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Proceedings Papers

T* ε Integral Analysis of Aluminum Specimens

Yoshika Omori, Albert S. Kobayashi, Hiroshi Okada, Satya N. Atluri, Paul Tan
Proc. ASME. IMECE96, Aerospace, 281-288, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0637
https://doi.org/10.1115/IMECE1996-0637
View Paper titled, T* ε Integral Analysis of Aluminum Specimens
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Topics: Aluminum, Fracture (Materials), Displacement, Finite element analysis, Fracture toughness, Interferometry, Materials properties, Simulation
Proceedings Papers

Simultaneous Three-Wavelength Interferometry for Head/Tape Spacing Measurement

Eric Baugh, Frank E. Talke, James Swenson
Proc. ASME. IMECE96, 7th International Symposium on Information Storage and Processing Systems, 53-57, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1067
https://doi.org/10.1115/IMECE1996-1067
View Paper titled, Simultaneous Three-Wavelength Interferometry for Head/Tape Spacing Measurement
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Topics: Interferometry, Wavelength, Algorithms, Instrumentation, Pressure, Simulation
Proceedings Papers

Polarization Switching for Ferroelectric Materials

S. B. Park, S. S. Park, G. P. Carman, H. T. Hahn
Proc. ASME. IMECE96, Aerospace, 603-612, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0675
https://doi.org/10.1115/IMECE1996-0675
View Paper titled, Polarization Switching for Ferroelectric Materials
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Topics: Polarization (Electricity), Polarization (Light), Polarization (Waves), Fatigue, Interferometry, Microcracks, Piezoelectric ceramics, Shear (Mechanics)
Proceedings Papers

Micro-Cavity Fiber Optic Sensors Embedded Into Laminated Composites for Impact and Impact-Induced Damage Detection

Chia-Chen Chang, Jim Sirkis
Proc. ASME. IMECE96, Aerospace, 655-662, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0680
https://doi.org/10.1115/IMECE1996-0680
View Paper titled, Micro-Cavity Fiber Optic Sensors Embedded Into Laminated Composites for Impact and Impact-Induced Damage Detection
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Topics: Cavities, Composite materials, Damage, Fiber optic sensors, Sensors, Stress, Strain gages, X-rays, Aluminum plate, Copper
Proceedings Papers

Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling

Jiansen Zhu, Daqing Zou, Sheng Liu, Jim Benson
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 141-148, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0728
https://doi.org/10.1115/IMECE1996-0728
View Paper titled, Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling
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Topics: Finite element analysis, High temperature, Interferometry, Modeling, Cooling, Finite element model, Cross section (Physics), Delamination, Diffraction gratings, Temperature
Proceedings Papers

Constraint Fracture in Simulated Weldments

D. D. Anderson, J. H. Jackson, J. S. Epstein, S. Ganti, D. M. Parks
Proc. ASME. IMECE96, Aerospace, 241-249, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0633
https://doi.org/10.1115/IMECE1996-0633
View Paper titled, Constraint Fracture in Simulated Weldments
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Topics: Fracture (Materials), Titanium, Stress, Deformation, Diffusion (Physics), Elastic moduli, Finite element methods, Flow (Dynamics), Hydrostatics, Interferometry
Proceedings Papers

Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole

Fan Yang, C. L. Chow, H. Eliot Fang
Proc. ASME. IMECE96, Aerospace, 805-813, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0697
https://doi.org/10.1115/IMECE1996-0697
View Paper titled, Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole
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Topics: Damage, Epoxy adhesives, Epoxy resins, Graphite, Laminates, Composite materials, Failure, Fibers, Constitutive equations, Damage mechanics
Proceedings Papers

Surface Analysis of Zirconia-Toughened Alumina Lapped With Polycrystalline Diamond Powders

Ioan D. Marinescu, Marc D. Turco
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 299-303, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0798
https://doi.org/10.1115/IMECE1996-0798
View Paper titled, Surface Analysis of Zirconia-Toughened Alumina Lapped With Polycrystalline Diamond Powders
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Topics: Diamonds, Finishes, Wear, Pressure, Deformation, Fracture (Materials), Fracture (Process), Grinding, Interferometry, Scanning electron microscopy
Proceedings Papers

Combined Concentration and Temperature-Induced Marangoni Convection in a Binary Mixture

Yuji Suzuki, Suguru Noguchi, Jon P. Longtin, Kunio Hijikata
Proc. ASME. IMECE96, Heat Transfer: Volume 3 — Experimental Studies in Multiphase Flow; Multiphase Flow in Porous Media; Experimental Multiphase Flows and Numerical Simulation of Two-Phase Flows; Fundamental Aspects of Experimental Methods, 77-83, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0096
https://doi.org/10.1115/IMECE1996-0096
View Paper titled, Combined Concentration and Temperature-Induced Marangoni Convection in a Binary Mixture
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Topics: Convection, Temperature, Ethanol, Flow (Dynamics), Water, Atmospheric pressure, Drying, Evaporation, Interferometry, Solidification
Proceedings Papers

Effects of Acoustic Atomization on Combustion Emissions

Charles A. Cook, S. Rao Charagundla, Cary Presser, John L. Dressler, Ashwani K. Gupta
Proc. ASME. IMECE96, Heat Transfer: Volume 4 — Natural Convection Within a Horizontal Circular Cylinder Heated From Below and Cooled From Above; Numerical Methods for Coupled Fluid-Thermal-Structural Interaction; Thermal Analysis in Waste Processing and Disposal; Heat Transfer in Fire and Combustion Systems, 233-241, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0185
https://doi.org/10.1115/IMECE1996-0185
View Paper titled, Effects of Acoustic Atomization on Combustion Emissions
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Topics: Acoustics, Combustion, Density, Drops, Emissions, Flames, Fourier transform infrared spectroscopy, Fuels, Interferometry, Nitrogen oxides
Proceedings Papers

Mathematical Modeling of a Piezo-Actuated Cantilever Beam With Interferometer Feedback

Jordan David Kochavi, Siyuan Xing
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A100, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95819
https://doi.org/10.1115/IMECE2022-95819
View Paper titled, Mathematical Modeling of a Piezo-Actuated Cantilever Beam With Interferometer Feedback
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Topics: Cantilever beams, Feedback, Interferometers, Interferometry, Lasers, Modeling, Vibration analysis, Motion control, Discrete systems, Dynamic systems
Proceedings Papers

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Qing Wang, Ming-Liang Du, Fu-Pen Chiang
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 459-465, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0746
https://doi.org/10.1115/IMECE1997-0746
View Paper titled, Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load
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Topics: Fracture (Materials), Micromechanics (Engineering), Steel, Stress, Fatigue, Deformation, Displacement, Carbon steel, Crack propagation, Cycles
Proceedings Papers

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

C. L. Chow, Fan Yang, H. Eliot Fang
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 223-233, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0668
https://doi.org/10.1115/IMECE1997-0668
View Paper titled, Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Damage, Failure, Fibers, Constitutive equations, Anisotropy
Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1230
https://doi.org/10.1115/IMECE1997-1230
View Paper titled, Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields
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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages
Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1227
https://doi.org/10.1115/IMECE1997-1227
View Paper titled, Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling
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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation
Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0505
https://doi.org/10.1115/IMECE1997-0505
View Paper titled, Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load
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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density
Proceedings Papers

Improving the Accuracy of Microscopic Laser Interferometry System for Precision Surface Measurement by Integrated Scanning Motions

Kee S. Moon, Yiding Wang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 209-215, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1094
https://doi.org/10.1115/IMECE1997-1094
View Paper titled, Improving the Accuracy of Microscopic Laser Interferometry System for Precision Surface Measurement by Integrated Scanning Motions
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Topics: Interferometry, Lasers, Resolution (Optics), Computer simulation, Design, Diffraction patterns, Instrumentation, Magnification, Measurement systems, Surface texture
Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1118
https://doi.org/10.1115/IMECE1997-1118
View Paper titled, Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density