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Proceedings Papers

Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages

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Patricia F. Mead, Patrick McCluskey, Qing Yan Chen, Don Haislett
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0735
https://doi.org/10.1115/IMECE1996-0735
View Paper titled, Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages
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Topics: Computer software, Computer-aided design, Failure, Physics, Reliability, Lasers, Light-emitting diodes, Optoelectronic devices, Printed circuit board assemblies, Computer-aided engineering
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

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William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

A Cost Model of New Electronic Products for Use During the Design and Development Phases

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Sammy G. Shina, Anil Saigal
Proc. ASME. IMECE97, Concurrent Product Design and Environmentally Conscious Manufacturing, 67-78, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0008
https://doi.org/10.1115/IMECE1997-0008
View Paper titled, A Cost Model of New Electronic Products for Use During the Design and Development Phases
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Topics: Design, Electronic products, Manufacturing, Simulation, Tradeoffs
Proceedings Papers

Industrial Design to Rapid Mold Making for Accelerated Time-to-Market of Consumer Electronic Products

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Fu-Chung Wang, Juan Plancarte, Paul K. Wright, Vito Fabbrizio, Alan Kramer
Proc. ASME. IMECE99, Manufacturing Science and Engineering, 107-113, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0661
https://doi.org/10.1115/IMECE1999-0661
View Paper titled, Industrial Design to Rapid Mold Making for Accelerated Time-to-Market of Consumer Electronic Products
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Topics: Aluminum, Computer-aided design, Cycles, Design, Electronic products, Electronics, Engineering prototypes, Fingerprints, Industrial design, Manufacturing
Proceedings Papers

Compliant Wafer Level Package

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Chirag Patel, Kevin P. Martin, James D. Meindl
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 53-61, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24706
https://doi.org/10.1115/IMECE2001/EPP-24706
View Paper titled, Compliant Wafer Level Package
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Topics: Semiconductor wafers, Manufacturing, Density, Electronic products, Integrated circuits, Packaging, Semiconductors (Materials)
Proceedings Papers

Design of a Power Waveform Capture Platform for Plug Load Monitoring

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Joseph Hoffbeck, Heather Dillon, Stephen Hildebrand
Proc. ASME. IMECE2016, Volume 6A: Energy, V06AT08A046, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65984
https://doi.org/10.1115/IMECE2016-65984
View Paper titled, Design of a Power Waveform Capture Platform for Plug Load Monitoring
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Topics: Design, Stress, Hardware, Computer software, Computers, Control systems, Electrical measurement, Electronic products, Electronic systems, Storage
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

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Pornvitoo Rittinon, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A053, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-36863
https://doi.org/10.1115/IMECE2014-36863
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture
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Topics: Copper, Texture (Materials), Thermal conductivity, Thin films, Grain boundaries, Heat conduction, Brittle fracture, Electrical resistance, Electrical resistivity, Electron backscatter diffraction
Proceedings Papers

Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact

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Yao Yao
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 757-765, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88629
https://doi.org/10.1115/IMECE2012-88629
View Paper titled, Cohesive Fracture Mechanics Based Finite Element Analysis to the Performance of Lead Free Solders in BGA Packaging Under Drop Impact
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Topics: Ball-Grid-Array packaging, Finite element analysis, Fracture mechanics, Lead-free solders, Solders, Alloys, Packaging, Electronic packaging, Failure, Fracture (Materials)
Proceedings Papers

Low Cost, Open-Loop Temperature Controller for MEMS and Modular Microfluidics Applications

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Brooks B. Lowrey, Christopher R. Brown, Daniel S. Park, Michael C. Murphy
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 335-336, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65543
https://doi.org/10.1115/IMECE2011-65543
View Paper titled, Low Cost, Open-Loop Temperature Controller for MEMS and Modular Microfluidics Applications
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Topics: Microelectromechanical systems, Microfluidics, Temperature controls, Temperature, Control equipment, Thermal reactors, Aluminum, Boundary-value problems, Calibration, Chain
Proceedings Papers

