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Proceedings Papers

Multiscale Investigation of Interfacial Adhesion Strength of Epoxy Resin Adhesives Over a Wide Range of Loading Rate

Aoi Takagi, Yuto Kasuya, Masayoshi Ogawa, Yuichi Hosoya, Akio Yonezu
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A007, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144839
https://doi.org/10.1115/IMECE2024-144839
View Paper titled, Multiscale Investigation of Interfacial Adhesion Strength of Epoxy Resin Adhesives Over a Wide Range of Loading Rate
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Topics: Adhesion, Adhesives, Epoxy resins, Finite element methods, Lasers, Molecular dynamics, Pressure, Shock waves
Proceedings Papers

The High Strain-Rate Impact Energy-Absorption Characteristics of Graphene Using Molecular Dynamics (MD) Simulations

Olanrewaju Aluko, Rakesh Geddam
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T12A032, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144943
https://doi.org/10.1115/IMECE2024-144943
View Paper titled, The High Strain-Rate Impact Energy-Absorption Characteristics of Graphene Using Molecular Dynamics (MD) Simulations
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Topics: Absorption, Deformation, Graphene, Molecular dynamics, Nanoscale phenomena, Simulation
Proceedings Papers

Constitutive Modeling of Nonlinear Time-Dependent Mechanical Properties Using Molecular Dynamics Simulations

Md Salah Uddin
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T12A039, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144238
https://doi.org/10.1115/IMECE2024-144238
View Paper titled, Constitutive Modeling of Nonlinear Time-Dependent Mechanical Properties Using Molecular Dynamics Simulations
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Topics: Mechanical properties, Modeling, Molecular dynamics, Molecular dynamics simulation, Stress, Aerospace industry, Automobiles, Biomedicine, Constitutive equations, Elasticity
Proceedings Papers

Flexural and Tensile Properties of Cu-Ni-Cr Alloy Processed by Solid-State Additive Manufacturing

Abyaz Abid, Hamid Sharifi, Chowdhury Sadid Alam, Radif Uddin Ahmed, Pratik Sarker, Collin Wick, M. Shafiqur Rahman
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A028, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-146032
https://doi.org/10.1115/IMECE2024-146032
View Paper titled, Flexural and Tensile Properties of Cu-Ni-Cr Alloy Processed by Solid-State Additive Manufacturing
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Topics: Additive manufacturing, Alloys, Molecular dynamics, Tensile strength
Proceedings Papers

Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations

Simon Bratescu, Jungkyu Park
Proc. ASME. IMECE2023, Volume 7: Energy, V007T08A086, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112656
https://doi.org/10.1115/IMECE2023-112656
View Paper titled, Thermal Transport Study of KCl-UCl3 Using Molecular Dynamics Simulations
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Topics: Algorithms, Density, Fuels, Heat flux, Molecular dynamics, Molecular dynamics simulation, Molten salt reactors, Phonons, Simulation, Temperature
Proceedings Papers

Study on Molecular Dynamics Simulation With Boiling Water and Copper for Different Nanostructured Surfaces

Tanjee Afreen, Fisseha L. Gebre, JiaJun Xu
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A020, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-116819
https://doi.org/10.1115/IMECE2023-116819
View Paper titled, Study on Molecular Dynamics Simulation With Boiling Water and Copper for Different Nanostructured Surfaces
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Topics: Boiling, Copper, Molecular dynamics simulation, Water, Bubbles, Engineering simulation, Flow (Dynamics), Heat, Liquid films, Microscale devices
Proceedings Papers

Characterizing High-Speed Impact Behavior of UHMWPE Through Molecular Dynamics Simulation

Guodong Guo, Shah Alam
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A017, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112860
https://doi.org/10.1115/IMECE2023-112860
View Paper titled, Characterizing High-Speed Impact Behavior of UHMWPE Through Molecular Dynamics Simulation
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Topics: Molecular dynamics simulation, Polymers, Potential energy, Computer simulation, Crystals, Diamonds, Energy dissipation, Mechanical properties, Molecular dynamics, Polyethylene fibers
Proceedings Papers

Understanding Governing Physical Mechanism of Bio-Inspired Nanostructured Antifouling Coating

Akash Singh, Yumeng Li
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A052, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113115
https://doi.org/10.1115/IMECE2023-113115
View Paper titled, Understanding Governing Physical Mechanism of Bio-Inspired Nanostructured Antifouling Coating
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Topics: Bacteria, Biomimetics, Coating processes, Coatings, Membranes, Molecular dynamics
Proceedings Papers

Fracture Mechanics of Tetragraphene Under Mixed Mode Loading

Elnaz Haddadi, Alireza Tabarraei
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A015, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-111443
https://doi.org/10.1115/IMECE2023-111443
View Paper titled, Fracture Mechanics of Tetragraphene Under Mixed Mode Loading
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Topics: Fracture mechanics, Molecular dynamics, Carbon, Stress, Temperature, Crack propagation, Graphene, Energy gap, Engineering simulation, Fracture toughness
Proceedings Papers

Dynamic Fracture via Molecular Dynamics and Cohesive Finite Element Method

X.-P. Xu
Proc. ASME. IMECE96, Advances in Failure Mechanisms in Brittle Materials, 99-107, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1397
https://doi.org/10.1115/IMECE1996-1397
View Paper titled, Dynamic Fracture via Molecular Dynamics and Cohesive Finite Element Method
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Topics: Finite element methods, Fracture (Materials), Molecular dynamics, Atoms, Finite element analysis, Degrees of freedom, Displacement, Simulation experiments, Traction
Proceedings Papers

Adsorption of Hydrogen Isotopes on Novel Nanomaterials

Suheyl Polat, Aaron Stinebaugh, Jungkyu Park
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A049, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-96589
https://doi.org/10.1115/IMECE2022-96589
View Paper titled, Adsorption of Hydrogen Isotopes on Novel Nanomaterials
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Topics: Graphene, Hydrogen, Isotopes, Nanomaterials, Atoms, Carbon, Reflection, Simulation, Carbon nanotubes, Electrons
Proceedings Papers

Layer Dependent Out-Of-Plane Thermal Conductivity in MoS 2 : A Molecular Dynamics Study

Mahabubur Rahman, Huijuan Zhao
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A055, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-96075
https://doi.org/10.1115/IMECE2022-96075
View Paper titled, Layer Dependent Out-Of-Plane Thermal Conductivity in MoS 2 : A Molecular Dynamics Study
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Topics: Molecular dynamics, Thermal conductivity
Proceedings Papers

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Shogo Tezuka, Ken Suzuki
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A036, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94286
https://doi.org/10.1115/IMECE2022-94286
View Paper titled, Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature
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Topics: Alloys, Creep, Diffusion (Physics), Fatigue, Grain boundaries, Heat, Molecular dynamics, Stress, Temperature
Proceedings Papers

Bactericidal Effects of Micropillars: A Molecular Dynamics Study

Akash Singh, Yumeng Li
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A001, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95325
https://doi.org/10.1115/IMECE2022-95325
View Paper titled, Bactericidal Effects of Micropillars: A Molecular Dynamics Study
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Topics: Bacteria, Biomimetics, Molecular dynamics, Design, Molecular dynamics simulation, Wings, Dimensions, Engineering simulation, Modeling, Simulation
Proceedings Papers

Molecular Dynamics Simulation of the Effect of Hydrogen on the Interaction Between Dislocations in Alpha-Iron

Sunday Temitope Oyinbo, Tien-Chien Jen
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A040, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94722
https://doi.org/10.1115/IMECE2022-94722
View Paper titled, Molecular Dynamics Simulation of the Effect of Hydrogen on the Interaction Between Dislocations in Alpha-Iron
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Topics: Dislocations, Hydrogen, Iron, Mechanical admittance, Molecular dynamics, Molecular dynamics simulation
Proceedings Papers

A Molecular Dynamics Study on the Piezoelectric Properties of Bulk ZnS and Nanobelts

Iyad Hijazi, Rui Xie, Regis Houachissi
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A052, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95592
https://doi.org/10.1115/IMECE2022-95592
View Paper titled, A Molecular Dynamics Study on the Piezoelectric Properties of Bulk ZnS and Nanobelts
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Topics: Molecular dynamics, Shells, Simulation, Molecular dynamics simulation, Heat conduction, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reliability, Simulation results
Proceedings Papers

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0432
https://doi.org/10.1115/IMECE1998-0432
View Paper titled, Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics
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Topics: Diamonds, Molecular dynamics, Nucleation (Physics), Silicon, Atoms, Carbon, Chemical vapor deposition, Diamond films, Simulation, Aluminum
Proceedings Papers

Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

Jennifer R. Lukes, Xin-Gang Liang, Chang-Lin Tien
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 229-240, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0709
https://doi.org/10.1115/IMECE1998-0709
View Paper titled, Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity
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Topics: Molecular dynamics, Thermal conductivity, Thin films, Film thickness, Microscale devices, Phonons, Temperature, Wave interference, Waves
Proceedings Papers

Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires

Sebastian G. Volz, Gang Chen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 199-208, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0706
https://doi.org/10.1115/IMECE1998-0706
View Paper titled, Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires
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Topics: Molecular dynamics simulation, Nanowires, Silicon, Thermal conductivity, Phonons, Crystals, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Approximation
Proceedings Papers

Atomistic Simulation of Interface Effects in Hybrid Carbon Fiber Reinforced Polymer Composites Incorporating ZnO Nanowires

Parisa Marashizadeh, Mohammad Abshirini, Mrinal C. Saha, Liangliang Huang, Yingtao Liu
Proc. ASME. IMECE2021, Volume 3: Advanced Materials: Design, Processing, Characterization, and Applications, V003T03A048, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70772
https://doi.org/10.1115/IMECE2021-70772
View Paper titled, Atomistic Simulation of Interface Effects in Hybrid Carbon Fiber Reinforced Polymer Composites Incorporating ZnO Nanowires
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Topics: Carbon reinforced plastics, Composite materials, Molecular dynamics, Nanowires, Simulation