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Proceedings Papers

Design and Fabrication of a Multi-Scale Fluidic Motherboard for a Universal Molecular Processing System (uMPS)

D. S. Park, M. Witek, X. Zhao, Y. Kang, K. Dathathreya, B. H. You, S. A. Soper, M. C. Murphy
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A015, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11921
https://doi.org/10.1115/IMECE2019-11921
View Paper titled, Design and Fabrication of a Multi-Scale Fluidic Motherboard for a Universal Molecular Processing System (uMPS)
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Topics: Blood, Bonding, Brass (Metal), Convection, Deformation, Design, Diseases, Embossing, Flow (Dynamics), Flow control
Proceedings Papers

Fabrication for and Flow Visualization in 2.5D Rock-Based Ceramic Micromodels

Daniel S. Park, J. Upadhyay, K. Sharmin, J. F. Robbins, I. Schoegl, K. E. Thompson, D. E. Nikitopoulos
Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A025, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-71639
https://doi.org/10.1115/IMECE2017-71639
View Paper titled, Fabrication for and Flow Visualization in 2.5D Rock-Based Ceramic Micromodels
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Topics: Ceramics, Flow visualization, Manufacturing, Rocks, Flow (Dynamics), Embossing, Geometry, Metals, Particulate matter, Binders (Materials)
Proceedings Papers

Study on Stress and Thermal Contraction During Cooling and Demolding in Hot Embossing

Juan A. Gomez, Devanda Lek, In-Hyouk Song, Du-Hwan Chun, Byoung H. You
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A037, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39203
https://doi.org/10.1115/IMECE2014-39203
View Paper titled, Study on Stress and Thermal Contraction During Cooling and Demolding in Hot Embossing
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Topics: Cooling, Embossing, Stress, Thermal expansion, Thermal stresses, Polymers, Adhesion, Shrinkage (Materials), Computer simulation, Deformation
Proceedings Papers

Measurement and Process Control in Precision Hot Embossing

Maia R. Bageant, David E. Hardt
Proc. ASME. IMECE2013, Volume 2A: Advanced Manufacturing, V02AT02A074, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65788
https://doi.org/10.1115/IMECE2013-65788
View Paper titled, Measurement and Process Control in Precision Hot Embossing
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Topics: Embossing, Process control, Cycles, Biomedicine, Deformation, Displacement, Forming equipment (Packaging), Glass transition, Instrumentation, Machinery
Proceedings Papers

Simple, Fast, and Low Cost Fabrication Methods of Microchannels for Manipulation of Living Cells

Anas Alazzam, Bashar El-Khasawneh, Mohammad Abutayeh
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A046, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66152
https://doi.org/10.1115/IMECE2013-66152
View Paper titled, Simple, Fast, and Low Cost Fabrication Methods of Microchannels for Manipulation of Living Cells
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Topics: Biological cells, Manufacturing, Microchannels, Polymers, Microfluidics, Embossing, Fluids, Glass, Additive manufacturing, Adhesives
Proceedings Papers

Multiplex Single Molecule Detection Module for Stroke Diagnosis

D. S. Park, B. B. Lowrey, C. R. Brown, B. H. You, V. Singh, S. A. Soper, A. Baird, M. C. Murphy
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A006, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65524
https://doi.org/10.1115/IMECE2013-65524
View Paper titled, Multiplex Single Molecule Detection Module for Stroke Diagnosis
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Topics: Bonding, Control systems, Copolymers, Embossing, Excitation, Leakage, Microchannels, Phase transition temperature, Plasma desorption mass spectrometry, Polymers
Proceedings Papers

Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing

Juan A. Gomez, Glenn Conner, In-Hyouk Song, Yoo-Jae Kim, Byoung Hee You, Du-Hwan Chun
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A043, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64829
https://doi.org/10.1115/IMECE2013-64829
View Paper titled, Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing
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Topics: Embossing, Finite element analysis, Molding, Polymers, Cavities, Flow (Dynamics), Temperature, Computer software, Finite element methods, Finite element model
Proceedings Papers

Mold Alignment System for Double-Sided Micro Hot Embossing Using Kinematic Constraints

Glenn Conner, Devanda Lek, Juan A. Gomez, In-Hyouk Song, Taehyun Park, Byoung Hee You
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A035, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63670
https://doi.org/10.1115/IMECE2013-63670
View Paper titled, Mold Alignment System for Double-Sided Micro Hot Embossing Using Kinematic Constraints
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Topics: Embossing, Kinematics, Tooling
Proceedings Papers

Design and Fabrication of Rock-Based Micromodel

Daniel S. Park, Saade Bou-Mikael, Sean King, Karsten E. Thompson, Clinton S. Willson, Dimitris E. Nikitopoulos
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 709-715, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88501
https://doi.org/10.1115/IMECE2012-88501
View Paper titled, Design and Fabrication of Rock-Based Micromodel
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Topics: Design, Manufacturing, Rocks, Computational fluid dynamics, Flow (Dynamics), Engineering simulation, Optimization, Particulate matter, Polymers, Simulation
Proceedings Papers

Cavity Filling Analysis for the Fabrication of an Alignment Structure in Micro Hot Embossing

J. A. Gomez, T. G. Conner, I.-H. Song, D.-H. Chun, Y.-J. Kim, B.-H. You
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 333-337, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88441
https://doi.org/10.1115/IMECE2012-88441
View Paper titled, Cavity Filling Analysis for the Fabrication of an Alignment Structure in Micro Hot Embossing
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Topics: Cavities, Embossing, Manufacturing, Polymers, Flow (Dynamics), Molding, Temperature, Computer software, Design, Displacement
Proceedings Papers

