (Optics), Lenses (Optics), Silicon, Diffraction, Refractive index, Spectroscopy, Temperature measurement, Wavelength
Proceedings Papers

Multiple Through-Wafer Interconnects for Stacking of Microsystems

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Matthias Heschel, Kurt Rasmussen, Jochen F. Kuhmann, Siebe Bouwstra
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 537-540, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0317
https://doi.org/10.1115/IMECE1999-0317
View Paper titled, Multiple Through-Wafer Interconnects for Stacking of Microsystems
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Topics: Microelectromechanical systems, Semiconductor wafers, Microphones, Bonding, Adhesives, Capacitance, Copper, Electroplating, Integrated circuits, Metals
Proceedings Papers

High-Aspect-Ratio Electroplated Structures With 2μm Beamwidth

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Xiaobin Li, Siddharth Kiyawat, Hector J. De Los Santos, Chang-Jin “CJ” Kim
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 25-30, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0241
https://doi.org/10.1115/IMECE1999-0241
View Paper titled, High-Aspect-Ratio Electroplated Structures With 2μm Beamwidth
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Topics: Bending (Stress), Cantilever beams, Cantilevers, Coating processes, Coatings, Electroplating, Flow (Dynamics), Nickel, Nickel plating, Optimization
Proceedings Papers

The Fabrication of Micro Mold Inserts Using Thick Film Resist Approach

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Huinan Yu, Dale Ganser, Kathleen A. Gehoski, David Mancini, David Rhine, Thomas Smekal, Piotr Grodzinski
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 247-250, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0275
https://doi.org/10.1115/IMECE1999-0275
View Paper titled, The Fabrication of Micro Mold Inserts Using Thick Film Resist Approach
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Topics: Manufacturing, Thick films, Microfluidics, Photoresists
Proceedings Papers

Constrained Layer Damping Treatments for Microstructures

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Yi-Chu Hsu, I. Y. Shen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 807-812, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23915
https://doi.org/10.1115/IMECE2001/MEMS-23915
View Paper titled, Constrained Layer Damping Treatments for Microstructures
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Topics: Damping, Microelectromechanical systems, Silicon, Aluminum, Etching, Photoresists, Excitation, Finite element analysis, Frequency response, Laser Doppler vibrometers
Proceedings Papers

A Wafer Transfer Technology for MEMS Adaptive Optics

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Eui-Hyeok Yang, Dean V. Wiberg
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 51-55, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23807
https://doi.org/10.1115/IMECE2001/MEMS-23807
View Paper titled, A Wafer Transfer Technology for MEMS Adaptive Optics
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Topics: Microelectromechanical systems, Optics, Semiconductor wafers, Membranes, Mirrors, Actuators, Epoxy adhesives, Epoxy resins, Manufacturing, Photoresists
Proceedings Papers

Fabrication of Novel Polysilazane MEMS Structures by Microcasting

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Li-Anne Liew, Tsali Cross, Victor M. Bright, Rishi Raj
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 837-844, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23920
https://doi.org/10.1115/IMECE2001/MEMS-23920
View Paper titled, Fabrication of Novel Polysilazane MEMS Structures by Microcasting
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Topics: Manufacturing, Microelectromechanical systems, Glass, Transparency, Absorption, Casting, Diffraction gratings, Optical instruments, Photoresists, Temperature
Proceedings Papers

A Batch Fabrication Micro-Ball Array for Optical Coupling in Free Space Communication

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S.-C. Shen, H.-P. Chou
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 851-857, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23922
https://doi.org/10.1115/IMECE2001/MEMS-23922
View Paper titled, A Batch Fabrication Micro-Ball Array for Optical Coupling in Free Space Communication
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Topics: Lenses (Optics), Manufacturing, Microelectromechanical systems, Semiconductor wafers, Vacuum, Fibers, Optical fiber, Silicon, Anisotropy, Bonding
Proceedings Papers

Design and Fabrication of a Silicon-Based MEMS Rotary Engine

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Kelvin Fu, Aaron J. Knobloch, Fabian C. Martinez, David C. Walther, Carlos Fernandez-Pello, Al P. Pisano, Dorian Liepmann
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 875-880, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23925
https://doi.org/10.1115/IMECE2001/MEMS-23925
View Paper titled, Design and Fabrication of a Silicon-Based MEMS Rotary Engine
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Topics: Design, Engines, Manufacturing, Microelectromechanical systems, Silicon, Rotors, Density, Energy / power systems, Etching, Geometry
Proceedings Papers

Design and Fabrication of a Silicon-Based MEMS Rotary Engine

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Kelvin Fu, Aaron J. Knobloch, Fabian C. Martinez, David C. Walther, Carlos Fernandez-Pello, Al P. Pisano, Dorian Liepmann
Proc. ASME. IMECE2001, Advanced Energy Systems, 303-308, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/AES-23636
https://doi.org/10.1115/IMECE2001/AES-23636
View Paper titled, Design and Fabrication of a Silicon-Based MEMS Rotary Engine
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Topics: Design, Engines, Manufacturing, Microelectromechanical systems, Silicon, Rotors, Density, Energy / power systems, Etching, Geometry
Proceedings Papers

