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Proceedings Papers

Protection of Electrical, Electronic, and Electromechanical Parts Against Increasing Random Vibrational Requirements in Space

Alexander Martin
Proc. ASME. IMECE2024, Volume 10: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging, V010T13A013, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145071
https://doi.org/10.1115/IMECE2024-145071
View Paper titled, Protection of Electrical, Electronic, and Electromechanical Parts Against Increasing Random Vibrational Requirements in Space
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Topics: Electronic components, Finite element methods, Finite element model, Flight, Hardware, Instrumentation, Modeling, Probes, Random vibration, Simulation
Proceedings Papers

Tension Control in Filament Winding Using Constant Force Mechanisms

Siwei Ye, Yaru Mo, Haihua Ou, Shun Bi, Shane Johnson
Proc. ASME. IMECE2023, Volume 6: Dynamics, Vibration, and Control, V006T07A057, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114308
https://doi.org/10.1115/IMECE2023-114308
View Paper titled, Tension Control in Filament Winding Using Constant Force Mechanisms
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Topics: Robotics, Tension, Winding (process), Actuators, Control equipment, Fibers, Cables, Force control, Bridges (Structures), Compliant mechanisms
Proceedings Papers

Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation

Enchao Yu, Yogendra K. Joshi
Proc. ASME. IMECE96, Heat Transfer: Volume 2 — Heat Transfer in Turbulent Flows; Fundamentals of Convection Heat Transfer; Fundamentals of Natural Convection in Laminar and Turbulent Flows; Natural Circulation, 323-330, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0083
https://doi.org/10.1115/IMECE1996-0083
View Paper titled, Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation
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Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Heat, Heat transfer, Electronic components, Flow (Dynamics), Irradiation (Radiation exposure), Rayleigh number
Proceedings Papers

Conjugate Mixed Convective Heat Transfer in Electronic Equipment

Prashant Gadepalli, Muhammad M. Rahman
Proc. ASME. IMECE96, Heat Transfer: Volume 2 — Heat Transfer in Turbulent Flows; Fundamentals of Convection Heat Transfer; Fundamentals of Natural Convection in Laminar and Turbulent Flows; Natural Circulation, 219-229, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0073
https://doi.org/10.1115/IMECE1996-0073
View Paper titled, Conjugate Mixed Convective Heat Transfer in Electronic Equipment
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Topics: Boundary layers, Convection, Cooling, Cross-flow, Electronic components, Electronic equipment, Flow (Dynamics), Forced convection, Heat, Heat transfer
Proceedings Papers

Nonlinear Control of Flexible Structures

Shafic S. Oueini, Ali H. Nayfeh, Jon R. Pratt
Proc. ASME. IMECE96, Nonlinear Dynamics and Controls, 135-141, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0449
https://doi.org/10.1115/IMECE1996-0449
View Paper titled, Nonlinear Control of Flexible Structures
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Topics: Actuators, Control equipment, Electronic components, Equations of motion, Feedback, Flexible structures, Nonlinear vibration, Piezoelectric ceramics, Resonance, Sensors
Proceedings Papers

Determination of Temperatures and Heat Fluxes on Surfaces of Multi-Domain Three-Dimensional Electronic Components

Thomas J. Martin, George S. Dulikravich
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 1-9, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0996
https://doi.org/10.1115/IMECE1996-0996
View Paper titled, Determination of Temperatures and Heat Fluxes on Surfaces of Multi-Domain Three-Dimensional Electronic Components
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Topics: Electronic components, Flux (Metallurgy), Heat, Temperature, Algorithms, Boundary-value problems, Boundary element methods, Cavities, Computer software, Heat flux
Proceedings Papers

Investigation of the Effect of Multiple Aging Temperature Profiles on the Constitutive Behavior of Neoprene Rubber Stored in Thermo-Oxidative Environment

Sharif Alazhary, Mamoon Shaafaey, Amir Bahrololoumi, Roozbeh Dargazany
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A033, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-96115
https://doi.org/10.1115/IMECE2022-96115
View Paper titled, Investigation of the Effect of Multiple Aging Temperature Profiles on the Constitutive Behavior of Neoprene Rubber Stored in Thermo-Oxidative Environment
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Topics: Neoprene rubber, Temperature profiles, Oxygen, Temperature, Polymers, Water, Density, Differential scanning calorimetry, Electronic components, Failure
Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1215
https://doi.org/10.1115/IMECE1997-1215
View Paper titled, Transient Thermal Analysis of Outdoor Electronic Equipment
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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability
Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1082
https://doi.org/10.1115/IMECE1997-1082
View Paper titled, Active Structural Control of Vertical Turning Lathe Vibrations
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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components
Proceedings Papers

