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Proceedings Papers

On the Reliability Analysis of VLSI Chips When Subjected to Thermal Cycling

Shahriar Jahanian, Jamshid Goshtasbi-G
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 121-129, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1353
https://doi.org/10.1115/IMECE1997-1353
View Paper titled, On the Reliability Analysis of VLSI Chips When Subjected to Thermal Cycling
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Topics: Circuits, Cooling, Event history analysis, Failure, Fracture (Materials), Fracture (Process), Mechanical structures, Microelectronic devices, Probability, Reliability
Proceedings Papers

Reliability of Welded Joints With Short Fatigue Cracks

David B. Lanning, Jr., M.-H. Herman Shen
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 45-51, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0143
https://doi.org/10.1115/IMECE1996-0143
View Paper titled, Reliability of Welded Joints With Short Fatigue Cracks
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Topics: Fatigue cracks, Reliability, Welded joints, Fracture (Materials), Crack propagation, Event history analysis, Fatigue, Flat plates, Fracture mechanics, Magnification
Proceedings Papers

Human Tolerance to Injury Under Complex Head-Neck Loading

Narayan Yoganadan, John Humm, Jamie Baisden, Vicky Varghese, Anjishnu Banerjee
Proc. ASME. IMECE2022, Volume 4: Biomedical and Biotechnology; Design, Systems, and Complexity, V004T05A042, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95731
https://doi.org/10.1115/IMECE2022-95731
View Paper titled, Human Tolerance to Injury Under Complex Head-Neck Loading
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Topics: Wounds, Stress, Shear (Mechanics), Autonomous vehicles, Event history analysis, Fracture (Materials), Fracture (Process), Rotation
Proceedings Papers

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

Tomohiko Jimbo, Akira Kano, Yousuke Hisakuni, Yasutaka Ito, Kenji Hirohata, Tsuyoshi Ichimura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A011, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94043
https://doi.org/10.1115/IMECE2022-94043
View Paper titled, Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load
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Topics: Event history analysis, Metamodeling, Stress, Wind, Wind turbines
Proceedings Papers

Automated Generation of Hybrid Probabilistic Risk Models From SysML V2 Models of Software-Defined Manufacturing Systems

Philipp Grimmeisen, Yuliang Ma, Mihai A. Diaconeasa, Andrey Morozov
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A031, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95433
https://doi.org/10.1115/IMECE2022-95433
View Paper titled, Automated Generation of Hybrid Probabilistic Risk Models From SysML V2 Models of Software-Defined Manufacturing Systems
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Topics: Chain, Computer software, Event history analysis, Manufacturing systems, Reliability, Risk, Digital twin, Manufacturing, Manipulators, Safety
Proceedings Papers

Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies

Run-Zi Wang, Ken Suzuki, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A020, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94273
https://doi.org/10.1115/IMECE2022-94273
View Paper titled, Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies
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Topics: Creep, Event history analysis, Fatigue, Metamodeling
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1231
https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Probabilistic Methods for Performance Evaluation of Actively Controlled Structures

Unyime O. Akpan, I. R. (Wally) Orisamolu
Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 217-225, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0195
https://doi.org/10.1115/IMECE1997-0195
View Paper titled, Probabilistic Methods for Performance Evaluation of Actively Controlled Structures
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Topics: Adaptive structures, Algorithms, Control equipment, Control systems, Damping, Design, Eigenvalues, Event history analysis, Modeling, Noise (Sound)
Proceedings Papers

Reliability Analysis of Flexible PCBs

Amogh Shejwal, Ashutosh Srivastava, Sandeep Medikonda, S. Babu Aminjikarai
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A054, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-71540
https://doi.org/10.1115/IMECE2021-71540
View Paper titled, Reliability Analysis of Flexible PCBs
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Topics: Cables, Computer simulation, Computer-aided design, Construction, Copper, Event history analysis, Fatigue, Fatigue life, Geometry, Laptop computers
Proceedings Papers

Structural Reliability Estimation of Steel Hall Exhibiting Random Mechanical Parameters

Rafał Bredow, Marcin Kamiński
Proc. ASME. IMECE2021, Volume 7B: Dynamics, Vibration, and Control, V07BT07A054, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-73306
https://doi.org/10.1115/IMECE2021-73306
View Paper titled, Structural Reliability Estimation of Steel Hall Exhibiting Random Mechanical Parameters
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Topics: Event history analysis, Finite element methods, Reliability, Steel
Proceedings Papers

A Sensitivity-Based Approach for Interval Reliability Analysis of Structures Under Random Excitation

Filippo Giunta, Giuseppe Muscolino, Alba Sofi
Proc. ASME. IMECE2021, Volume 7B: Dynamics, Vibration, and Control, V07BT07A052, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-71092
https://doi.org/10.1115/IMECE2021-71092
View Paper titled, A Sensitivity-Based Approach for Interval Reliability Analysis of Structures Under Random Excitation
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Topics: Event history analysis, Random excitation, Reliability, Uncertainty
Proceedings Papers

The Role of Protective System Reliability Analysis in the Study of System Safety

Martin Wortman, Ernie Kee, Pranav Kannan
Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A032, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-69562
https://doi.org/10.1115/IMECE2021-69562
View Paper titled, The Role of Protective System Reliability Analysis in the Study of System Safety
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Topics: Event history analysis, Reliability, Safety
Proceedings Papers

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

Ryan Thorpe, Daniel F. Baldwin
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 33-38, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0914
https://doi.org/10.1115/IMECE1999-0914
View Paper titled, Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
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Topics: Event history analysis, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability
Proceedings Papers

On Environmental Vibration Power Spectra and Accelerated Testing for Medical Devices

Jingshu Wu, Ruichong Zhang, Karl K. Stevens
Proc. ASME. IMECE99, Recent Advances in Solids and Structures, 95-102, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0619
https://doi.org/10.1115/IMECE1999-0619
View Paper titled, On Environmental Vibration Power Spectra and Accelerated Testing for Medical Devices
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Topics: Medical devices, Spectra (Spectroscopy), Testing, Vibration, Helicopters, Transportation systems, Design, Random vibration, Vehicles, Event history analysis
Proceedings Papers

Design Features of Compliant Packages and Their Impact on Reliability

Ilyas Mohammed, Young-Gon Kim
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 43-52, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24705
https://doi.org/10.1115/IMECE2001/EPP-24705
View Paper titled, Design Features of Compliant Packages and Their Impact on Reliability
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Topics: Design, Reliability, Silicon, Packaging, Accelerated life testing, Electronic packages, Epoxy adhesives, Epoxy resins, Event history analysis, Failure
Proceedings Papers

Reliability Analysis on the Chaos Induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board

Xiaoling He, Robert Fulton
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 257-263, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24733
https://doi.org/10.1115/IMECE2001/EPP-24733
View Paper titled, Reliability Analysis on the Chaos Induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board
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Topics: Chaos, Event history analysis, Nonlinear dynamics, Printed circuit boards, Temperature, Transients (Dynamics)
Proceedings Papers

Discussion of the Worst Case Scenario of FLD 0

Naji Arwashan
Proc. ASME. IMECE2000, Manufacturing Engineering, 721-727, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1875
https://doi.org/10.1115/IMECE2000-1875
View Paper titled, Discussion of the Worst Case Scenario of FLD 0
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Topics: Event history analysis, Forming limit diagrams, Manufacturing, Probability, Safety, Shapes, Steel
Proceedings Papers

Fatigue Reliability Under Corrosion, Creep, and Fretting Damage

Sankaran Mahadevan
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 53, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2670
https://doi.org/10.1115/IMECE2000-2670
View Paper titled, Fatigue Reliability Under Corrosion, Creep, and Fretting Damage
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Topics: Corrosion, Creep, Damage, Fatigue, Reliability, Fracture (Materials), Aircraft, Event history analysis, Fatigue life, Nucleation (Physics)
Proceedings Papers

Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

Y. T. Lin, P. J. Tang, K. N. Chiang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 69-78, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2248
https://doi.org/10.1115/IMECE2000-2248
View Paper titled, Parametric Design and Reliability Analysis of WIT Wafer Level Packaging
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Topics: Event history analysis, Packaging, Parametric design, Semiconductor wafers, Density, Reliability, Solders, Copper, Electronic packages, Finite element methods
Proceedings Papers

Probabilistic Characterization of Fatigue Damage Data for Aerospace Materials

I. R. Wally Orisamolu
Proc. ASME. IMECE2000, Materials: Book of Abstracts, 1, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2644
https://doi.org/10.1115/IMECE2000-2644
View Paper titled, Probabilistic Characterization of Fatigue Damage Data for Aerospace Materials
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Topics: Aerospace industry, Fatigue damage, Fatigue, Reliability, Damage, Durability, Fracture (Materials), Modeling, Statistical distributions, ASTM International