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Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997

Paper No: IMECE1997-0818

DOI: https://doi.org/10.1115/IMECE1997-0818

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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds

Proceedings Papers

Design Considerations in Avionics Electronic Packaging

Ali Jamnia, Robert E. Walter

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 1-13, November 16–21, 1997

Paper No: IMECE1997-0810

DOI: https://doi.org/10.1115/IMECE1997-0810

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Topics: Avionics, Design, Electronic packaging, Aeronautics, Aviation, Electronic packages, Engineers, Failure, Finite element methods, Packaging

Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997

Paper No: IMECE1997-1116

DOI: https://doi.org/10.1115/IMECE1997-1116

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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 117-123, November 16–21, 1997

Paper No: IMECE1997-1236

DOI: https://doi.org/10.1115/IMECE1997-1236

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Topics: Algorithms, Computers, Displacement, Displacement measurement, Electron microscopy, Electronic packaging, Engineering simulation, Failure, Finite element analysis, Flip-chip assemblies

Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997

Paper No: IMECE1997-1211

DOI: https://doi.org/10.1115/IMECE1997-1211

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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Development and Characterisation of a Oxazolidone-Isocyanurate-Urethane Modified Diglycidyl Ether of Bisphenol A Epoxy Resin

K. S. Chian, S. Yi

Proc. ASME. IMECE99, Polymeric Systems, 51-56, November 14–19, 1999

Paper No: IMECE1999-1204

DOI: https://doi.org/10.1115/IMECE1999-1204

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Topics: Epoxy resins, Ethers (Class of compounds), Urethane elastomers, Resins, Rubber, Adhesives, Fracture toughness, Thermal stability, Aerospace industry, Bearings

Proceedings Papers

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Nancy E. Mathis

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 37-41, November 14–19, 1999

Paper No: IMECE1999-0968

DOI: https://doi.org/10.1115/IMECE1999-0968

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Topics: Fillers (Materials), Thermal management, Electronic packaging, Fibers, Thermal conductivity

Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999

Paper No: IMECE1999-1066

DOI: https://doi.org/10.1115/IMECE1999-1066

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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)

Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001

Paper No: IMECE2001/HTD-24377

DOI: https://doi.org/10.1115/IMECE2001/HTD-24377

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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)

Proceedings Papers

Novel Experimental-Computational Method for Quantitative Applications in Electronic Packaging

Cosme Furlong, Ryszard J. Pryputniewicz

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 251-256, November 11–16, 2001

Paper No: IMECE2001/EPP-24732

DOI: https://doi.org/10.1115/IMECE2001/EPP-24732

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Topics: Electronic packaging, Nondestructive evaluation

Proceedings Papers

Computational and Experimental Study of Laser Microwelding Processes for Electronic Packaging

Wei Han, Ryszard J. Pryputniewicz

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 201-205, November 11–16, 2001

Paper No: IMECE2001/EPP-24725

DOI: https://doi.org/10.1115/IMECE2001/EPP-24725

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Topics: Electronic packaging, Lasers

NARROW

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Design Considerations in Avionics Electronic Packaging

Sequential Processing Mechanics Modeling for a Model IC Package

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Testing and Measurement Techniques Applied to Electronic Packaging Development

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Thermal Mechanical Properties of Two Solder Alloys

Evaluation of Die Stress Using van der Pauw Sensors

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

Stress Analysis of High Density Bare Chip Packaging Technologies

Development and Characterisation of a Oxazolidone-Isocyanurate-Urethane Modified Diglycidyl Ether of Bisphenol A Epoxy Resin

Filler Dispersion Measurements Within Thermal Management Materials for Electronic Applications

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Novel Experimental-Computational Method for Quantitative Applications in Electronic Packaging

Computational and Experimental Study of Laser Microwelding Processes for Electronic Packaging

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