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Proceedings Papers

Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams

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Mu Chiao, Liwei Lin
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 75-80, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0942
https://doi.org/10.1115/IMECE1997-0942
View Paper titled, Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams
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Topics: Microactuators, Microbeams, Computers, Displacement, Image processing, Micromachining, Polysilicon, Thermoelasticity
Proceedings Papers

Blister-Like Local Buckling of Polysilicon Microbeams During Wet-Release

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Xin Zhang, Yitshak Zohar, Tong-Yi Zhang
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 379-384, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1272
https://doi.org/10.1115/IMECE1998-1272
View Paper titled, Blister-Like Local Buckling of Polysilicon Microbeams During Wet-Release
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Topics: Buckling, Microbeams, Polysilicon, Drying, Manufacturing, Stress
Proceedings Papers

Low-Cycle Fatigue in Aluminum Microbeams

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Richard P. Vinci
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 139, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1148
https://doi.org/10.1115/IMECE1998-1148
View Paper titled, Low-Cycle Fatigue in Aluminum Microbeams
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Topics: Aluminum, Bulk solids, Fatigue failure, Low cycle fatigue, Microbeams, Microelectromechanical systems, Plasticity, Tensile strength, Thin films
Proceedings Papers

A Numerical Hybrid Finite Element Model for Lattice Structures Using 3D/Beam Elements

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Ahmadali Tahmasebimoradi, Chetra Mang, Xavier Lorang
Proc. ASME. IMECE2021, Volume 2A: Advanced Manufacturing, V02AT02A061, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-69119
https://doi.org/10.1115/IMECE2021-69119
View Paper titled, A Numerical Hybrid Finite Element Model for Lattice Structures Using 3D/Beam Elements
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Topics: Finite element model, Microbeams, Junctions, Additive manufacturing, Deformation, Engineering simulation, Plasticity, Shapes, Simulation, Surface roughness
Proceedings Papers

Modal Interaction in a Levitation Force MEMS Based Resonator

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Mohammadreza Zamanzadeh, H. G. E. Meijer, Ilgar Jafarsadeghi-Pournaki, H. M. Ouakad
Proc. ASME. IMECE2021, Volume 7B: Dynamics, Vibration, and Control, V07BT07A064, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-72755
https://doi.org/10.1115/IMECE2021-72755
View Paper titled, Modal Interaction in a Levitation Force MEMS Based Resonator
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Topics: Levitation, Microelectromechanical systems, Resonance, Microbeams, Electrodes, Bifurcation, Design, Attractors, Cantilevers, Eigenvalues
Proceedings Papers

Investigations Into the Linear Coupling Between Symmetric and Anti-Symmetric Modes of V-Shaped MEMS Resonators Under Electrostatic Perturbation

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Nouha Alcheikh, Hassen M. Ouakad, Sofiane Ben Mbarek, Mohammad I. Younis
Proc. ASME. IMECE2021, Volume 7A: Dynamics, Vibration, and Control, V07AT07A029, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-73535
https://doi.org/10.1115/IMECE2021-73535
View Paper titled, Investigations Into the Linear Coupling Between Symmetric and Anti-Symmetric Modes of V-Shaped MEMS Resonators Under Electrostatic Perturbation
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Topics: Arches, Electrodes, Microbeams, Microelectromechanical systems, Silicon, Vibration
Proceedings Papers

Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing

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Daphne Joachim, Liwei Lin
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 37-42, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0243
https://doi.org/10.1115/IMECE1999-0243
View Paper titled, Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing
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Topics: Manufacturing, Microelectromechanical systems, Polysilicon, Microbeams, Finite element analysis, Sealing (Process), Silicon, Temperature
Proceedings Papers

Novel Bulk Acoustic Wave Hammer to Determinate the Dynamic Response of Microstructures Using Pulsed Broad Bandwidth Ultrasonic Transducers

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Wen-Pin Lai, Yi-Ping Ho, Weileun Fang
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 199-206, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23829
https://doi.org/10.1115/IMECE2001/MEMS-23829
View Paper titled, Novel Bulk Acoustic Wave Hammer to Determinate the Dynamic Response of Microstructures Using Pulsed Broad Bandwidth Ultrasonic Transducers
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Topics: Acoustics, Dynamic response, Hammers, Microelectromechanical systems, Ultrasonic transducers, Waves, Damping, Excitation, Microbeams, Mode shapes
Proceedings Papers

Pirani Pressure Sensor With Distributed Temperature Sensing

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J. J. van Baar, R. J. Wiegerink, T. S. J. Lammerink, G. J. M. Krijnen, M. Elwenspoek
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 115-122, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23817
https://doi.org/10.1115/IMECE2001/MEMS-23817
View Paper titled, Pirani Pressure Sensor With Distributed Temperature Sensing
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Topics: Microelectromechanical systems, Pressure sensors, Temperature, Microbeams, Pressure, Temperature distribution, Thermal conductivity, Heat losses, Heat sinks, Resistors
Proceedings Papers

A Novel Testing Machine for Characterization of Materials for MEMS Applications

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Sauri Gudlavalleti, Lallit Anand
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 371-376, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23854
https://doi.org/10.1115/IMECE2001/MEMS-23854
View Paper titled, A Novel Testing Machine for Characterization of Materials for MEMS Applications
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Topics: Machinery, Materials characterization, Microelectromechanical systems, Testing, Thin films, Displacement, Aluminum, Copper foil, Fibers, Force measurement
Proceedings Papers

Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler

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Da-Jeng Yao, Gang Chen, Chang-Jin “CJ” Kim
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 719-722, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23901
https://doi.org/10.1115/IMECE2001/MEMS-23901
View Paper titled, Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler
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Topics: Bonding, Low temperature, Microelectromechanical systems, Thermoelectric coolers, Cooling, Manufacturing, Microbeams, Silicon, Flow (Dynamics), High temperature
Proceedings Papers

A Macromodel for Dynamic Simulation of Microelectromechanical Systems

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W. Z. Lin, K. H. Lee, S. P. Lim, P. Lu
Proc. ASME. IMECE2000, Dynamics, Acoustics and Simulations, 155-162, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2194
https://doi.org/10.1115/IMECE2000-2194
View Paper titled, A Macromodel for Dynamic Simulation of Microelectromechanical Systems
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Topics: Microelectromechanical systems, Simulation, Computation, Degrees of freedom, Dynamics (Mechanics), Finite difference methods, Microbeams, Signals
Proceedings Papers

Nonlinear Vibration Analysis of a Fractional Viscoelastic Euler-Bernoulli Microbeam

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Firooz Bakhtiari-Nejad, Ehsan Loghman, Mostafa Pirasteh
Proc. ASME. IMECE2018, Volume 11: Acoustics, Vibration, and Phononics, V011T01A017, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-87061
https://doi.org/10.1115/IMECE2018-87061
View Paper titled, Nonlinear Vibration Analysis of a Fractional Viscoelastic Euler-Bernoulli Microbeam
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Topics: Microbeams, Nonlinear vibration, Resonance, Differential equations, Excitation, Frequency response, Galerkin method, Partial differential equations, Strain gradient
Proceedings Papers

Static and Dynamic Amplification Using Strong Mechanical Coupling

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Saad Ilyas, Nizar Jaber, Mohammad I. Younis
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A026, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66104
https://doi.org/10.1115/IMECE2016-66104
View Paper titled, Static and Dynamic Amplification Using Strong Mechanical Coupling
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Topics: Dynamics (Mechanics), Microbeams, Resonance, Sensors, Signal to noise ratio, Signals, Stress, Switches
Proceedings Papers

Nonlinear Structural Behavior of Double-Layers Based MEMS Actuator

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Abdulrahman Al-oufi, Hassen M. Ouakad, Mohammad Tausiff Firaque
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A016, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66353
https://doi.org/10.1115/IMECE2016-66353
View Paper titled, Nonlinear Structural Behavior of Double-Layers Based MEMS Actuator
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Topics: Actuators, Microelectromechanical systems, Microbeams, Eigenvalues, Mode shapes, Modeling, Stress, Switches
Proceedings Papers

Static Response of Microbeams due to Capillary and Electrostatic Forces

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Ahmad M. Bataineh, Hassen M. Ouakad, Mohammad I. Younis
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A012, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52037
https://doi.org/10.1115/IMECE2015-52037
View Paper titled, Static Response of Microbeams due to Capillary and Electrostatic Forces
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Topics: Microbeams, Electrodes, Stability, Fluids, Manufacturing, Switches, Water, Cantilevers, Chemical etching, Condensation
Proceedings Papers

Static Pull-In Analysis of an Electrically Actuated Piezoelectric Viscoelastic Microbeam

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Changping Chen, Shoujian Li, Liming Dai
Proc. ASME. IMECE2013, Volume 4B: Dynamics, Vibration and Control, V04BT04A016, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63574
https://doi.org/10.1115/IMECE2013-63574
View Paper titled, Static Pull-In Analysis of an Electrically Actuated Piezoelectric Viscoelastic Microbeam
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Topics: Microbeams, Stress, Numerical analysis, Piezoelectricity
Proceedings Papers

Structural Behavior of Microbeams Actuated by Out-of-Plane Electrostatic Fringing-Fields

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Hassen M. Ouakad
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A014, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65770
https://doi.org/10.1115/IMECE2013-65770
View Paper titled, Structural Behavior of Microbeams Actuated by Out-of-Plane Electrostatic Fringing-Fields
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Topics: Microbeams, Electrodes, Finite element methods, Microelectromechanical systems, Stress, Eigenvalues, Fittings, Gates (Closures), Microactuators
Proceedings Papers

Indenter Tip Dependence in the Determination of Elastic Modulus in Polymers

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Seyed Hamid Reza Sanei, F. Alisafaei, Chung-Souk Han
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A079, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64831
https://doi.org/10.1115/IMECE2013-64831
View Paper titled, Indenter Tip Dependence in the Determination of Elastic Modulus in Polymers
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Topics: Elastic moduli, Polymers, Deformation, Plasma desorption mass spectrometry, Dislocations, Geometry, Mechanical properties, Mechanical testing, Metals, Microbeams
Proceedings Papers

Novel Low Cost Powerless MEMS Based Ossicular System

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Adarsh Venkataraman Ganesan, Varun Das Ramanujam Ramdoss, Deepan Kishore Kumar, S. Swaminathan
Proc. ASME. IMECE2013, Volume 15: Safety, Reliability and Risk; Virtual Podium (Posters), V015T16A024, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66341
https://doi.org/10.1115/IMECE2013-66341
View Paper titled, Novel Low Cost Powerless MEMS Based Ossicular System
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Topics: Microelectromechanical systems, Sound pressure, Acoustics, Actuators, Aircraft, Chain, Design, Displacement, Ear, Electricity (Physics)