Thermal and Structural Response of Pin Fins for Different Interface Conditions

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Abul Fazal M. Arif, Sulaman Pashah, Syed M. Zubair, M. Inam
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 375-384, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39972
https://doi.org/10.1115/IMECE2010-39972
View Paper titled, Thermal and Structural Response of Pin Fins for Different Interface Conditions
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Topics: Adhesives, Design, Electronic products, Energy dissipation, Finite element methods, Finite element model, Fins, Heat, Heat sinks, Heat transfer
Proceedings Papers

Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps

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Pradeep Lall, Prashant Gupta
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 517-531, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40666
https://doi.org/10.1115/IMECE2010-40666
View Paper titled, Failure-Mode Clustering for Electronics Under Shock and Vibration Using Neural-Net Based Self-Organized Maps
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Topics: Artificial neural networks, Electronics, Failure mechanisms, Shock (Mechanics), Vibration, Failure, Damage, Electronic systems, Fracture (Process), Solders
Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

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Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40803
https://doi.org/10.1115/IMECE2010-40803
View Paper titled, Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits
Proceedings Papers

Investigation of Board-Level and Package-Level Drop Reliability of RF MEMS Packages

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Li Sun, Dana DeReus, Shawn Cunningham, Arthur Morris
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 225-230, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11741
https://doi.org/10.1115/IMECE2009-11741
View Paper titled, Investigation of Board-Level and Package-Level Drop Reliability of RF MEMS Packages
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Topics: MEMS packages, Reliability, Stress, Modeling, Metals, Microelectromechanical systems, Solders, Transients (Dynamics), Electronic products, Excitation
Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

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Farbod Askari Farahani, Moustafa Al-Bassyiouni, Abhigit Dasgupta, Sheldon Tolchinsky
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 137-143, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67749
https://doi.org/10.1115/IMECE2008-67749
View Paper titled, Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
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Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Design, Failure mechanisms, Transients (Dynamics), Circuits, Cycles, Dynamic testing (Materials)
Proceedings Papers

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

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Masaru Ishizuka, Shinji Nakagawa, Tatsuro Yoshida, Wataru Nakayama
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1471-1478, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66091
https://doi.org/10.1115/IMECE2008-66091
View Paper titled, Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel
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Topics: Computational fluid dynamics, Flat heat pipes, Network models, Heat, Temperature, Uncertainty, Computation, Corners (Structural elements), Design, Electronic products
Proceedings Papers

Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability

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Tieyu Zheng, Zhen-Zhong Du
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 333-338, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42366
https://doi.org/10.1115/IMECE2007-42366
View Paper titled, Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability
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Topics: Fatigue, Modeling, Reliability, Solder joints, Ball-Grid-Array packaging, Crack propagation, Electronic products, Fatigue life, Low cycle fatigue, Packaging
Proceedings Papers

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

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Mohammad Yunus, Muthiah Venkateswaran, Peter Borgesen
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 117-123, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39253
https://doi.org/10.1115/IMECE2002-39253
View Paper titled, Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy
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Topics: Alloys, Flip-chip, Flip-chip devices, Lead-free solders, Tin, Solders, Alpha particles, Ceramics, Copper alloys, Electronic products
Proceedings Papers

Highlights From the European Thermal Project PROFIT

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Clemens J. M. Lasance
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 559-564, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42173
https://doi.org/10.1115/IMECE2003-42173
View Paper titled, Highlights From the European Thermal Project PROFIT
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Topics: Electronic products, Modeling, Reliability, Safety, Temperature gradient, Thermal characterization
Proceedings Papers

Test Methodology for Impact Testing of Portable Electronic Products

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J. Varghese, A. Dasgupta
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 71-77, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41844
https://doi.org/10.1115/IMECE2003-41844
View Paper titled, Test Methodology for Impact Testing of Portable Electronic Products
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Topics: Damage, Electronic products, Impact testing, Testing
Proceedings Papers

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

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Erik Jung, Dirk Wojakowski, Alexander Neumann, Rolf Aschenbrenner, Herbert Reichl
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 153-157, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41116
https://doi.org/10.1115/IMECE2003-41116
View Paper titled, Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP
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Topics: Electronic products, Engineering simulation, Finite element methods, Finite element model, Laminates, Manufacturing, Packaging, Printed circuit boards, Silicon, Simulation