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Proceedings Papers

CFD and Experimental Investigation of Graphite Heat Spreader Based Cooling for Li-Ion Batteries for Electric Vehicles and EVTOL (Electric Vertical Take-Off and Landing) Aircraft Applications

Shashwat Bakhshi, Prahit Dubey
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A050, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-97123
https://doi.org/10.1115/IMECE2022-97123
View Paper titled, CFD and Experimental Investigation of Graphite Heat Spreader Based Cooling for Li-Ion Batteries for Electric Vehicles and EVTOL (Electric Vertical Take-Off and Landing) Aircraft Applications
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Topics: Aircraft, Computational fluid dynamics, Cooling, Electric vehicles, Flat heat pipes, Graphite, Lithium-ion batteries, Modeling
Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0494
https://doi.org/10.1115/IMECE1997-0494
View Paper titled, Reliability of Underfill-Encapsulated Flip-Chip Packages
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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods
Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao
Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0879
https://doi.org/10.1115/IMECE1998-0879
View Paper titled, Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space
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Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1089
https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

Capillary Pumped Loop Heat Spreader for Electronics Cooling

Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24405
https://doi.org/10.1115/IMECE2001/HTD-24405
View Paper titled, Capillary Pumped Loop Heat Spreader for Electronics Cooling
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Topics: Computer cooling, Flat heat pipes
Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24381
https://doi.org/10.1115/IMECE2001/HTD-24381
View Paper titled, A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets
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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation
Proceedings Papers

Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers

Marc Hodes
Proc. ASME. IMECE2000, Manufacturing Engineering, 443-451, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1839
https://doi.org/10.1115/IMECE2000-1839
View Paper titled, Formulae to Size Axisymmetric Heat Spreaders Above Dielectric Layers
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Topics: Flat heat pipes, Thermal resistance, Heat sinks
Proceedings Papers

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

Ravi S. Prasher, Craig Simmons, Gary Solbrekken
Proc. ASME. IMECE2000, Manufacturing Engineering, 461-466, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1841
https://doi.org/10.1115/IMECE2000-1841
View Paper titled, Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials
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Topics: Contact resistance, Thermal conductivity, Phase change materials, Polymers, Flat heat pipes, Computer cooling, Electronic packages, Fluids, Heat sinks, Particulate matter
Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee
Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1838
https://doi.org/10.1115/IMECE2000-1838
View Paper titled, Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction
Proceedings Papers

Cooling of a PWB With Irregular Populated Chips

Yiwu Ding, Dereje Agonafer, Elliott Short
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 293-298, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2276
https://doi.org/10.1115/IMECE2000-2276
View Paper titled, Cooling of a PWB With Irregular Populated Chips
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Topics: Cooling, Printed circuit boards, Temperature, Computational fluid dynamics, Buoyancy, Flat heat pipes, Simulation, Thermal conductivity, Heat conduction, Heat sinks
Proceedings Papers

Characterization of the Performance of Flat Heat Pipes for Electronics Cooling

Unnikrishnan Vadakkan, Suresh V. Garimella, Choondal B. Sobhan
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 261-268, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2272
https://doi.org/10.1115/IMECE2000-2272
View Paper titled, Characterization of the Performance of Flat Heat Pipes for Electronics Cooling
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Topics: Computer cooling, Flat heat pipes, Heat pipes
Proceedings Papers

Time-Periodic Forced Convection in Micro Heat Spreaders

Cuneyt Sert, Ali Beskok
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 375-384, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1119
https://doi.org/10.1115/IMECE2000-1119
View Paper titled, Time-Periodic Forced Convection in Micro Heat Spreaders
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Topics: Flat heat pipes, Forced convection, Cooling, Energy dissipation, Heat, Dimensions, Laminar flow, Microfluidics, Stress
Proceedings Papers

Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications

Steven A. Isaacs, Diego A. Arias, Peter E. Hamlington, Derek Hengeveld
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A053, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67229
https://doi.org/10.1115/IMECE2016-67229
View Paper titled, Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
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Topics: Copper, Design, Flat heat pipes, Fluids, Genetic algorithms, Heat, Modeling, Optimization, Pressure, Stress
Proceedings Papers

Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting With Advanced Heat Spreader Technology

Umut Zeynep Uras, Enes Tamdoğan, Mehmet Arık
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A050, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65602
https://doi.org/10.1115/IMECE2016-65602
View Paper titled, Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting With Advanced Heat Spreader Technology
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Topics: Engines, Flat heat pipes, Light-emitting diodes, Metals, Thermal conductivity, Vapors, Flexible electronics, Internet of things, Lumber, Printed circuit boards
Proceedings Papers

Study on Periodic Thermal-Switching Behavior of Flat Heat Pipe

Shigeki Hirasawa, Tatsuya Nakamu, Tsuyoshi Kawanami, Katsuaki Shirai
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A001, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50158
https://doi.org/10.1115/IMECE2015-50158
View Paper titled, Study on Periodic Thermal-Switching Behavior of Flat Heat Pipe
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Topics: Flat heat pipes, Heat, Condensers (steam plant), Heat transfer, Temperature, Switches, Computer simulation, Flow (Dynamics), Heat capacity, Heat pipes
Proceedings Papers

Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Rajesh Jha
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52804
https://doi.org/10.1115/IMECE2015-52804
View Paper titled, Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots
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Topics: Flat heat pipes, Temperature, Thin films, Airfoils, Circuits, Coating processes, Coatings, Cross section (Physics), Diamonds, Fins
Proceedings Papers

Passivation and Performance of Inorganic Aqueous Solutions in a Grooved, Aluminum Flat Heat Pipe

Michael Stubblebine, Ladan Amouzegar, Ivan Catton
Proc. ASME. IMECE2013, Volume 8C: Heat Transfer and Thermal Engineering, V08CT09A061, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65641
https://doi.org/10.1115/IMECE2013-65641
View Paper titled, Passivation and Performance of Inorganic Aqueous Solutions in a Grooved, Aluminum Flat Heat Pipe
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Topics: Aluminum, Flat heat pipes, Heat pipes, Water, Condensers (steam plant), Copper, Fluids, Heat, Weight (Mass), Aerospace industry
Proceedings Papers

An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold

Shailesh N. Joshi, Matthew J. Rau, Ercan M. Dede
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A021, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63249
https://doi.org/10.1115/IMECE2013-63249
View Paper titled, An Experimental Study of a Single-Device Jet Impingement Cooler With Phase Change Using HFE-7100 and a Vapor Extraction Manifold
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Topics: Manifolds, Vapors, Pressure, Coolants, Design, Flat heat pipes, Heat transfer coefficients, Heat transfer, Containment, Cooling
Proceedings Papers

Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe

Agat Hirachan, Dereje Agonafer
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1189-1195, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89998
https://doi.org/10.1115/IMECE2012-89998
View Paper titled, Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe
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Topics: Heat pipes, Thermoelectric coolers, Silicon, Cooling, Heat, Patents, Computer software, Copper, Electronic packaging, Flat heat pipes