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Proceedings Papers

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials

Minfu Lu, Sheng Liu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 87-92, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0894
https://doi.org/10.1115/IMECE1996-0894
View Paper titled, A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
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Topics: Electronic packaging, Fatigue, Thermomechanics, Alloys, Calibration, Copper, Lead-free solders, Machinery, Testing, Wire
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1237
https://doi.org/10.1115/IMECE1997-1237
View Paper titled, Thermal Mechanical Properties of Two Solder Alloys
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24728
https://doi.org/10.1115/IMECE2001/EPP-24728
View Paper titled, Creep Behavior of PB-Free Solders
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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds
Proceedings Papers

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization

Xing Jia Huang, Shi-Wei Ricky Lee, Wan Sze Tse
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 167-171, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2259
https://doi.org/10.1115/IMECE2000-2259
View Paper titled, Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization
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Topics: Ceramics, Lead-free solders, Shear strength
Proceedings Papers

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2249
https://doi.org/10.1115/IMECE2000-2249
View Paper titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Lead-free solders, Printed circuit boards, Semiconductor wafers, Alloys, Shear (Mechanics), Shear stress, Solder joints, Solders, Constitutive equations
Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-12109
https://doi.org/10.1115/IMECE2019-12109
View Paper titled, Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material
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Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components
Proceedings Papers

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53751
https://doi.org/10.1115/IMECE2015-53751
View Paper titled, Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature
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Topics: High temperature, Mechanical behavior, Viscoplasticity, Solders, Temperature, Deformation, Operating temperature, Storage, Electronics, Constitutive equations
Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Pradeep Lall, Di Zhang, Vikas Yadav
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39518
https://doi.org/10.1115/IMECE2014-39518
View Paper titled, High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature
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Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging
Proceedings Papers

Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling

Hohyung Lee, Ruiyang Liu, Seungbae Park, Jae Kwak
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A071, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38661
https://doi.org/10.1115/IMECE2014-38661
View Paper titled, Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling
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Topics: Creep, Lead-free solders, Modeling, Solders, Displacement, Ball-Grid-Array packaging, Finite element analysis, Electronic packages, Mechanical behavior, Mechanical properties
Proceedings Papers

High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A075, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66820
https://doi.org/10.1115/IMECE2013-66820
View Paper titled, High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

Yao Yao
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88629
https://doi.org/10.1115/IMECE2012-88629
View Paper titled, Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact
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Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)
Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89655
https://doi.org/10.1115/IMECE2012-89655
View Paper titled, Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly
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Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter
Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89799
https://doi.org/10.1115/IMECE2012-89799
View Paper titled, Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation
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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages
Proceedings Papers

Printed Circuit Board Pad Crater Test Methods and Sample Design

Todd Embree, Deassy Novita, Gary Long, Satish Parupalli
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 989-993, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-85562
https://doi.org/10.1115/IMECE2012-85562
View Paper titled, Printed Circuit Board Pad Crater Test Methods and Sample Design
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Topics: Design, Printed circuit boards, Damage, Dimensions, Lead-free solders, Manufacturing, Temperature
Proceedings Papers

Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 491-505, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-93059
https://doi.org/10.1115/IMECE2012-93059
View Paper titled, Mechanical Behavior of Sn1Ag0.5Cu and Sn3Ag0.5Cu Alloys at High Strain Rates
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Topics: Alloys, Mechanical behavior, Shock (Mechanics), Vibration, Electronics, Solders, Failure, Stress, Damage, High temperature
Proceedings Papers

Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation

Yao Yao, Jared Fry, Morris Fine, Leon Keer
Proc. ASME. IMECE2012, Volume 3: Design, Materials and Manufacturing, Parts A, B, and C, 1275-1284, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88634
https://doi.org/10.1115/IMECE2012-88634
View Paper titled, Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation
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Topics: Intermetallic compounds, Lead-free solders, Numerical analysis, Solders, Fracture (Materials), Thermal conductivity, Tin, Electric current, Electrical conductivity, Materials properties
Proceedings Papers

Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology

Weidong Xie, Mudasir Ahmad
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1011-1021, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87734
https://doi.org/10.1115/IMECE2012-87734
View Paper titled, Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology
Open the PDF for Inverse Derivation of Constants for the Constitutive Equation and Fatigue Model of Pb-Free Solder Joints Based on Experiment Results, Finite Element Simulation and Virtual Optimization Methodology in another window
Topics: Fatigue, Finite element analysis, Lead-free solders, Optimization, Simulation, Solders, Ball-Grid-Array packaging, Creep, Fatigue life, Reliability
Proceedings Papers

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 941-948, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63147
https://doi.org/10.1115/IMECE2011-63147
View Paper titled, Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique
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Topics: Ball-Grid-Array packaging, Inspection, Lasers, Lead-free solders, Ultrasound, Solders, X-rays, Interferometers, Solder joints, Transients (Dynamics)
Proceedings Papers

Unified Creep Plasticity Damage (UCPD) Model for Solder

Michael Neilsen, Paul Vianco
Proc. ASME. IMECE2011, Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation, 497-504, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65387
https://doi.org/10.1115/IMECE2011-65387
View Paper titled, Unified Creep Plasticity Damage (UCPD) Model for Solder
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Topics: Creep, Damage, Plasticity, Solders, Fracture (Materials), Cycles, Finite element analysis, Fatigue, Solder joints, Computer simulation