1-20 of 339
Epoxy adhesives
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
View Paper
PDF
Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

C. L. Chow, Fan Yang, H. Eliot Fang
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 223-233, November 16–21, 1997
Paper No: IMECE1997-0668
DOI: https://doi.org/10.1115/IMECE1997-0668
View Paper
PDF
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Damage, Failure, Fibers, Constitutive equations, Anisotropy
Proceedings Papers

Stiffness Changes in Laminates Caused by Intralaminar Cracks and Shear Deformation

Janis Varna, Nagendra V. Akshantala, Ramesh Talreja
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 165-168, November 16–21, 1997
Paper No: IMECE1997-0661
DOI: https://doi.org/10.1115/IMECE1997-0661
View Paper
PDF
Topics: Fracture (Materials), Laminates, Shear deformation, Stiffness, Damage mechanics, Epoxy adhesives, Epoxy resins, Glass, Shear modulus
Proceedings Papers

Size Effects in Tensile, Compressive and Interlaminar Failure of Unidirectional Composites

Michael R. Wisnom
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 67-77, November 16–21, 1997
Paper No: IMECE1997-0710
DOI: https://doi.org/10.1115/IMECE1997-0710
View Paper
PDF
Topics: Composite materials, Failure, Carbon fibers, Epoxy adhesives, Epoxy resins, Glass, Buckling, Failure mechanisms, Shear (Mechanics), Shear strength
Proceedings Papers

Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates

Ho-Jun Lee, Dimitris A. Saravanos
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 249-257, November 16–21, 1997
Paper No: IMECE1997-0726
DOI: https://doi.org/10.1115/IMECE1997-0726
View Paper
PDF
Topics: Composite materials, Plates (structures), Shapes, Temperature effects, Epoxy adhesives, Epoxy resins, Finite element analysis, Graphite, Laminates, Piezoelectric ceramics
Proceedings Papers

Prediction of First Ply Failure in Scaled Cross-Ply Composite Laminates

Karen E. Jackson
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 11-21, November 16–21, 1997
Paper No: IMECE1997-0705
DOI: https://doi.org/10.1115/IMECE1997-0705
View Paper
PDF
Topics: Composite materials, Failure, Laminates, Stress, Tension, Acoustic emissions, Dimensions, Epoxy adhesives, Epoxy resins, Failure analysis
Proceedings Papers

On the Optimization of Composite Cylindrical Sandwich Shells Subjected to Beam Type Bending

Jack R. Vinson
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 387-399, November 16–21, 1997
Paper No: IMECE1997-0738
DOI: https://doi.org/10.1115/IMECE1997-0738
View Paper
PDF
Topics: Composite materials, Optimization, Shells, Stress, Epoxy adhesives, Epoxy resins, Weight (Mass), Buckling, Carbon, Design
Proceedings Papers

Orthotropic Column Buckling: The Euler and Engesser/Haringx/Timoshenko Formulas Versus an Elasticity Solution

George A. Kardomateas
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 35-48, November 16–21, 1997
Paper No: IMECE1997-0707
DOI: https://doi.org/10.1115/IMECE1997-0707
View Paper
PDF
Topics: Buckling, Elasticity, Stress, Shear (Mechanics), Composite materials, Epoxy adhesives, Epoxy resins, Circular cylinders, Cylinders, Glass
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997
Paper No: IMECE1997-0820
DOI: https://doi.org/10.1115/IMECE1997-0820
View Paper
PDF
Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Paper No: IMECE1997-0818
DOI: https://doi.org/10.1115/IMECE1997-0818
View Paper
PDF
Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds
Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997
Paper No: IMECE1997-0813
DOI: https://doi.org/10.1115/IMECE1997-0813
View Paper
PDF
Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
View Paper
PDF
Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Paper No: IMECE1997-0825
DOI: https://doi.org/10.1115/IMECE1997-0825
View Paper
PDF
Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
View Paper
PDF
Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997
Paper No: IMECE1997-0493
DOI: https://doi.org/10.1115/IMECE1997-0493
View Paper
PDF
Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
View Paper
PDF
Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997
Paper No: IMECE1997-0512
DOI: https://doi.org/10.1115/IMECE1997-0512
View Paper
PDF
Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)
Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Paper No: IMECE1997-0502
DOI: https://doi.org/10.1115/IMECE1997-0502
View Paper
PDF
Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads

P. Atherton, A. Saigal, R. Greif
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 155-165, November 16–21, 1997
Paper No: IMECE1997-0532
DOI: https://doi.org/10.1115/IMECE1997-0532
View Paper
PDF
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Failure analysis, Graphite, Stress, Failure, Finite element analysis, Residual stresses, Fibers
Proceedings Papers

Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices

Jonathan Simon, Long-Sun Huang, Balaji Sridharan, Chang-Jin Kim
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 29-34, November 16–21, 1997
Paper No: IMECE1997-0935
DOI: https://doi.org/10.1115/IMECE1997-0935
View Paper
PDF
Topics: Joining, Microelectromechanical systems, Semiconductor wafers, Temperature, Adhesives, Low temperature, Reservoirs, Sealing (Process), Epoxy adhesives, Hardening (Curing)