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Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits

Nickolaos Strifas, Aris Christou
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 109-114, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0897
https://doi.org/10.1115/IMECE1996-0897
View Paper titled, Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits
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Topics: Flip-chip, Flip-chip devices, Integrated circuits, Polymers, Anisotropy, Ceramics, Finite element analysis, Heat, Simulation results, Stress
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0503
https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0505
https://doi.org/10.1115/IMECE1997-0505
View Paper titled, Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load
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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density
Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0506
https://doi.org/10.1115/IMECE1997-0506
View Paper titled, Investigation of Underfill Adhesion in Plastic Flip-Chip Packages
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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0502
https://doi.org/10.1115/IMECE1997-0502
View Paper titled, The Effect of Underfill Delamination on the Reliability of Flip Chip Modules
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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0811
https://doi.org/10.1115/IMECE1997-0811
View Paper titled, Assessment of Chip-Scale Package Design Options
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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1233
https://doi.org/10.1115/IMECE1997-1233
View Paper titled, A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry
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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0429
https://doi.org/10.1115/IMECE1998-0429
View Paper titled, Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages
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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0425
https://doi.org/10.1115/IMECE1998-0425
View Paper titled, Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0424
https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0426
https://doi.org/10.1115/IMECE1998-0426
View Paper titled, Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages
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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination
Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Jianbiao Pan, Gregory L. Tonkay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0920
https://doi.org/10.1115/IMECE1999-0920
View Paper titled, A Study of the Aperture Filling Process in Solder Paste Stencil Printing
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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions