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Proceedings Papers

Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat

Spencer Miesner, Gabriella Shibata, Neyda Bautista, Kieran Wolk, Ben Furst, Takuro Daimaru, Eric Sunada, Scott Roberts, John Bellardo, Jim Kuo
Proc. ASME. IMECE2023, Volume 10: Heat Transfer and Thermal Engineering, V010T11A014, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114220
https://doi.org/10.1115/IMECE2023-114220
View Paper titled, Thermal Orbital Spacecraft Analysis of an Additively Manufactured Deployable Radiator Oscillating Heat Pipes (AMDROHP) CubeSat
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Topics: Additive manufacturing, Heat pipes, Oscillations, Space vehicles, Temperature, Engineering simulation, Simulation, Electronics, Design, Heat
Proceedings Papers

Feedback Guided Self Training Balance Equipment for Physical Therapy and Elite Athlete Use

Akin Tatoglu, Katharine Wilson, Alexandra Chabot, Jarel Marcelin, Claudio Campana, Mary Cater Arico
Proc. ASME. IMECE2023, Volume 5: Biomedical and Biotechnology, V005T06A055, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112832
https://doi.org/10.1115/IMECE2023-112832
View Paper titled, Feedback Guided Self Training Balance Equipment for Physical Therapy and Elite Athlete Use
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Topics: Design, Engineering prototypes, Errors, Feedback, Lumber, Measurement units and standards, Muscle, Patient treatment, User interfaces, Wounds
Proceedings Papers

Design of Low-Level Hardware for a Multi-Layered Control Architecture

Madeline Kogelis, Zachary J. Fuge, Connor W. Herron, Bhaben Kalita, Alexander Leonessa
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A015, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94614
https://doi.org/10.1115/IMECE2022-94614
View Paper titled, Design of Low-Level Hardware for a Multi-Layered Control Architecture
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Topics: Actuators, Design, Hardware, Motors, Sensors, Control equipment, Filters, Robotics, Circuits, Computer software
Proceedings Papers

Outdoor System for Synchronous Triggering of Multiple Scientific Cameras Using Direct-Access GNSS Time Transfer

Marko Bjelotomic, Prashanth Subramaniam, Oginne Rashid Lapuz, Khuloud Almaeeni, Mohammed Minhas Anzil, Sidi Ahmed Bendoukha, Luis Pomares
Proc. ASME. IMECE2022, Volume 4: Biomedical and Biotechnology; Design, Systems, and Complexity, V004T06A015, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95393
https://doi.org/10.1115/IMECE2022-95393
View Paper titled, Outdoor System for Synchronous Triggering of Multiple Scientific Cameras Using Direct-Access GNSS Time Transfer
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Topics: Atomic clocks, Data storage systems, Impulse (Physics), Lumber, Navigation, Noise (Sound), Satellites, Sensors, Signals
Proceedings Papers

Open Architecture Modular Tool Kit for Motion and Machining Process Control

N. A. Erol, Y. Altintas
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 15-22, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1070
https://doi.org/10.1115/IMECE1997-1070
View Paper titled, Open Architecture Modular Tool Kit for Motion and Machining Process Control
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Topics: Computer numerical control machine tools, Machining, Process control, Robots, Computers, Lumber, Machine tools, Computer software, Control systems, Sensors
Proceedings Papers

Use of Calf Lumbar Spine Models for the Test of Spinal Instrumentation

Tae-Hong Lim, Jason C. Eck, Lee H. Riley, III, Hyroyuki Yoshida
Proc. ASME. IMECE97, Advances in Bioengineering, 241-242, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0318
https://doi.org/10.1115/IMECE1997-0318
View Paper titled, Use of Calf Lumbar Spine Models for the Test of Spinal Instrumentation
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Topics: Instrumentation, Lumbar spine, Biomechanics, Human spine, Lumber, Statistical analysis, Stiffness, Testing
Proceedings Papers

The Effects of Channel Height on Flow Boiling of Liquid Nitrogen

W. Lu, L. C. Chow
Proc. ASME. IMECE98, Advanced Energy Systems, 495-502, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0878
https://doi.org/10.1115/IMECE1998-0878
View Paper titled, The Effects of Channel Height on Flow Boiling of Liquid Nitrogen
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Topics: Boiling, Flow (Dynamics), Nitrogen, Critical heat flux, Heat transfer, Cooling, Heat, Lumber, Printed circuit boards, Design
Proceedings Papers

Empirical Modeling of Launch-to-LEO Accelerations for Mechanical Characterization of Organoids

Peter Violante, Nicholas Blischak, William McLamb, Twyman Clements, Erik Viirre, Maziar Ghazinejad
Proc. ASME. IMECE2021, Volume 7B: Dynamics, Vibration, and Control, V07BT07A036, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-72095
https://doi.org/10.1115/IMECE2021-72095
View Paper titled, Empirical Modeling of Launch-to-LEO Accelerations for Mechanical Characterization of Organoids
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Topics: Circuits, Design, Dynamics (Mechanics), Failure, Lumber, Mechanical behavior, Microfluidics, Modeling, Rockets, Rotation
Proceedings Papers

Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System

Ismail Fidan, Russell P. Kraft, Stephen J. Derby
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 83-90, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0921
https://doi.org/10.1115/IMECE1999-0921
View Paper titled, Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System
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Topics: Circuits, Density, Design, Electronics, End effectors, Lasers, Lumber, Manufacturing, Printed circuit boards, Robotics
Proceedings Papers

Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems

Ruijun Chen, Daniel F. Baldwin
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 53-58, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0917
https://doi.org/10.1115/IMECE1999-0917
View Paper titled, Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems
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Topics: Circuits, Manufacturing, Tooling, Fixturing, Printed circuit boards, Design, Flexible electronics, Lumber, Printing, Reflow soldering
Proceedings Papers

In-Situ Continuous Process for Bonding Glass-Fiber Reinforced Polypropylene to Wood

Karthik Ramani, Michael Smith, Heming Dai
Proc. ASME. IMECE99, Polymeric Systems, 29-43, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1202
https://doi.org/10.1115/IMECE1999-1202
View Paper titled, In-Situ Continuous Process for Bonding Glass-Fiber Reinforced Polypropylene to Wood
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Topics: Anisotropy, Bonding, Composite materials, Failure mechanisms, Fibers, Glass, Glass fibers, Heating, Lumber, Polypropylene fibers
Proceedings Papers

Natural Convection Heat Transfer in a Vertical Air Layer Partitioned Into Cubical Enclosures of Finite Wall Thermal Conductivity and Thickness

Y. Yamaguchi, Y. Asako
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 191-197, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0985
https://doi.org/10.1115/IMECE1999-0985
View Paper titled, Natural Convection Heat Transfer in a Vertical Air Layer Partitioned Into Cubical Enclosures of Finite Wall Thermal Conductivity and Thickness
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Topics: Heat transfer, Natural convection, Thermal conductivity, Wall thickness, Boundary-value problems, Doors, Lumber, Temperature, Temperature distribution, Thermal insulation
Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24389
https://doi.org/10.1115/IMECE2001/HTD-24389
View Paper titled, Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module
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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software
Proceedings Papers

Effective Thermal Conductivity of Compressed Woods

Y. Asako, H. Nishimura, H. Kamikoga, Y. Yamaguchi
Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 303-308, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1488
https://doi.org/10.1115/IMECE2000-1488
View Paper titled, Effective Thermal Conductivity of Compressed Woods
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Topics: Thermal conductivity, Lumber, Wood products, Compression
Proceedings Papers

Relationship Between the Frictional Shear Stresses and the Normal Pressure on the Buttocks While Lying on a Spine Board

Vinay Kumar Pallerla, Mohamed Samir Hefzy
Proc. ASME. IMECE2019, Volume 3: Biomedical and Biotechnology Engineering, V003T04A056, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11814
https://doi.org/10.1115/IMECE2019-11814
View Paper titled, Relationship Between the Frictional Shear Stresses and the Normal Pressure on the Buttocks While Lying on a Spine Board
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Topics: Pressure, Shear stress, Skin, Bone, Cushioning materials, Finite element analysis, Lumber, Muscle, Body systems and structures, Computer software
Proceedings Papers

Borehole Temperature Modelling in High Temperature Drilling Environment Based on Heat Transfer Laws

Abhijeet D. Chodankar, Cheng-Xian Lin
Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A075, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-10085
https://doi.org/10.1115/IMECE2019-10085
View Paper titled, Borehole Temperature Modelling in High Temperature Drilling Environment Based on Heat Transfer Laws
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Topics: Drilling, Heat transfer, High temperature, Modeling, Temperature, Fluids, Drill strings, Composite materials, Cylinders, Stability
Proceedings Papers

Phantom-Element Technique for Periodic Deformation Analysis of Plain Fabrics Using LS-DYNA

Hikaru Miyaki, Atsushi Sakuma
Proc. ASME. IMECE2018, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T12A050, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-87459
https://doi.org/10.1115/IMECE2018-87459
View Paper titled, Phantom-Element Technique for Periodic Deformation Analysis of Plain Fabrics Using LS-DYNA
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Topics: Deformation, Phantoms, Textiles, Stress, Periodic structures, Computer software, Finite element analysis, Boundary-value problems, Computation, Design methodology
Proceedings Papers

“To the Boards”: Team-Based Design for Student-Centered Learning

David D. Gill, Jeffrey L. Newcomer
Proc. ASME. IMECE2017, Volume 5: Education and Globalization, V005T06A007, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-70571
https://doi.org/10.1115/IMECE2017-70571
View Paper titled, “To the Boards”: Team-Based Design for Student-Centered Learning
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Topics: Design, Lumber, Students, Teams, Tooling, Feedback, Engineering design, Engineering disciplines, Manufacturing engineering, Performance
Proceedings Papers

Factors Influencing Blast Attenuation on Walls With Foamed Concrete Boards

Yijian Shi
Proc. ASME. IMECE2016, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis, V009T12A012, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65863
https://doi.org/10.1115/IMECE2016-65863
View Paper titled, Factors Influencing Blast Attenuation on Walls With Foamed Concrete Boards
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Topics: Concretes, Lumber, Pressure, Density, Design, Simulation results, Finite element analysis, Boundary-value problems, Delays, Stress
Proceedings Papers

Effects of Linear Hysteric Material Damping and Shock Pulse Shapes for Uniform Board Response

Sharan Kallolimath, Jiang Zhou
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A049, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-68119
https://doi.org/10.1115/IMECE2016-68119
View Paper titled, Effects of Linear Hysteric Material Damping and Shock Pulse Shapes for Uniform Board Response
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Topics: Damping, Shapes, Shock (Mechanics), Stress, Finite element analysis, Stiffness, Computer simulation, Interpolation, Lumber, Solder joints