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Proceedings Papers

Vibrational Response of Boron Nitride Nanofiller in Epoxy Nanocomposites- An Experimental Study

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Luis Rafael Miranda Rodriguez, Shalaka Tendolkar, Kyra Wilson, Crystal Yung, Spiro Klimentos, Andrew Norris, Jonathan P. Singer, Assimina A. Pelegri
Proc. ASME. IMECE2024, Volume 1: Acoustics, Vibration, and Phononics; Advanced Design and Information Technologies, V001T01A017, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145125
https://doi.org/10.1115/IMECE2024-145125
View Paper titled, Vibrational Response of Boron Nitride Nanofiller in Epoxy Nanocomposites- An Experimental Study
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Topics: Boron nitride, Boron nitride nanotubes, Epoxy adhesives, Epoxy resins, Nanocomposites, Young's modulus
Proceedings Papers

Acoustic Emission Analysis and Source Localization With Pencil Lead Breaks on Graphene-Reinforced Epoxy Specimens

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Michael Ewles, Griffin Rousseau, Linda Zhu, Je-Heon Han, Olanrewaju Aluko
Proc. ASME. IMECE2024, Volume 1: Acoustics, Vibration, and Phononics; Advanced Design and Information Technologies, V001T01A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139660
https://doi.org/10.1115/IMECE2024-139660
View Paper titled, Acoustic Emission Analysis and Source Localization With Pencil Lead Breaks on Graphene-Reinforced Epoxy Specimens
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Topics: Acoustic emissions, Epoxy adhesives, Epoxy resins, Graphene
Proceedings Papers

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

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Yao Qiao, Seunghyun Ko, Yongsoon Shin, Jose L. Ramos, Justin L. Olson, Kevin L. Simmons
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A018, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139915
https://doi.org/10.1115/IMECE2024-139915
View Paper titled, Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures
Open the PDF for Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures in another window
Topics: Adhesive joints, Adhesives, Bonding, Epoxy adhesives, Epoxy resins, Hardening (Curing), Plasmas (Ionized gases), Polymer composites, Pressure
Proceedings Papers

Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging

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Rahul Adhikari, Nathan Jackson
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144963
https://doi.org/10.1115/IMECE2024-144963
View Paper titled, Parylene Capping Layer for Embedded Liquid Mass for MEMS Packaging
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Topics: MEMS packaging, Microelectronic devices, Packaging, Microelectromechanical systems, Testing, Silicon, Silicones, Additive manufacturing, Biomedicine, Cavities
Proceedings Papers

A Numerical and Experimental Analysis of Compression-Induced Cracking in Epoxy Composite Grout Under Thermo-Mechanical Loading

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Nahri S. Waseetuddin, Abba A. Abubakar, Khaled S. Al-Athel, Syed S. Akhtar
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A003, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112962
https://doi.org/10.1115/IMECE2023-112962
View Paper titled, A Numerical and Experimental Analysis of Compression-Induced Cracking in Epoxy Composite Grout Under Thermo-Mechanical Loading
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Topics: Composite materials, Compression, Epoxy adhesives, Epoxy resins, Experimental analysis, Fracture (Process), High temperature, Thermomechanics
Proceedings Papers

Dynamic Analysis of a Cracked Composite Beam

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Pratik Sarker, Uttam K. Chakravarty
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A030, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113709
https://doi.org/10.1115/IMECE2023-113709
View Paper titled, Dynamic Analysis of a Cracked Composite Beam
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Topics: Composite building materials, Composite materials, Dynamic analysis, Vibration, Fracture (Materials), Dynamic testing (Materials), Epoxy adhesives, Epoxy resins, Failure, Finite element analysis
Proceedings Papers

A Numerical and Experimental Investigation About Tensile Fracture in Epoxy Composite Grout Under Thermo-Mechanical Load

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Nahri S. Waseetuddin, Abba A. Abubakar
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A004, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112979
https://doi.org/10.1115/IMECE2023-112979
View Paper titled, A Numerical and Experimental Investigation About Tensile Fracture in Epoxy Composite Grout Under Thermo-Mechanical Load
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Fracture (Materials), Fracture (Process), High temperature, Stress, Thermomechanics
Proceedings Papers

Electronic Failure of Small Implantable Devices due to Moisture Ingress Through a Medical Grade Epoxy

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Simon Blue, Deborah Munro
Proc. ASME. IMECE2023, Volume 5: Biomedical and Biotechnology, V005T06A020, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112177
https://doi.org/10.1115/IMECE2023-112177
View Paper titled, Electronic Failure of Small Implantable Devices due to Moisture Ingress Through a Medical Grade Epoxy
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Topics: Biomedicine, Cobalt, Epoxy adhesives, Epoxy resins, Failure
Proceedings Papers

On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)

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Aoi Takagi, Yuichi Hosoya, Shotaro Yasuda, Kazuma Ogata, Tomo Takeda, Akio Yonezu
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A059, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113400
https://doi.org/10.1115/IMECE2023-113400
View Paper titled, On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)
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Topics: Adhesion, Adhesives, Bonding, Carbon reinforced plastics, Delamination, Epoxy adhesives, Epoxy resins, Lasers, Shock (Mechanics)
Proceedings Papers