Flow Visualization in Artificial Porous Media From Microfluidic PMMA Devices

D. S. Park, S. King, K. E. Thompson, C. S. Willson, D. E. Nikitopoulos
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1159-1166, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65266
https://doi.org/10.1115/IMECE2011-65266
View Paper titled, Flow Visualization in Artificial Porous Media From Microfluidic PMMA Devices
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Topics: Flow visualization, Microfluidics, Porous materials, Particulate matter, Microchannels, Bonding, Brass (Metal), Bubbles, Embossing
Proceedings Papers

Computational Modeling of Polymer Flow in Microcavities Through a Microscreen

Jie Chen, Ranga Pitchumani
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 185-193, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38675
https://doi.org/10.1115/IMECE2010-38675
View Paper titled, Computational Modeling of Polymer Flow in Microcavities Through a Microscreen
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Topics: Computer simulation, Flow (Dynamics), Polymers, Electroforming, Electrodeposition, Embossing, Geometry, Injection molding, Manufacturing, Polymer melts
Proceedings Papers

Fabrication of a Flexible Metal/Polymer Mold With Liquid Crystal Polymer Material for Hot-Embossing Process

Haijing Lu, Xiao Fang Ang, Hongping Liu, Zheng Sun, Jun Wei
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 871-874, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38348
https://doi.org/10.1115/IMECE2010-38348
View Paper titled, Fabrication of a Flexible Metal/Polymer Mold With Liquid Crystal Polymer Material for Hot-Embossing Process
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Topics: Embossing, Liquid crystalline polymers, Manufacturing, Metals, Polymers, Density
Proceedings Papers

3-D Integration of Micro-Gratings Into Bio-Analytical Devices

Bahador Farshchian, Jeong Tae Ok, JaeJong Lee, Sunggook Park
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 481-485, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11934
https://doi.org/10.1115/IMECE2009-11934
View Paper titled, 3-D Integration of Micro-Gratings Into Bio-Analytical Devices
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Topics: Brass (Metal), Crystals, Diffraction gratings, Embossing, Fluids, Microchannels, Microfluidics, Molding, Nanofabrication, Nanoscale phenomena
Proceedings Papers

Microfluidic Reactors for Bioluminescence Detection

Z. Hugh Fan, Qian Mei, Steve Soper
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 773-778, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12464
https://doi.org/10.1115/IMECE2009-12464
View Paper titled, Microfluidic Reactors for Bioluminescence Detection
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Topics: Microfluidics, Enzymes, Calibration, Embossing, Flow (Dynamics), Micromilling, Theoretical analysis
Proceedings Papers

Development and Testing of a Low-Cost Rapid-Cycle Hot Embossing System for Manufacturing Microscale Parts

Melinda Hale, David E. Hardt
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 455-459, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11094
https://doi.org/10.1115/IMECE2009-11094
View Paper titled, Development and Testing of a Low-Cost Rapid-Cycle Hot Embossing System for Manufacturing Microscale Parts
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Topics: Cycles, Embossing, Manufacturing, Microscale devices, Testing, Design, Heating, Ceramics, Heat, Heat sinks
Proceedings Papers

Numerical Modeling and Experimental Study of Hot-Embossing Process for Manufacturing of Microcomponents

Jean-Philippe Marcotte, Kalonji K. Kabanemi, Jean-Franc¸ois He´tu
Proc. ASME. IMECE2009, Volume 14: Processing and Engineering Applications of Novel Materials, 117-126, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10488
https://doi.org/10.1115/IMECE2009-10488
View Paper titled, Numerical Modeling and Experimental Study of Hot-Embossing Process for Manufacturing of Microcomponents
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Topics: Computer simulation, Embossing, Manufacturing, Polymers, Approximation, Compression molding, Contact mechanics, Cooling, Coulomb's law, Dry friction
Proceedings Papers

Microscale Thermoplastic Forming of Bulk Metallic Glasses: Numerical Simulations and Experiments

David L. Henann, Lallit Anand
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 121-127, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67340
https://doi.org/10.1115/IMECE2008-67340
View Paper titled, Microscale Thermoplastic Forming of Bulk Metallic Glasses: Numerical Simulations and Experiments
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Topics: Computer simulation, Metallic glasses, Microscale devices, Embossing, Deformation, Design, Errors, Zirconium
Proceedings Papers

Development of a Low-Cost, Rapid-Cycle Hot Embossing System for Microscale Parts

Melinda Hale, David E. Hardt
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 19-23, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67372
https://doi.org/10.1115/IMECE2008-67372
View Paper titled, Development of a Low-Cost, Rapid-Cycle Hot Embossing System for Microscale Parts
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Topics: Cycles, Embossing, Microscale devices, Design, Heating, Machine design, Ceramics, Heat, Heat sinks, Machinery
Proceedings Papers

On Modeling the Mechanical Behavior of Amorphous Polymers for the Micro-Hot-Embossing of Microfluidic Devices

Vikas Srivastava, Lallit Anand
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 113-120, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67135
https://doi.org/10.1115/IMECE2008-67135
View Paper titled, On Modeling the Mechanical Behavior of Amorphous Polymers for the Micro-Hot-Embossing of Microfluidic Devices
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Topics: Embossing, Mechanical behavior, Microfluidics, Modeling, Polymers, Temperature, Compression, Computer simulation, Constitutive equations, Deformation