Thin Film NiTi Shape Memory Alloy Microactuator With Two-Way Effect

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John J. Gill, Gregory P. Carman
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 89-95, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1076
https://doi.org/10.1115/IMECE2000-1076
View Paper titled, Thin Film NiTi Shape Memory Alloy Microactuator With Two-Way Effect
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Topics: Microactuators, Nickel titanium alloys, Thin films, Temperature, Membranes, Deflection, Frequency response, Microelectromechanical systems, Shapes, Actuators
Proceedings Papers

Study of Low-Frequency Narrow Bandwidth Surface Acoustic Wave Sensor for Liquid Applications

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Kun-Lin Lee, Ioana Voiculescu
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A003, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11618
https://doi.org/10.1115/IMECE2019-11618
View Paper titled, Study of Low-Frequency Narrow Bandwidth Surface Acoustic Wave Sensor for Liquid Applications
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Topics: Sensors, Surface acoustic waves, Waveguides, Electrodes, Delay lines, Filters, Quartz, Signals, Water, Acoustics
Proceedings Papers

Dynamic Exposure Model of Scanning Beam Interference Lithography

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Sen Lu, Kaiming Yang, Yu Zhu, Leijie Wang, Ming Zhang
Proc. ASME. IMECE2018, Volume 4A: Dynamics, Vibration, and Control, V04AT06A004, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-86979
https://doi.org/10.1115/IMECE2018-86979
View Paper titled, Dynamic Exposure Model of Scanning Beam Interference Lithography
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Topics: Lithography, Photoresists, Diffraction gratings, Process simulation
Proceedings Papers

An Experimental Study of the Structural Dynamic Response of a Biomimetic Insect-Sized Wing

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Jose E. Rubio, Uttam K. Chakravarty
Proc. ASME. IMECE2017, Volume 1: Advances in Aerospace Technology, V001T03A019, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-70447
https://doi.org/10.1115/IMECE2017-70447
View Paper titled, An Experimental Study of the Structural Dynamic Response of a Biomimetic Insect-Sized Wing
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Topics: Biomimetics, Structural dynamics, Wings, Cranes, Deformation, Membranes, Photolithography, Computer-aided design, Displacement, Fast Fourier transforms
Proceedings Papers

An Investigation of the Aerodynamic Performance of a Biomimetic Insect-Sized Wing for Micro Air Vehicles

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Jose E. Rubio, Uttam K. Chakravarty
Proc. ASME. IMECE2016, Volume 1: Advances in Aerospace Technology, V001T03A015, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65303
https://doi.org/10.1115/IMECE2016-65303
View Paper titled, An Investigation of the Aerodynamic Performance of a Biomimetic Insect-Sized Wing for Micro Air Vehicles
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Topics: Biomimetics, Vehicles, Wings, Reynolds number, Deformation, Drag (Fluid dynamics), Air flow, Aircraft, Computational fluid dynamics, Computer simulation
Proceedings Papers

Impact of Particle Selection on Nanoparticle Self-Assembly in Evaporating Colloidal Droplets

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Marcette Greyson, Kara L. Maki, Michael J. Schertzer
Proc. ASME. IMECE2016, Volume 7: Fluids Engineering, V007T09A051, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66851
https://doi.org/10.1115/IMECE2016-66851
View Paper titled, Impact of Particle Selection on Nanoparticle Self-Assembly in Evaporating Colloidal Droplets
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Topics: Drops, Evaporation, Nanoparticles, Particulate matter, Self-assembly, Electric fields, Dynamics (Mechanics), Titanium, Biomedicine, Electrophoresis
Proceedings Papers

Transient Interface Shape and Deposition Profile Left by Desiccation of Colloidal Droplets on Multiple Surfaces

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Peter D. Dunning, Marcette Greyson, Michael J. Schertzer
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A026, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52216
https://doi.org/10.1115/IMECE2015-52216
View Paper titled, Transient Interface Shape and Deposition Profile Left by Desiccation of Colloidal Droplets on Multiple Surfaces
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Topics: Drops, Shapes, Transients (Dynamics), Glass, Particulate matter, Electric fields, Patient diagnosis, Photoresists, Printing
Proceedings Papers

Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist

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Wei Chen, Yaqin Song, Jiaxing Liang, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A041, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40154
https://doi.org/10.1115/IMECE2014-40154
View Paper titled, Fabrication of Second-Level TriDelta Interconnects Using Negative Dry-Film Photoresist
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Topics: Manufacturing, Photoresists, Design, Semiconductor wafers, Silicon, Displacement, Liquid films, Stress