A Summary of Darpa’s Embedded Sensors for Submarine Structures Program

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John H. Belk, James J. Kelly, Roger M. Crane
Proc. ASME. IMECE96, Aerospace, 497-503, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0661
https://doi.org/10.1115/IMECE1996-0661
View Paper titled, A Summary of Darpa’s Embedded Sensors for Submarine Structures Program
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Topics: Sensors, Underwater vehicles, Composite materials, Manufacturing, Defense industry, Design, Epoxy adhesives, Epoxy resins, Fiber optic sensors, Graphite
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

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Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
Open the PDF for A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep in another window
Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Finite Element Analysis of Optical Fiber Structures

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B. R. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 181-191, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0733
https://doi.org/10.1115/IMECE1996-0733
View Paper titled, Finite Element Analysis of Optical Fiber Structures
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Topics: Finite element analysis, Optical fiber, Stress, Composite materials, Computer software, Design, Epoxy adhesives, Geometry, Metals, Modeling
Proceedings Papers

Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

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M. Uschitsky, E. Suhir
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 67-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0724
https://doi.org/10.1115/IMECE1996-0724
View Paper titled, Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner
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Topics: Corners (Structural elements), Epoxy adhesives, Epoxy resins, Molding, Stress, Delamination, Adhesion, Fracture (Materials), Reliability, Design
Proceedings Papers

Damage Growth in Stitched Graphite/Epoxy Laminates Under Mode I Fracture and Compression Loading

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Suresh K. Sharma, Bhavani V. Sankar
Proc. ASME. IMECE96, Aerospace, 39-50, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0608
https://doi.org/10.1115/IMECE1996-0608
View Paper titled, Damage Growth in Stitched Graphite/Epoxy Laminates Under Mode I Fracture and Compression Loading
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Topics: Compression, Damage, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Laminates, Textiles, Composite materials, Fracture toughness
Proceedings Papers

Three-Dimensional Penetration Modelling of Composite Plates

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J. K. Chen, J. E. Beraun
Proc. ASME. IMECE96, Aerospace, 25-30, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0606
https://doi.org/10.1115/IMECE1996-0606
View Paper titled, Three-Dimensional Penetration Modelling of Composite Plates
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Topics: Composite materials, Modeling, Plates (structures), Damage, Engineering simulation, Epoxy adhesives, Epoxy resins, Fiber reinforced composites, Fibers, Graphite
Proceedings Papers

Active Fracture Control of a Composite Material System With SMA Actuator and AE Sensor

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Y. Furuya, A. Shimamoto, J. Tani, J. Qiu
Proc. ASME. IMECE96, Aerospace, 529-533, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0666
https://doi.org/10.1115/IMECE1996-0666
View Paper titled, Active Fracture Control of a Composite Material System With SMA Actuator and AE Sensor
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Topics: Actuators, Composite materials, Fracture (Materials), Sensors, Fibers, Epoxy adhesives, Epoxy resins, Failure, Shapes, Acoustic emissions
Proceedings Papers

Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole

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Fan Yang, C. L. Chow, H. Eliot Fang
Proc. ASME. IMECE96, Aerospace, 805-813, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0697
https://doi.org/10.1115/IMECE1996-0697
View Paper titled, Damage in Unidirectional Graphite/Epoxy Laminates Containing a Circular Hole
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Topics: Damage, Epoxy adhesives, Epoxy resins, Graphite, Laminates, Composite materials, Failure, Fibers, Constitutive equations, Damage mechanics
Proceedings Papers

An Analytical Study of Investment Casting With Webbed Epoxy Patterns

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W. L. Yao, H. Wong, M. C. Leu, D. H. Sebastian
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 11-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0770
https://doi.org/10.1115/IMECE1996-0770
View Paper titled, An Analytical Study of Investment Casting With Webbed Epoxy Patterns
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Topics: Epoxy adhesives, Epoxy resins, Investment casting (Process), Investment castings, Finite element analysis, Geometry, Stress, Thermal expansion, Buckling, Ceramics
Proceedings Papers

Viscoelastic Analysis of IC Package Warpage

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T. S. Yeung, M. M. F. Yuen
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 101-107, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0896
https://doi.org/10.1115/IMECE1996-0896
View Paper titled, Viscoelastic Analysis of IC Package Warpage
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Topics: Warping, Coordinate measuring machines, Finite element analysis, Mechanical properties, Temperature, Epoxy adhesives, Epoxy resins, Finite element model, Glass transition, Hardening (Curing)
Proceedings Papers

Curing Analysis of a Flip-Chip-on-Board Electronic Package

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Wen C. Zheng
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 13-22, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0885
https://doi.org/10.1115/IMECE1996-0885
View Paper titled, Curing Analysis of a Flip-Chip-on-Board Electronic Package
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Topics: Electronic packages, Hardening (Curing), Epoxy adhesives, Epoxy resins, Manufacturing, Finite element methods, Finite element model, Temperature, Chemical reactions, Computer simulation