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Proceedings Papers

Multiscale Surface Force Models for Adhesive Metasurfaces

Corrisa R. Heyes, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A015, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112720
https://doi.org/10.1115/IMECE2023-112720
View Paper titled, Multiscale Surface Force Models for Adhesive Metasurfaces
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Topics: Adhesives, Modeling, Manufacturing, Nanoscale phenomena, Adhesion, Bonding, Design, Electronic packaging, Metamaterials, Microfabrication
Proceedings Papers

Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages

Patricia F. Mead, Patrick McCluskey, Qing Yan Chen, Don Haislett
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0735
https://doi.org/10.1115/IMECE1996-0735
View Paper titled, Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages
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Topics: Computer software, Computer-aided design, Failure, Physics, Reliability, Lasers, Light-emitting diodes, Optoelectronic devices, Printed circuit board assemblies, Computer-aided engineering
Proceedings Papers

Characterization and Modeling of the Creep Behavior of Xydar G930 Liquid Crystalline Polymer

Vincent DiFilippo, Anil Saigal, Michael A. Zimmerman
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 37-44, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0721
https://doi.org/10.1115/IMECE1996-0721
View Paper titled, Characterization and Modeling of the Creep Behavior of Xydar G930 Liquid Crystalline Polymer
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Topics: Creep, Liquid crystalline polymers, Modeling, Stress, Temperature, Tensile strength, Deformation, Electronic packaging, Failure, Fillers (Materials)
Proceedings Papers

A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials

Minfu Lu, Sheng Liu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 87-92, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0894
https://doi.org/10.1115/IMECE1996-0894
View Paper titled, A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials
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Topics: Electronic packaging, Fatigue, Thermomechanics, Alloys, Calibration, Copper, Lead-free solders, Machinery, Testing, Wire
Proceedings Papers

Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals

M. A. Lambert, L. S. Fletcher
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 207-215, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0045
https://doi.org/10.1115/IMECE1996-0045
View Paper titled, Thermal Contact Conductance of Non-Flat, Rough, Metallic Coated Metals
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Topics: Contact resistance, Metals, Surface roughness, Electrical conductance, Coatings, Cooling, Electrical conductivity, Electronic packaging, Flight, Gas turbines
Proceedings Papers

Applications of Two-State M-Integral to a Triple Junction Vertex Under Thermal Loading

Seyoung Im, Insu Jeon
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 53-61, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0144
https://doi.org/10.1115/IMECE1996-0144
View Paper titled, Applications of Two-State M-Integral to a Triple Junction Vertex Under Thermal Loading
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Topics: Junctions, Eigenfunctions, Wedges, Boundary layers, Composite materials, Electronic packaging, Finite element analysis
Proceedings Papers

On the Routinization of Analysis for Physical Design

Russell S. Peak, Andrew J. Scholand, Robert E. Fulton
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 73-82, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1005
https://doi.org/10.1115/IMECE1996-1005
View Paper titled, On the Routinization of Analysis for Physical Design
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Topics: Design, Electronic packaging, Catalysts, Deformation, Fatigue, Finite element analysis, Printed circuit boards, Product design, Solder joints, Warping
Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1231
https://doi.org/10.1115/IMECE1997-1231
View Paper titled, Testing and Measurement Techniques Applied to Electronic Packaging Development
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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging
Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1222
https://doi.org/10.1115/IMECE1997-1222
View Paper titled, Characterization of Plastic Packages Using (100) Silicon Stress Test Chips
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1229
https://doi.org/10.1115/IMECE1997-1229
View Paper titled, Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry
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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena
Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1236
https://doi.org/10.1115/IMECE1997-1236
View Paper titled, The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging
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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1237
https://doi.org/10.1115/IMECE1997-1237
View Paper titled, Thermal Mechanical Properties of Two Solder Alloys
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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1228
https://doi.org/10.1115/IMECE1997-1228
View Paper titled, Evaluation of Die Stress Using van der Pauw Sensors
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1211
https://doi.org/10.1115/IMECE1997-1211
View Paper titled, Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study
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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1117
https://doi.org/10.1115/IMECE1997-1117
View Paper titled, Sequential Processing Mechanics Modeling for a Model IC Package
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1116
https://doi.org/10.1115/IMECE1997-1116
View Paper titled, Prediction of the Solder Joint Configuration Under Various Geometric Parameters
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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1111
https://doi.org/10.1115/IMECE1997-1111
View Paper titled, Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0818
https://doi.org/10.1115/IMECE1997-0818
View Paper titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds