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Proceedings Papers

In-Process Intelligent Inspection of the Specimen Using Machine Vision

Adarsh Mahor, Ram Singar Yadav
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A057, October 30–November 3, 2022
Paper No: IMECE2022-95347
DOI: https://doi.org/10.1115/IMECE2022-95347
View Paper titled, In-Process Intelligent Inspection of the Specimen Using Machine Vision
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Topics: Inspection, Machinery, Algorithms, Dimensions, Manufacturing, Assembly lines, Computers, Shapes, Artificial neural networks, Conveyor belts
Proceedings Papers

Design of Human-Robot Collaborative Workstation for the Packaging of Kitchen Furniture

Marianna Ciccarelli, Simir Moschini, Matteo Claudio Palpacelli, Alessandra Papetti, Michele Germani
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A059, October 30–November 3, 2022
Paper No: IMECE2022-95452
DOI: https://doi.org/10.1115/IMECE2022-95452
View Paper titled, Design of Human-Robot Collaborative Workstation for the Packaging of Kitchen Furniture
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Topics: Design, Packaging, Risk assessment, Robots, Safety
Proceedings Papers

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 65-80, November 16–21, 1997
Paper No: IMECE1997-0815
DOI: https://doi.org/10.1115/IMECE1997-0815
View Paper titled, Low Cost Plastic Packaging of the Network Interface Unit
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Topics: Packaging, Electronics, Snap fitting, Design, Fire resistance, Gaskets, Heat, Hinges, Injection molded plastics, Low temperature
Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997
Paper No: IMECE1997-0810
DOI: https://doi.org/10.1115/IMECE1997-0810
View Paper titled, Design Considerations in Avionics Electronic Packaging
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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
View Paper titled, Sequential Processing Mechanics Modeling for a Model IC Package
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997
Paper No: IMECE1997-1126
DOI: https://doi.org/10.1115/IMECE1997-1126
View Paper titled, Video Based Manufacturing Courses for Electronics
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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Paper No: IMECE1997-1111
DOI: https://doi.org/10.1115/IMECE1997-1111
View Paper titled, Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Paper No: IMECE1997-1110
DOI: https://doi.org/10.1115/IMECE1997-1110
View Paper titled, On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints
Proceedings Papers

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Salvador M. Aceves, Gene D. Berry
Proc. ASME. IMECE97, Advanced Energy Systems, 155-163, November 16–21, 1997
Paper No: IMECE1997-0985
DOI: https://doi.org/10.1115/IMECE1997-0985
View Paper titled, Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage
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Topics: Hydrogen storage, Pressure vessels, Thermodynamics, Hydrogen, Temperature, Vessels, Automobiles, Fuels, Low temperature, Pressure
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Paper No: IMECE1997-1231
DOI: https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
View Paper titled, Characterization of Plastic Packages Using (100) Silicon Stress Test Chips
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997
Paper No: IMECE1997-1216
DOI: https://doi.org/10.1115/IMECE1997-1216
View Paper titled, Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules
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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability
Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997
Paper No: IMECE1997-1210
DOI: https://doi.org/10.1115/IMECE1997-1210
View Paper titled, Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
DOI: https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment

J. Kurth Reynolds, David C. Catling, Randy C. Blue, Nadim Maluf, Thomas W. Kenny
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 401-406, November 15–20, 1998
Paper No: IMECE1998-1276
DOI: https://doi.org/10.1115/IMECE1998-1276
View Paper titled, Packaging and Instrumentation of a Commercial Pressure Sensor for a High-G Impact and the Martian Environment
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Topics: Instrumentation, Packaging, Pressure sensors, Sensors, Temperature, Atmospheric pressure, Calibration, Errors, Fluctuations (Physics), NASA
Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998
Paper No: IMECE1998-1290
DOI: https://doi.org/10.1115/IMECE1998-1290
View Paper titled, Ceramic Tape-Based Meso Systems Technology
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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems
Proceedings Papers

Process Improvement Using Assembly Analysis Method

Devdas Shetty, Claudio Campana, Jun Kondo
Proc. ASME. IMECE98, Applications of Design for Manufacturing, 39-47, November 15–20, 1998
Paper No: IMECE1998-0912
DOI: https://doi.org/10.1115/IMECE1998-0912
View Paper titled, Process Improvement Using Assembly Analysis Method
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Topics: Manufacturing, Packaging, Design
Proceedings Papers

Structural Analysis of a Sensor Module for the “Smart” Bearing

Robert Gao, Priyaranjan Sahay
Proc. ASME. IMECE98, Dynamic Systems and Control, 615-621, November 15–20, 1998
Paper No: IMECE1998-0309
DOI: https://doi.org/10.1115/IMECE1998-0309
View Paper titled, Structural Analysis of a Sensor Module for the “Smart” Bearing
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Topics: Bearings, Sensors, Structural analysis, Ball bearings, Deflection, Design, Electronic components, Modal analysis, Packaging, Stress
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
DOI: https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers