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Proceedings Papers
Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging
Available to Purchase
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144963
Proceedings Papers
On the Reliability Analysis of VLSI Chips When Subjected to Thermal Cycling
Available to Purchase
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 121-129, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1353
Proceedings Papers
Control of Thermal Deformations of Integrated Optical and Shape Memory Alloys Fibers
Available to Purchase
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 133-139, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0727
Proceedings Papers
Development of a Micropump for Microelectronic Cooling
Available to Purchase
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 239-244, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1357
Proceedings Papers
Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
Available to Purchase
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 131-140, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0783
Proceedings Papers
Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners
Available to Purchase
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1232
Proceedings Papers
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 27, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0934
Proceedings Papers
The Effect of Temperature and Humidity Exposure on Adhesion
Available to Purchase
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0493
Proceedings Papers
“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures
Available to Purchase
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0816
Proceedings Papers
Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
Available to Purchase
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0817
Proceedings Papers
Ceramic Tape-Based Meso Systems Technology
Available to PurchaseHaim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1290
Proceedings Papers
Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry
Available to Purchase
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0434
Proceedings Papers
Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing
Available to Purchase
Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0623
Proceedings Papers
A Large Stroke, Nanometer Precision X-Y Stage for Lithography
Available to Purchase
Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 89-94, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0942
Proceedings Papers
Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72
Available to Purchase
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 245-253, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1125
Proceedings Papers
High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics
Available to Purchase
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0308
Proceedings Papers
Design and Analysis of a Meso-Scale Refrigerator
Available to PurchaseN. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1068
Proceedings Papers
Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
Available to Purchase
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24382
Proceedings Papers
Bias-Dependent Peltier Coefficient in Bipolar Devices
Available to Purchase
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24396
Proceedings Papers
Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy
Available to PurchaseKwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24393
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