1-20 of 121
Computer cooling
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Heat Transfer From a Flush-Mounted Heat Source-Limiting Cases and the Conjugate Peclet Number

K. D. Cole
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 145-157, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1347
https://doi.org/10.1115/IMECE1996-1347
View Paper titled, Heat Transfer From a Flush-Mounted Heat Source-Limiting Cases and the Conjugate Peclet Number
Open the PDF for Heat Transfer From a Flush-Mounted Heat Source-Limiting Cases and the Conjugate Peclet Number in another window
Topics: Heat, Heat transfer, Computer cooling, Flat plates, Flow (Dynamics), Fluids, Integral equations
Proceedings Papers

High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems

Andrzej J. Przekwas, Mahesh M. Athavale, Yin-H. Ho
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 27-32, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0999
https://doi.org/10.1115/IMECE1996-0999
View Paper titled, High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems
Open the PDF for High Resolution Thermal Design Tools for Air-Cooled Electronics Components and Systems in another window
Topics: Design, Electronics, Resolution (Optics), Computer simulation, Heat, Heat sinks, Computer cooling, Computers, Cooling, Defense industry
Proceedings Papers

The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers

Dereje Agonafer, Liao Gan-Li, D. Brian Spalding
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 23-26, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0998
https://doi.org/10.1115/IMECE1996-0998
View Paper titled, The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers
Open the PDF for The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers in another window
Topics: Heat transfer, Reynolds number, Turbulence, Computer cooling, Geometry
Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0853
https://doi.org/10.1115/IMECE1997-0853
View Paper titled, Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package
Open the PDF for Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package in another window
Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number
Proceedings Papers

Effectiveness of Open-Cell Metallic Foams for High Power Electronic Cooling

Ashraf-F. Bastawros
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 211-217, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0655
https://doi.org/10.1115/IMECE1998-0655
View Paper titled, Effectiveness of Open-Cell Metallic Foams for High Power Electronic Cooling
Open the PDF for Effectiveness of Open-Cell Metallic Foams for High Power Electronic Cooling in another window
Topics: Computer cooling, Metal foams, Pressure drop, Heat, Cross-flow, Cylinders, Design, Flow (Dynamics), Fluids, Forced convection
Proceedings Papers

Characterization of Electric Fan Noise Generation Due to Blade Geometry

Liliosa-Eyang Cole, Fred Barez
Proc. ASME. IMECE2021, Volume 1: Acoustics, Vibration, and Phononics, V001T01A001, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-68201
https://doi.org/10.1115/IMECE2021-68201
View Paper titled, Characterization of Electric Fan Noise Generation Due to Blade Geometry
Open the PDF for Characterization of Electric Fan Noise Generation Due to Blade Geometry in another window
Topics: Blades, Geometry, Noise (Sound), Sound pressure, Flow (Dynamics), Noise control, Pressure, Rotors, Aerodynamic noise, Computational fluid dynamics
Proceedings Papers

Development of a Topology-Optimized Structure for Electronics Cooling Under Natural Convection Conditions

Yao Song See, Jin Yao Ho, Kai Choong Leong, Teck Neng Wong
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A002, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70712
https://doi.org/10.1115/IMECE2021-70712
View Paper titled, Development of a Topology-Optimized Structure for Electronics Cooling Under Natural Convection Conditions
Open the PDF for Development of a Topology-Optimized Structure for Electronics Cooling Under Natural Convection Conditions in another window
Topics: Computer cooling, Lasers, Melting, Natural convection, Optimization, Phase change materials, Topology
Proceedings Papers

Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe

A. Hoelke, H. T. Henderson, F. M. Gerner, M. Kazmierczak
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 53-60, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1062
https://doi.org/10.1115/IMECE1999-1062
View Paper titled, Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe
Open the PDF for Analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe in another window
Topics: Heat pipes, Heat transfer, Micromachining, Silicon, Computer cooling, Ducts, Heat, Heat flux, Microfabrication, Network analysis
Proceedings Papers

High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics

Andrzej J. Przekwas, Zhijian Chen, Marek Turowski
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 475-481, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0308
https://doi.org/10.1115/IMECE1999-0308
View Paper titled, High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics
Open the PDF for High Fidelity and Compact Models of Synthetic Jets and Their Application in Aerodynamics and Microelectronics in another window
Topics: Aerodynamics, Jets, Microelectronic devices, Modeling, Simulation, Aerodynamic flow, Computational fluid dynamics, Computer cooling, Flow (Dynamics), Fluid mechanics
Proceedings Papers

