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Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

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Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

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Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

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F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits

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Nickolaos Strifas, Aris Christou
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 109-114, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0897
https://doi.org/10.1115/IMECE1996-0897
View Paper titled, Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits
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Topics: Flip-chip, Flip-chip devices, Integrated circuits, Polymers, Anisotropy, Ceramics, Finite element analysis, Heat, Simulation results, Stress
Proceedings Papers

Thermal Management of Flip Chips on Printed Circuit Boards

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Ron Zhang, Darrel Peugh, Bruce Myers
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 73-79, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0892
https://doi.org/10.1115/IMECE1996-0892
View Paper titled, Thermal Management of Flip Chips on Printed Circuit Boards
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Topics: Flip-chip devices, Printed circuit boards, Thermal management, Ceramics, Electronics, Energy dissipation, Power density, Reliability, Shrinkage (Materials)
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

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Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

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Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

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Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

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Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0503
https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

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Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0502
https://doi.org/10.1115/IMECE1997-0502
View Paper titled, The Effect of Underfill Delamination on the Reliability of Flip Chip Modules
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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

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Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0425
https://doi.org/10.1115/IMECE1998-0425
View Paper titled, Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

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Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0424
https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

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Jianbiao Pan, Gregory L. Tonkay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0920
https://doi.org/10.1115/IMECE1999-0920
View Paper titled, A Study of the Aperture Filling Process in Solder Paste Stencil Printing
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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

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V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

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Ryan Thorpe, Daniel F. Baldwin
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 33-38, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0914
https://doi.org/10.1115/IMECE1999-0914
View Paper titled, Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
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Topics: Event history analysis, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability
Proceedings Papers

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

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Brian J. Lewis, Hilary Sasso
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 47-52, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0916
https://doi.org/10.1115/IMECE1999-0916
View Paper titled, Process Characterization and the Effect of Process Defects on Flip Chip Reliability
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Topics: Flip-chip devices, Reliability, Solders, Manufacturing, Crack propagation, Delamination, Engineers, Failure mechanisms, Flip-chip assemblies, Optimization
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

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Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

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V. H. Adams, T.-Y. Tom Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 151-162, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24388
https://doi.org/10.1115/IMECE2001/HTD-24388
View Paper titled, An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices
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Topics: Gallium arsenide, Wire, Design, Engineering simulation, Junctions, Printed circuit boards, Simulation, Thermal resistance, Epoxy adhesives, Epoxy resins
Proceedings Papers

Reliable Low-Cost Flip Chip Interconnections

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Z. W. Zhong
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 207-212, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24726
https://doi.org/10.1115/IMECE2001/EPP-24726
View Paper titled, Reliable Low-Cost Flip Chip Interconnections
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flip-chip assemblies, Mass production, Reliability, Solders
Proceedings Papers

Warpage Analysis of Wafers With Film Coating

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Hai Ding, I. Charles Ume, Cheng Zhang
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 1-7, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24700
https://doi.org/10.1115/IMECE2001/EPP-24700
View Paper titled, Warpage Analysis of Wafers With Film Coating
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Topics: Coating processes, Coatings, Semiconductor wafers, Warping, Finite element analysis, Packaging, Shades and shadows, Young's modulus, Delamination, Design