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Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997

Paper No: IMECE1997-1236

DOI: https://doi.org/10.1115/IMECE1997-1236

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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies

Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997

Paper No: IMECE1997-1114

DOI: https://doi.org/10.1115/IMECE1997-1114

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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998

Paper No: IMECE1998-1092

DOI: https://doi.org/10.1115/IMECE1998-1092

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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Proceedings Papers

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

Xiantao Yan

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998

Paper No: IMECE1998-1088

DOI: https://doi.org/10.1115/IMECE1998-1088

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Topics: Flip-chip assemblies, Reliability, Solders, Fracture toughness, Printed circuit boards, Stress, Cracking (Materials), Experimental methods, Fatigue, Flow (Dynamics)

Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998

Paper No: IMECE1998-0435

DOI: https://doi.org/10.1115/IMECE1998-0435

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Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models

Proceedings Papers

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

Brian J. Lewis, Hilary Sasso

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 47-52, November 14–19, 1999

Paper No: IMECE1999-0916

DOI: https://doi.org/10.1115/IMECE1999-0916

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Topics: Flip-chip devices, Reliability, Solders, Manufacturing, Crack propagation, Delamination, Engineers, Failure mechanisms, Flip-chip assemblies, Optimization

Proceedings Papers

Reliable Low-Cost Flip Chip Interconnections

Z. W. Zhong

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 207-212, November 11–16, 2001

Paper No: IMECE2001/EPP-24726

DOI: https://doi.org/10.1115/IMECE2001/EPP-24726

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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flip-chip assemblies, Mass production, Reliability, Solders

Proceedings Papers

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

Jürgen Auersperg, Eva Kieselstein, Andreas Schubert, Bernd Michel

Proc. ASME. IMECE2001, Threaded and Riveted Connections, Design Issues, Reliability, Stress Analysis, and Failure Prevention, 89-94, November 11–16, 2001

Paper No: IMECE2001/DE-25109

DOI: https://doi.org/10.1115/IMECE2001/DE-25109

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Topics: Electronic packages, Flip-chip assemblies, Fracture (Process), Fracture mechanics, Fracture toughness, Reliability, Thermomechanics, Delamination, Damage, Fatigue

Proceedings Papers

The Resonant Micro Fan for Fluidic Transport, Mixing and Particle Filtering

Ryan J. Linderman, Subham Sett, Victor M. Bright

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 463-470, November 11–16, 2001

Paper No: IMECE2001/MEMS-23868

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23868

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Topics: Microelectromechanical systems, Particle filtering (numerical methods), Resonance, Fans, Flow (Dynamics), Flow visualization, Particulate matter, Ceilings, Channel flow, Deflection

Proceedings Papers

Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism

M. Adrian Michalicek, Victor M. Bright

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 57-64, November 11–16, 2001

Paper No: IMECE2001/MEMS-23808

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23808

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Topics: Flip-chip, Hinges, Manufacturing, Microelectromechanical systems, Bonding, Design, Micromachining, Adhesives, Ceramics, Complementary metal oxide semiconductors

Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014

Paper No: IMECE2014-40199

DOI: https://doi.org/10.1115/IMECE2014-40199

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Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials

Proceedings Papers

Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability

Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh Sitaraman

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A074, November 15–21, 2013

Paper No: IMECE2013-65877

DOI: https://doi.org/10.1115/IMECE2013-65877

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Topics: Design, Reliability, Warping, Temperature, Stress, Fracture (Materials), Fracture mechanics, Flip-chip, Flip-chip assemblies, Manufacturing

Proceedings Papers

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

K. Sinha, D. Farley, T. Kahnert, S. Solares, A. Dasgupta, J. F. J. Caers, X. J. Zhao

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 29-34, November 13–19, 2009

Paper No: IMECE2009-12650

DOI: https://doi.org/10.1115/IMECE2009-12650

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Topics: Flip-chip, Welding, Temperature, Adhesives, Bonding, Low temperature, Modeling, Bond strength, Compression, Cycles

Proceedings Papers

Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder

S. M. L. Nai, J. Wei, M. Gupta

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 39-42, November 11–15, 2007

Paper No: IMECE2007-41762

DOI: https://doi.org/10.1115/IMECE2007-41762

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Topics: Composite materials, Electrical resistivity, Solders, Tin, Multi-walled carbon nanotubes, Compacting, Extruding, Flip-chip assemblies, Microelectromechanical systems, Microelectronic devices

Proceedings Papers

Lead-Free Flip Chip Assembly

Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002

Paper No: IMECE2002-39251

DOI: https://doi.org/10.1115/IMECE2002-39251

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Topics: Alloys, Collapse, Copper, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flux (Metallurgy), Manufacturing, Soldering, Solders

Proceedings Papers

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Muthiah Venkateswaran, Peter Borgesen, K. Srihari

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 111-115, November 17–22, 2002

Paper No: IMECE2002-39252

DOI: https://doi.org/10.1115/IMECE2002-39252

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Topics: Adhesives, Flip-chip assemblies

NARROW

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

Reliable Low-Cost Flip Chip Interconnections

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

The Resonant Micro Fan for Fluidic Transport, Mixing and Particle Filtering

Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder

Lead-Free Flip Chip Assembly

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

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