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Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

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Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

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Xiantao Yan, Rakesh K. Agarwal
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1114
https://doi.org/10.1115/IMECE1997-1114
View Paper titled, Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

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Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0503
https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

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Xiang Dai, Mark V. Brillhart, Paul S. Ho
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0506
https://doi.org/10.1115/IMECE1997-0506
View Paper titled, Investigation of Underfill Adhesion in Plastic Flip-Chip Packages
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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

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Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0508
https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

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Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

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Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1236
https://doi.org/10.1115/IMECE1997-1236
View Paper titled, The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

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Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0435
https://doi.org/10.1115/IMECE1998-0435
View Paper titled, Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling
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Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models
Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

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Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1092
https://doi.org/10.1115/IMECE1998-1092
View Paper titled, Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Proceedings Papers

Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies

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Xiantao Yan
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 735-745, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1088
https://doi.org/10.1115/IMECE1998-1088
View Paper titled, Underfill Selection and its Impact on the Reliability of Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Reliability, Solders, Fracture toughness, Printed circuit boards, Stress, Cracking (Materials), Experimental methods, Fatigue, Flow (Dynamics)
Proceedings Papers

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

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Brian J. Lewis, Hilary Sasso
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 47-52, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0916
https://doi.org/10.1115/IMECE1999-0916
View Paper titled, Process Characterization and the Effect of Process Defects on Flip Chip Reliability
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Topics: Flip-chip devices, Reliability, Solders, Manufacturing, Crack propagation, Delamination, Engineers, Failure mechanisms, Flip-chip assemblies, Optimization
Proceedings Papers

The Resonant Micro Fan for Fluidic Transport, Mixing and Particle Filtering

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Ryan J. Linderman, Subham Sett, Victor M. Bright
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 463-470, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23868
https://doi.org/10.1115/IMECE2001/MEMS-23868
View Paper titled, The Resonant Micro Fan for Fluidic Transport, Mixing and Particle Filtering
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Topics: Microelectromechanical systems, Particle filtering (numerical methods), Resonance, Fans, Flow (Dynamics), Flow visualization, Particulate matter, Ceilings, Channel flow, Deflection
Proceedings Papers

Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism

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M. Adrian Michalicek, Victor M. Bright
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 57-64, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23808
https://doi.org/10.1115/IMECE2001/MEMS-23808
View Paper titled, Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism
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Topics: Flip-chip, Hinges, Manufacturing, Microelectromechanical systems, Bonding, Design, Micromachining, Adhesives, Ceramics, Complementary metal oxide semiconductors
Proceedings Papers

Reliable Low-Cost Flip Chip Interconnections

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Z. W. Zhong
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 207-212, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24726
https://doi.org/10.1115/IMECE2001/EPP-24726
View Paper titled, Reliable Low-Cost Flip Chip Interconnections
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flip-chip assemblies, Mass production, Reliability, Solders
Proceedings Papers

Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches

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Jürgen Auersperg, Eva Kieselstein, Andreas Schubert, Bernd Michel
Proc. ASME. IMECE2001, Threaded and Riveted Connections, Design Issues, Reliability, Stress Analysis, and Failure Prevention, 89-94, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-25109
https://doi.org/10.1115/IMECE2001/DE-25109
View Paper titled, Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
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Topics: Electronic packages, Flip-chip assemblies, Fracture (Process), Fracture mechanics, Fracture toughness, Reliability, Thermomechanics, Delamination, Damage, Fatigue
Proceedings Papers

Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies

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Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A080, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40199
https://doi.org/10.1115/IMECE2014-40199
View Paper titled, Cohesive Zone Models to Predict Multiple White Bumps in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Failure, Finite element model, Fracture (Process), Fracture mechanics, Microelectronic devices, Stress, Adhesives, Delamination, Dielectric materials
Proceedings Papers

Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability

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Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh Sitaraman
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A074, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65877
https://doi.org/10.1115/IMECE2013-65877
View Paper titled, Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability
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Topics: Design, Reliability, Warping, Temperature, Stress, Fracture (Materials), Fracture mechanics, Flip-chip, Flip-chip assemblies, Manufacturing
Proceedings Papers

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

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K. Sinha, D. Farley, T. Kahnert, S. Solares, A. Dasgupta, J. F. J. Caers, X. J. Zhao
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 29-34, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12650
https://doi.org/10.1115/IMECE2009-12650
View Paper titled, Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects
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Topics: Flip-chip, Welding, Temperature, Adhesives, Bonding, Low temperature, Modeling, Bond strength, Compression, Cycles
Proceedings Papers

Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder

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S. M. L. Nai, J. Wei, M. Gupta
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 39-42, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41762
https://doi.org/10.1115/IMECE2007-41762
View Paper titled, Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder
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Topics: Composite materials, Electrical resistivity, Solders, Tin, Multi-walled carbon nanotubes, Compacting, Extruding, Flip-chip assemblies, Microelectromechanical systems, Microelectronic devices
Proceedings Papers

Lead-Free Flip Chip Assembly

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Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39251
https://doi.org/10.1115/IMECE2002-39251
View Paper titled, Lead-Free Flip Chip Assembly
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Topics: Alloys, Collapse, Copper, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flux (Metallurgy), Manufacturing, Soldering, Solders