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Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997

Paper No: IMECE1997-0816

DOI: https://doi.org/10.1115/IMECE1997-0816

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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

MEMS for Fluidic Controls

Chih-Ming Ho, Yu-Chong Tai

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 27, November 16–21, 1997

Paper No: IMECE1997-0934

DOI: https://doi.org/10.1115/IMECE1997-0934

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Topics: Microelectromechanical systems, Sensors, Actuators, Circuits, Shear stress, Transducers, Computers, Integrated circuit fabrication, Micromachining, Artificial neural networks

Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997

Paper No: IMECE1997-1232

DOI: https://doi.org/10.1115/IMECE1997-1232

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Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

Lowell D. Jones, Jeffrey S. N. Paine

Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 89-94, November 15–20, 1998

Paper No: IMECE1998-0942

DOI: https://doi.org/10.1115/IMECE1998-0942

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Topics: Lithography, Design, Heat, Actuators, Cables, Flexure mechanisms, Inertia (Mechanics), Innovation, Magnetic levitation, Microelectronic devices

Proceedings Papers

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Haruna Tada, Alexis R. Abramson, Ioannis N. Miaoulis, Peter Y. Wong, Patricia Nieva, Paul Zavracky

Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998

Paper No: IMECE1998-0623

DOI: https://doi.org/10.1115/IMECE1998-0623

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Topics: Rapid thermal processing, Thin films, Semiconductor wafers, Heating, Reflectance, Temperature, Absorption, Computer simulation, Energy gap, High temperature

Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998

Paper No: IMECE1998-0434

DOI: https://doi.org/10.1115/IMECE1998-0434

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Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography

Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Andrzej J. Przekwas, Zhijian Chen, Marek Turowski

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999

Paper No: IMECE1999-0308

DOI: https://doi.org/10.1115/IMECE1999-0308

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Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics

Proceedings Papers

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

K. N. Rainey, S. M. You

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 245-253, November 14–19, 1999

Paper No: IMECE1999-1125

DOI: https://doi.org/10.1115/IMECE1999-1125

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Topics: Heat transfer, Pool boiling, Critical heat flux, Nucleate boiling, Coating processes, Coatings, Fins, Atmospheric pressure, Bubbles, Density

Proceedings Papers

Design and Analysis of a Meso-Scale Refrigerator

N. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999

Paper No: IMECE1999-1068

DOI: https://doi.org/10.1115/IMECE1999-1068

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Topics: Design, Compression, Engines, Motors, Capacitance, Compressors, Electromagnetic induction, Electronics, Heat, Microelectronic devices

Proceedings Papers

Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading

Yanhang Zhang, Martin L. Dunn

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 149-156, November 11–16, 2001

Paper No: IMECE2001/MEMS-23822

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23822

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Topics: Microelectromechanical systems, Polysilicon, Relaxation (Physics), Stress, Temperature, Cooling, Creep, Cycles, Deformation, Microelectronic devices

Proceedings Papers

Issues and Directions of MEMS Research for the Electronics Industry

Y. Eugene Pak

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 3-8, November 11–16, 2001

Paper No: IMECE2001/MEMS-23800

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23800

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Topics: Electronics, Microelectromechanical systems, Biotechnology, Electromechanical systems, Machining, Manufacturing, Microelectronic devices

Proceedings Papers

The History of Heat Transfer

L. S. “Skip” Fletcher

Proc. ASME. IMECE2001, Partnering to Succeed: Keys to Managing Technology Development, Risk and Globalization, 1, November 11–16, 2001

Paper No: IMECE2001/TS-23400

DOI: https://doi.org/10.1115/IMECE2001/TS-23400

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Topics: Heat transfer, Radiation (Physics), Convection, Engineering disciplines, Heat, Heat conduction, Physicists, Air-breathing engines, Creativity, Energy generation

Proceedings Papers

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

Vijay K. Varadan

Proc. ASME. IMECE2001, Partnering to Succeed: Keys to Managing Technology Development, Risk and Globalization, 19-20, November 11–16, 2001

Paper No: IMECE2001/TS-23404

DOI: https://doi.org/10.1115/IMECE2001/TS-23404

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Topics: Microelectromechanical systems, Microsensors, Nanoelectromechanical systems, Manufacturing, Actuators, Microelectronic devices, Sensors, Carbon, Carbon nanotubes, Diamonds

Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

Bias-Dependent Peltier Coefficient in Bipolar Devices

Kevin P. Pipe, Rajeev J. Ram, Ali Shakouri

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001

Paper No: IMECE2001/HTD-24396

DOI: https://doi.org/10.1115/IMECE2001/HTD-24396

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Topics: Cooling, Design, Diffusion (Physics), Heating, Microelectronic devices, Semiconductor lasers, Temperature, Thermoelectric cooling

Proceedings Papers

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

Kwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001

Paper No: IMECE2001/HTD-24393

DOI: https://doi.org/10.1115/IMECE2001/HTD-24393

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Topics: Imaging, Microscopy, Nanoscale phenomena, Coolers, Cooling, Superlattices, Temperature, Thermocouples, Microelectronic devices, Optoelectronic devices

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

2 3 4 5

NARROW

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

MEMS for Fluidic Controls

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

The Effect of Temperature and Humidity Exposure on Adhesion

Ceramic Tape-Based Meso Systems Technology

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

Design and Analysis of a Meso-Scale Refrigerator

Stress Relaxation of Gold/Polysilicon Layered MEMS Microstructures Subjected to Thermal Loading

Issues and Directions of MEMS Research for the Electronics Industry

The History of Heat Transfer

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Bias-Dependent Peltier Coefficient in Bipolar Devices

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

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