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Flip-chip assemblies
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Proceedings Papers
Thermal Management in Direct Chip Attach Assemblies
Available to Purchase
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
Proceedings Papers
Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
Available to Purchase
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1114
Proceedings Papers
Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
Available to Purchase
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0503
Proceedings Papers
Investigation of Underfill Adhesion in Plastic Flip-Chip Packages
Available to Purchase
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0506
Proceedings Papers
Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Available to Purchase
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0508
Proceedings Papers
In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
Available to Purchase
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
Proceedings Papers
The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging
Available to Purchase
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1236
Proceedings Papers
Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling
Available to Purchase
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0435
Proceedings Papers
Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading
Available to Purchase
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1092
Proceedings Papers
Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies
Available to Purchase
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1088
Proceedings Papers
Process Characterization and the Effect of Process Defects on Flip Chip Reliability
Available to Purchase
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 47-52, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0916
Proceedings Papers
The Resonant Micro Fan for Fluidic Transport, Mixing and Particle Filtering
Available to Purchase
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 463-470, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23868
Proceedings Papers
Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism
Available to Purchase
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 57-64, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23808
Proceedings Papers
Reliable Low-Cost Flip Chip Interconnections
Available to Purchase
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 207-212, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24726
Proceedings Papers
Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Available to Purchase
Proc. ASME. IMECE2001, Threaded and Riveted Connections, Design Issues, Reliability, Stress Analysis, and Failure Prevention, 89-94, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-25109
Proceedings Papers
Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies
Available to Purchase
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40199
Proceedings Papers
Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability
Available to Purchase
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A074, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65877
Proceedings Papers
Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects
Available to Purchase
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 29-34, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12650
Proceedings Papers
Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder
Available to Purchase
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 39-42, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41762
Proceedings Papers
Lead-Free Flip Chip Assembly
Available to Purchase
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39251
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