Optimization of the Compression (Injection/Compression) Molding Process Using Numerical Simulation

Bruce A. Davis, Richard P. Theriault, Tim A. Osswald
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 125-138, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0624
https://doi.org/10.1115/IMECE1997-0624
View Paper titled, Optimization of the Compression (Injection/Compression) Molding Process Using Numerical Simulation
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Topics: Compression, Computer simulation, Molding, Optimization, Design, Simulation, Computers, Fibers, Thermosetting composites, Vehicles
Proceedings Papers

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Hyunjae Park, Nicholas Nigro, Abdel Elkouh, Neil Gollhardt, Ping Lee
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 315-324, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0857
https://doi.org/10.1115/IMECE1997-0857
View Paper titled, Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards
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Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution
Proceedings Papers

Effects of Orifice Geometry on the Heat Transfer Distribution for Impinging Jet Array

Simona C. Arjocu, James A. Liburdy, Michele M. Ferland
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 47-54, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0893
https://doi.org/10.1115/IMECE1997-0893
View Paper titled, Effects of Orifice Geometry on the Heat Transfer Distribution for Impinging Jet Array
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Topics: Geometry, Heat transfer, Jets, Flow (Dynamics), Heat, Heat transfer coefficients, Liquid crystals, Reynolds number, Blades, Cooling
Proceedings Papers

Structural Analysis of a Sensor Module for the “Smart” Bearing

Robert Gao, Priyaranjan Sahay
Proc. ASME. IMECE98, Dynamic Systems and Control, 615-621, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0309
https://doi.org/10.1115/IMECE1998-0309
View Paper titled, Structural Analysis of a Sensor Module for the “Smart” Bearing
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Topics: Bearings, Sensors, Structural analysis, Ball bearings, Deflection, Design, Electronic components, Modal analysis, Packaging, Stress
Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao
Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0879
https://doi.org/10.1115/IMECE1998-0879
View Paper titled, Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space
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Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design
Proceedings Papers

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Ozan Atalay, Murat Gultekin, Sertac Cadirci
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A055, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70472
https://doi.org/10.1115/IMECE2021-70472
View Paper titled, Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink
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Topics: Computational fluid dynamics, Heat sinks, Heat transfer, Design, Modeling, Convection, Cooling, Electric vehicles, Electronic components, Energy consumption
Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1066
https://doi.org/10.1115/IMECE1999-1066
View Paper titled, Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components
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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)
Proceedings Papers

A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)

Anthony J. Rafanelli
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 143-155, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24718
https://doi.org/10.1115/IMECE2001/EPP-24718
View Paper titled, A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)
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Topics: Adhesives, Reliability, Solders, Creep, Fatigue, Fracture mechanics, Electronic components, Stress, Temperature, Thermal shock
Proceedings Papers

Dynamics of the Flows in Micro-Channels of a Capillary Pumped Loop (CPL) Evaporator

Hyoung-In Lee, Hye-Jung Cho, In-Seob Song, Ju-Hyeong Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 171-178, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24212
https://doi.org/10.1115/IMECE2001/HTD-24212
View Paper titled, Dynamics of the Flows in Micro-Channels of a Capillary Pumped Loop (CPL) Evaporator
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Topics: Dynamics (Mechanics), Flow (Dynamics), Microchannels, Capillarity, Cooling, Cycles, Coolants, Design, Electronic components, Energy consumption
Proceedings Papers

Mitigating Environmental and Occupational Health Concerns for the Electronic Demanufacturing Industry

LuAnn Gibson
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 85, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1186
https://doi.org/10.1115/IMECE2000-1186
View Paper titled, Mitigating Environmental and Occupational Health Concerns for the Electronic Demanufacturing Industry
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Topics: Occupational safety and health, Electronics, Computers, Cutting, Electronic components, Electronic equipment, Ergonomics, Errors, Forklifts, Hazardous substances
Proceedings Papers

Equivalent Active Circuits of Distributed Control Systems

H. S. Tzou, J. H. Ding
Proc. ASME. IMECE2000, Control of Vibration and Noise: New Millennium, 195-202, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1782
https://doi.org/10.1115/IMECE2000-1782
View Paper titled, Equivalent Active Circuits of Distributed Control Systems
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Topics: Circuits, Control systems, Electronic circuits, Modeling, Signals, Actuators, Distributed parameter systems, Dynamics (Mechanics), Electronic components, Finite difference methods