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Proceedings Papers
Vibrational Response of Boron Nitride Nanofiller in Epoxy Nanocomposites- An Experimental Study
Available to PurchaseLuis Rafael Miranda Rodriguez, Shalaka Tendolkar, Kyra Wilson, Crystal Yung, Spiro Klimentos, Andrew Norris, Jonathan P. Singer, Assimina A. Pelegri
Proc. ASME. IMECE2024, Volume 1: Acoustics, Vibration, and Phononics; Advanced Design and Information Technologies, V001T01A017, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145125
Proceedings Papers
Acoustic Emission Analysis and Source Localization With Pencil Lead Breaks on Graphene-Reinforced Epoxy Specimens
Available to Purchase
Proc. ASME. IMECE2024, Volume 1: Acoustics, Vibration, and Phononics; Advanced Design and Information Technologies, V001T01A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139660
Proceedings Papers
Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures
Available to Purchase
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A018, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139915
Proceedings Papers
Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging
Available to Purchase
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144963
Proceedings Papers
A Numerical and Experimental Analysis of Compression-Induced Cracking in Epoxy Composite Grout Under Thermo-Mechanical Loading
Available to Purchase
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A003, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112962
Proceedings Papers
Dynamic Analysis of a Cracked Composite Beam
Available to Purchase
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A030, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113709
Proceedings Papers
A Numerical and Experimental Investigation About Tensile Fracture in Epoxy Composite Grout Under Thermo-Mechanical Load
Available to Purchase
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A004, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112979
Proceedings Papers
Electronic Failure of Small Implantable Devices due to Moisture Ingress Through a Medical Grade Epoxy
Available to Purchase
Proc. ASME. IMECE2023, Volume 5: Biomedical and Biotechnology, V005T06A020, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112177
Proceedings Papers
On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)
Available to Purchase
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A059, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113400
Proceedings Papers
A Summary of Darpa’s Embedded Sensors for Submarine Structures Program
Available to Purchase
Proc. ASME. IMECE96, Aerospace, 497-503, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0661
Proceedings Papers
A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
Available to Purchase
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
Proceedings Papers
Finite Element Analysis of Optical Fiber Structures
Available to Purchase
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 181-191, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0733
Proceedings Papers
Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
Available to Purchase
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
Proceedings Papers
Damage Growth in Stitched Graphite/Epoxy Laminates Under Mode I Fracture and Compression Loading
Available to Purchase
Proc. ASME. IMECE96, Aerospace, 39-50, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0608
Proceedings Papers
Three-Dimensional Penetration Modelling of Composite Plates
Available to Purchase
Proc. ASME. IMECE96, Aerospace, 25-30, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0606
Proceedings Papers
Active Fracture Control of a Composite Material System With SMA Actuator and AE Sensor
Available to Purchase
Proc. ASME. IMECE96, Aerospace, 529-533, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0666
Proceedings Papers
Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole
Available to Purchase
Proc. ASME. IMECE96, Aerospace, 805-813, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0697
Proceedings Papers
An Analytical Study of Investment Casting With Webbed Epoxy Patterns
Available to Purchase
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 11-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0770
Proceedings Papers
Viscoelastic Analysis of IC Package Warpage
Available to Purchase
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 101-107, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0896
Proceedings Papers
Curing Analysis of a Flip-Chip-on-Board Electronic Package
Available to Purchase
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 13-22, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0885
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