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Proceedings Papers

Strength Distribution and Size Effects for the Fracture of Fibrous Composite Materials

S. Leigh Phoenix, Irene J. Beyerlein

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 23-34, November 16–21, 1997

Paper No: IMECE1997-0706

DOI: https://doi.org/10.1115/IMECE1997-0706

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Topics: Fiber reinforced composites, Fracture (Materials), Size effect, Approximation, Breakdown (Electricity), Brittle fracture, Failure, Network models, Physics, Simulation

Proceedings Papers

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

Moshe M. Domb, Jorn S. Hansen

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 93-98, November 16–21, 1997

Paper No: IMECE1997-0712

DOI: https://doi.org/10.1115/IMECE1997-0712

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Topics: Laminates, Stress, Thermoplastic composites, Cooling, Cycles, Residual stresses, Annealing, Computer simulation, Design, Fracture (Materials)

Proceedings Papers

Comparison of Fretting Fatigue Crack Nucleation Experiments to Multiaxial Fatigue Theory Life Predictions

Matthew P. Szolwinski, G. Harish, Thomas N. Farris

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 449-457, November 16–21, 1997

Paper No: IMECE1997-0745

DOI: https://doi.org/10.1115/IMECE1997-0745

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Topics: Fatigue, Fatigue cracks, Nucleation (Physics), Stress, Fracture (Materials), Cycles, Aircraft, Aluminum alloys, Disks, Failure mechanisms

Proceedings Papers

The Role of Threshold Fatigue Crack Growth in Life Prediction of the Alloy Ti-6Al-2Sn-4Zr-6Mo Under High Cycle Fatigue Spectra

James M. Larsen, Stephan M. Russ, David C. Maxwell, Brian D. Worth

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 443-448, November 16–21, 1997

Paper No: IMECE1997-0744

DOI: https://doi.org/10.1115/IMECE1997-0744

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Topics: Alloys, Fatigue cracks, High cycle fatigue, Spectra (Spectroscopy), Fracture (Materials), Gas turbines, Stress, Airfoils, Low cycle fatigue, Titanium alloys

Proceedings Papers

Probabilistic Mesomechanics for High Cycle Fatigue Life Prediction

Robert G. Tryon, Thomas A. Cruse

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 467-474, November 16–21, 1997

Paper No: IMECE1997-0747

DOI: https://doi.org/10.1115/IMECE1997-0747

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Topics: High cycle fatigue, Electromagnetic scattering, Fatigue, Design, Fracture (Materials), Alloys, Damage, Durability, Gas turbines, Materials properties

Proceedings Papers

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Qing Wang, Ming-Liang Du, Fu-Pen Chiang

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 459-465, November 16–21, 1997

Paper No: IMECE1997-0746

DOI: https://doi.org/10.1115/IMECE1997-0746

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Topics: Fracture (Materials), Micromechanics (Engineering), Steel, Stress, Fatigue, Deformation, Displacement, Carbon steel, Crack propagation, Cycles

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Clifford K. Ho

Proc. ASME. IMECE97, Fluids Engineering, 401-412, November 16–21, 1997

Paper No: IMECE1997-0798

DOI: https://doi.org/10.1115/IMECE1997-0798

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Topics: Flow (Dynamics), Fracture (Materials), Fracture (Process), Heat, Porous materials, Permeability, Electrical conductance, Engineering simulation, Numerical analysis, Simulation

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997

Paper No: IMECE1997-0825

DOI: https://doi.org/10.1115/IMECE1997-0825

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Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis

Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997

Paper No: IMECE1997-1230

DOI: https://doi.org/10.1115/IMECE1997-1230

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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 91-95, November 16–21, 1997

Paper No: IMECE1997-1232

DOI: https://doi.org/10.1115/IMECE1997-1232

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Topics: Corners (Structural elements), Fracture (Materials), Nucleation (Physics), Eigenvalues, Stress, Elasticity, Geometry, Microelectronic devices, Structural elements (Construction)

Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997

Paper No: IMECE1997-1235

DOI: https://doi.org/10.1115/IMECE1997-1235

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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing

Proceedings Papers

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 131-133, November 16–21, 1997

Paper No: IMECE1997-1238

DOI: https://doi.org/10.1115/IMECE1997-1238

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Topics: Fracture (Materials), Fracture (Process), Metals, Adhesives, Aluminum, Modeling

Proceedings Papers

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

Yusaku Wada, Masaki Morishita, Akira Yamaguchi, Koji Iwata, Masakazu Ichimiya

Proc. ASME. IMECE97, 4th International Symposium on Fluid-Structure Interactions, Aeroelasticity, Flow-Induced Vibration and Noise: Volume I, 149-157, November 16–21, 1997

Paper No: IMECE1997-0054

DOI: https://doi.org/10.1115/IMECE1997-0054

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Topics: Failure mechanisms, Fatigue cracks, Flow-induced vibrations, Thermocouples, Fracture (Materials), Displacement, Failure, Damping, Fatigue, High cycle fatigue

Proceedings Papers

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

Ashraf -F. Bastawros, Kyung -S. Kim

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 139-144, November 16–21, 1997

Paper No: IMECE1997-0509

DOI: https://doi.org/10.1115/IMECE1997-0509

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Topics: Damage, Electric current, Fracture (Materials), Heating, Thin films, Aluminum, Electrodes, Temperature, Melting, Coating processes

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

Nathan W. Klingbeil, Jack L. Beuth

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 153-162, November 16–21, 1997

Paper No: IMECE1997-0511

DOI: https://doi.org/10.1115/IMECE1997-0511

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Topics: Stress, Design, Stress singularity, Finite element analysis, Fracture (Materials), Fracture (Process), Pressure, Strips

2 3 4 5

NARROW

Strength Distribution and Size Effects for the Fracture of Fibrous Composite Materials

Stacking Sequence Effects on the Process-Induced Free-Edge Stresses in Thermoplastic Composite Laminates

Comparison of Fretting Fatigue Crack Nucleation Experiments to Multiaxial Fatigue Theory Life Predictions

The Role of Threshold Fatigue Crack Growth in Life Prediction of the Alloy Ti-6Al-2Sn-4Zr-6Mo Under High Cycle Fatigue Spectra

Probabilistic Mesomechanics for High Cycle Fatigue Life Prediction

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Models of Fracture-Matrix Interactions During Multiphase Heat and Mass Flow in Unsaturated Fractured Porous Media

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Structural Integrity of Optical Fibers in Connectors

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

Advances in Tensile Testing of Polysilicon Thin Films

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Failure Mechanism of a Thermocouple Well Caused by Flow-Induced Vibration: (2) — Interaction Between Flow-Induced Vibration and Fatigue Crack Growth in a Thermocouple Well

The Role of Electric-Current Induced Heating in Damage Evolution at the Crack Tip in Thin Film Conductors

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Free-Edge Stress Intensity Factors for Edge-Loaded Bimaterial Layers

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