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Proceedings Papers

Monatomic and Polyatomic Gas Flow Through Uniform Microchannels

Jack C. Shih, Chih-Ming Ho, Jianqiang Liu, Yu-Chong Tai
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 197-203, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1353
https://doi.org/10.1115/IMECE1996-1353
View Paper titled, Monatomic and Polyatomic Gas Flow Through Uniform Microchannels
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Topics: Gas flow, Microchannels, Flow (Dynamics), Boundary-value problems, Data acquisition systems, Dimensions, Gases, Helium, Integrated circuits, Navier-Stokes equations
Proceedings Papers

A Method for Selecting Electronic Manufacturing Processes Based on Cost Factors

Sammy G. Shina, Anil Saigal
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 757-769, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0846
https://doi.org/10.1115/IMECE1996-0846
View Paper titled, A Method for Selecting Electronic Manufacturing Processes Based on Cost Factors
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Topics: Manufacturing, Design, Algorithms, Electronic circuits, Integrated circuits, Printed circuit boards, Tooling
Proceedings Papers

A Framework for Logistics System Metrics

Jill E. Byers, Thomas L. Landers, Steve Anderson
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 773-781, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0847
https://doi.org/10.1115/IMECE1996-0847
View Paper titled, A Framework for Logistics System Metrics
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Topics: Integrated circuits, Logistics, Materials handling, Stress, Tradeoffs, Transportation systems
Proceedings Papers

Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System

Edward S. Kolesar, Rocky R. Reston
Proc. ASME. IMECE96, Engineering Systems, 11-17, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0869
https://doi.org/10.1115/IMECE1996-0869
View Paper titled, Design and Fabrication of the Fundamental Components Integrated to Realize a Functional Silicon Micromachined Gas Chromatography System
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Topics: Design, Gas chromatography, Manufacturing, Micromachining, Silicon, Nitrogen, Sensors, Circuits, Ejectors, Borosilicate glasses
Proceedings Papers

Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits

Nickolaos Strifas, Aris Christou
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 109-114, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0897
https://doi.org/10.1115/IMECE1996-0897
View Paper titled, Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits
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Topics: Flip-chip, Flip-chip devices, Integrated circuits, Polymers, Anisotropy, Ceramics, Finite element analysis, Heat, Simulation results, Stress
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

Semiconductor Deposition Profile Simulation Using Direct Simulation Monte Carlo Method

Masato Ikegawa, Jun’ichi Kobayashi, Morihisa Maruko
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 235-242, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1051
https://doi.org/10.1115/IMECE1996-1051
View Paper titled, Semiconductor Deposition Profile Simulation Using Direct Simulation Monte Carlo Method
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Topics: Monte Carlo methods, Semiconductors (Materials), Simulation, Boundary-value problems, Pressure, Sputter deposition, Chemical vapor deposition, Collisions (Physics), Dimensions, Gas flow
Proceedings Papers

Low-Cost Portable High-Speed Data Logging

Colton Kerr, John Rogers
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A046, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94016
https://doi.org/10.1115/IMECE2022-94016
View Paper titled, Low-Cost Portable High-Speed Data Logging
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Topics: Aircraft, Bridges (Structures), Data acquisition, Data acquisition systems, Design, Engineering prototypes, Flight, Gages, Hammers, Hardware
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0818
https://doi.org/10.1115/IMECE1997-0818
View Paper titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0819
https://doi.org/10.1115/IMECE1997-0819
View Paper titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Jagannath Raghavan, Muhammad M. Rahman
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 337-346, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0859
https://doi.org/10.1115/IMECE1997-0859
View Paper titled, Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board
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Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction
Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1220
https://doi.org/10.1115/IMECE1997-1220
View Paper titled, Advances in Stress Test Chips
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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1213
https://doi.org/10.1115/IMECE1997-1213
View Paper titled, The Recommended Geometry for Laminar Microchannel Heat Sinks
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Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments
Proceedings Papers

Utilization of Standard CMOS Layers for Microchannels

Angela Rasmussen, Laurie E. Locascio, Michael Gaitan, Mona E. Zaghloul
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 407-411, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1277
https://doi.org/10.1115/IMECE1998-1277
View Paper titled, Utilization of Standard CMOS Layers for Microchannels
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Topics: Complementary metal oxide semiconductors, Microchannels, Micromachining, Actuators, Electronics, Integrated circuits, Metals, Sensors
Proceedings Papers

A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control

Krishnan Nandakumar, Allen G. Parr, Geon Hahm, Michael A. Huff, Stephen M. Phillips
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 139-143, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1234
https://doi.org/10.1115/IMECE1998-1234
View Paper titled, A Smart Shape Memory Alloy Actuated Microvalve With Feedback Control
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Topics: Feedback, Shape memory alloys, Valves, Flow (Dynamics), Flow sensors, Micromachining, Air flow, Control equipment, Electronics, Fluids
Proceedings Papers

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

K. Kurabayashi, M. Asheghi, M. N. Touzelbaev, K. E. Goodson
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 71-81, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0431
https://doi.org/10.1115/IMECE1998-0431
View Paper titled, Thermal Characterization of Anisotropic Polymer Films for Electronic Systems
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Topics: Anisotropy, Electronic systems, Polymer films, Thermal characterization, Micromachining, Temperature, Thermal conductivity, Actuators, Heating, Integrated circuits
Proceedings Papers

MEMS-Based Test Structures for IC Technology

Stephen A. Smee, Michael Gaitan, Yogendra Joshi
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 147-149, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1151
https://doi.org/10.1115/IMECE1998-1151
View Paper titled, MEMS-Based Test Structures for IC Technology
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Topics: Delamination, Density, Electrodiffusion, Failure, Integrated circuits, Microelectromechanical systems, Probability, Reliability, Stress, Thermomechanics
Proceedings Papers

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Chi-Te Chin, James N. Fordemwalt, Jong-I Mou
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 53-58, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1015
https://doi.org/10.1115/IMECE1998-1015
View Paper titled, Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD
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Topics: Circuits, Complementary metal oxide semiconductors, Computer-aided design, Delays, Diffusion (Physics), Gates (Closures), Integrated circuits, Junctions, Manufacturing, Metal oxide semiconductors
Proceedings Papers

Three-Dimensional Simulation of Microchip Encapsulation Processes

Ruihua Han, Mahesh Gupta
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 757-766, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1090
https://doi.org/10.1115/IMECE1998-1090
View Paper titled, Three-Dimensional Simulation of Microchip Encapsulation Processes
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Topics: Integrated circuits, Simulation, Flow (Dynamics), Fluids, Finite element analysis, Inertia (Mechanics), Pressure
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0650
https://doi.org/10.1115/IMECE1998-0650
View Paper titled, Micro Channel Heat Exchanger for Cooling Electrical Equipment
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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits