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Proceedings Papers

Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging

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Rahul Adhikari, Nathan Jackson
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144963
https://doi.org/10.1115/IMECE2024-144963
View Paper titled, Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging
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Topics: MEMS packaging, Microelectronic devices, Packaging, Microelectromechanical systems, Testing, Silicon, Silicones, Additive manufacturing, Biomedicine, Cavities
Proceedings Papers

On the Reliability Analysis of VLSI Chips When Subjected to Thermal Cycling

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Shahriar Jahanian, Jamshid Goshtasbi-G
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 121-129, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1353
https://doi.org/10.1115/IMECE1997-1353
View Paper titled, On the Reliability Analysis of VLSI Chips When Subjected to Thermal Cycling
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Topics: Circuits, Cooling, Event history analysis, Failure, Fracture (Materials), Fracture (Process), Mechanical structures, Microelectronic devices, Probability, Reliability
Proceedings Papers

Control of Thermal Deformations of Integrated Optical and Shape Memory Alloys Fibers

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Victor Birman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 133-139, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0727
https://doi.org/10.1115/IMECE1996-0727
View Paper titled, Control of Thermal Deformations of Integrated Optical and Shape Memory Alloys Fibers
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Topics: Deformation, Fibers, Shape memory alloys, Optical fiber, Shapes, Temperature, Design, Low temperature, Manufacturing, Microelectronic devices
Proceedings Papers

Development of a Micropump for Microelectronic Cooling

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C. Channy Wong, Douglas R. Adkins, Dahwey Chu
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 239-244, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1357
https://doi.org/10.1115/IMECE1996-1357
View Paper titled, Development of a Micropump for Microelectronic Cooling
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Topics: Cooling, Micropumps, Design, Pumps, Silicon, Microelectromechanical systems, Electrodes, Electrohydrodynamics, Fluids, Manufacturing
Proceedings Papers

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

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R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 131-140, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0783
https://doi.org/10.1115/IMECE1996-0783
View Paper titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Control algorithms, Finishes, Finite element methods, Fracture (Materials), Fracture (Process), Microelectronic devices
Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

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I. Mohammed, K. M. Liechti
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1232
https://doi.org/10.1115/IMECE1997-1232
View Paper titled, Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners
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Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)
Proceedings Papers

MEMS for Fluidic Controls

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Chih-Ming Ho, Yu-Chong Tai
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 27, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0934
https://doi.org/10.1115/IMECE1997-0934
View Paper titled, MEMS for Fluidic Controls
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Topics: Microelectromechanical systems, Sensors, Actuators, Circuits, Shear stress, Transducers, Computers, Integrated circuit fabrication, Micromachining, Artificial neural networks
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

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R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0493
https://doi.org/10.1115/IMECE1997-0493
View Paper titled, The Effect of Temperature and Humidity Exposure on Adhesion
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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

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Qazi S. Ilyas, Ephraim Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 81-88, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0816
https://doi.org/10.1115/IMECE1997-0816
View Paper titled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures
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Topics: Failure, Electronic packages, Microelectronic devices, Molding, Optical fiber, Structural analysis
Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

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Y. Feng, V. R. Raju, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0817
https://doi.org/10.1115/IMECE1997-0817
View Paper titled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs
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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)
Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

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Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1290
https://doi.org/10.1115/IMECE1998-1290
View Paper titled, Ceramic Tape-Based Meso Systems Technology
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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems
Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

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K. Verma, B. Han
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0434
https://doi.org/10.1115/IMECE1998-0434
View Paper titled, Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry
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Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography
Proceedings Papers

Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing

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Haruna Tada, Alexis R. Abramson, Ioannis N. Miaoulis, Peter Y. Wong, Patricia Nieva, Paul Zavracky
Proc. ASME. IMECE98, Heat Transfer: Volume 2 — Combustion and Radiation Heat Transfer, 93-98, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0623
https://doi.org/10.1115/IMECE1998-0623
View Paper titled, Effects of Surface Patterning in Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal Processing
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Topics: Rapid thermal processing, Thin films, Semiconductor wafers, Heating, Reflectance, Temperature, Absorption, Computer simulation, Energy gap, High temperature
Proceedings Papers

A Large Stroke, Nanometer Precision X-Y Stage for Lithography

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Lowell D. Jones, Jeffrey S. N. Paine
Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 89-94, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0942
https://doi.org/10.1115/IMECE1998-0942
View Paper titled, A Large Stroke, Nanometer Precision X-Y Stage for Lithography
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Topics: Lithography, Design, Heat, Actuators, Cables, Flexure mechanisms, Inertia (Mechanics), Innovation, Magnetic levitation, Microelectronic devices
Proceedings Papers

Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72

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K. N. Rainey, S. M. You
Proc. ASME. IMECE99, Heat Transfer: Volume 4, 245-253, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1125
https://doi.org/10.1115/IMECE1999-1125
View Paper titled, Pool Boiling Heat Transfer From Plain and Microporous, Square Pin Finned Surfaces in Saturated FC-72
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Topics: Heat transfer, Pool boiling, Critical heat flux, Nucleate boiling, Coating processes, Coatings, Fins, Atmospheric pressure, Bubbles, Density
Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

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Andrzej J. Przekwas, Zhijian Chen, Marek Turowski
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0308
https://doi.org/10.1115/IMECE1999-0308
View Paper titled, High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics
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Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics
Proceedings Papers

Design and Analysis of a Meso-Scale Refrigerator

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N. S. Ashraf, H. C. Carter, III, K. Casey, L. C. Chow, S. Corban, M. K. Drost, A. J. Gumm, Z. Hao, A. Q. Hasan, J. S. Kapat, L. Kramer, M. Newton, K. B. Sundaram, J. Vaidya, C. C. Wong, K. Yerkes
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 109-116, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1068
https://doi.org/10.1115/IMECE1999-1068
View Paper titled, Design and Analysis of a Meso-Scale Refrigerator
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Topics: Design, Compression, Engines, Motors, Capacitance, Compressors, Electromagnetic induction, Electronics, Heat, Microelectronic devices
Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

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Victor Adrian Chiriac, Tien -Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24382
https://doi.org/10.1115/IMECE2001/HTD-24382
View Paper titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability
Proceedings Papers

Bias-Dependent Peltier Coefficient in Bipolar Devices

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Kevin P. Pipe, Rajeev J. Ram, Ali Shakouri
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24396
https://doi.org/10.1115/IMECE2001/HTD-24396
View Paper titled, Bias-Dependent Peltier Coefficient in Bipolar Devices
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Topics: Cooling, Design, Diffusion (Physics), Heating, Microelectronic devices, Semiconductor lasers, Temperature, Thermoelectric cooling
Proceedings Papers

Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy

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Kwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24393
https://doi.org/10.1115/IMECE2001/HTD-24393
View Paper titled, Nanoscale Thermal Imaging of Thermionic Devices Using Scanning Thermal Microscopy
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Topics: Imaging, Microscopy, Nanoscale phenomena, Coolers, Cooling, Superlattices, Temperature, Thermocouples, Microelectronic devices, Optoelectronic devices