Capillary Pumped Loop Heat Spreader for Electronics Cooling

Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 283-290, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24405
https://doi.org/10.1115/IMECE2001/HTD-24405
View Paper titled, Capillary Pumped Loop Heat Spreader for Electronics Cooling
Open the PDF for Capillary Pumped Loop Heat Spreader for Electronics Cooling in another window
Topics: Computer cooling, Flat heat pipes
Proceedings Papers

Three-Dimensional Flow and Heat Transfer Calculations in Micro-Channel Heat Exchangers

A. K. Saha, Sumanta Acharya
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 199-208, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24394
https://doi.org/10.1115/IMECE2001/HTD-24394
View Paper titled, Three-Dimensional Flow and Heat Transfer Calculations in Micro-Channel Heat Exchangers
Open the PDF for Three-Dimensional Flow and Heat Transfer Calculations in Micro-Channel Heat Exchangers in another window
Topics: Flow (Dynamics), Heat exchangers, Heat transfer, Microchannels, Reynolds number, Cylinders, Friction, Computer cooling, Convection, Cooling
Proceedings Papers

Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation

Assunta Andreozzi, Oronzio Manca, Biagio Morrone
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 3-12, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24372
https://doi.org/10.1115/IMECE2001/HTD-24372
View Paper titled, Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation
Open the PDF for Effects of an Auxiliary Plate Position on Natural Convection in a Vertical Channel With Radiation in another window
Topics: Natural convection, Radiation (Physics), Radiative heat transfer, Wall temperature, Emissivity, Rayleigh number, Computer cooling, Heat flux, Heat transfer, Telecommunications
Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

S. I. Haider, Yogendra K. Joshi, Wataru Nakayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24395
https://doi.org/10.1115/IMECE2001/HTD-24395
View Paper titled, A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling
Open the PDF for A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling in another window
Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids
Proceedings Papers

Computation of Natural Convection in Channels With Staggered Pin Fins

Dhanunjay S. Boyalakuntla, Jayathi Y. Murthy, Cristina H. Amon
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 129-137, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24386
https://doi.org/10.1115/IMECE2001/HTD-24386
View Paper titled, Computation of Natural Convection in Channels With Staggered Pin Fins
Open the PDF for Computation of Natural Convection in Channels With Staggered Pin Fins in another window
Topics: Computation, Computer cooling, Cooling, Design, Electronics, Exterior walls, Finite volume methods, Fins, Flow (Dynamics), Heat flux
Proceedings Papers

Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers

Ali Heydari, Kathy Russell
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 83-93, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24710
https://doi.org/10.1115/IMECE2001/EPP-24710
View Paper titled, Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers
Open the PDF for Miniature Vapor Compression Refrigeration Systems for Active Cooling of High Performance Computers in another window
Topics: Compression, Computers, Cooling, Refrigeration, Vapors, Compressors, Refrigerants, Condensers (steam plant), Heat exchangers, Clearances (Engineering)
Proceedings Papers

A Mixed Thermal Convection Criteria for a Printed Circuit Board

E. Kehoe, R. Grimes, M. Davies
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 95-103, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24711
https://doi.org/10.1115/IMECE2001/EPP-24711
View Paper titled, A Mixed Thermal Convection Criteria for a Printed Circuit Board
Open the PDF for A Mixed Thermal Convection Criteria for a Printed Circuit Board in another window
Topics: Convection, Printed circuit boards, Mixed convection, Cylinders, Electronic systems, Reynolds number, Temperature distribution, Buoyancy, Computer cooling, Cross-flow
Proceedings Papers

Two-Phase Flow in Microchannels

G. Hetsroni, A. Mosyak, Z. Segal
Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 87-93, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24204
https://doi.org/10.1115/IMECE2001/HTD-24204
View Paper titled, Two-Phase Flow in Microchannels
Open the PDF for Two-Phase Flow in Microchannels in another window
Topics: Microchannels, Two-phase flow, Flow (Dynamics), Heat sinks, Temperature, Boiling, Computer cooling, Fluids, Heat transfer, Imaging
Proceedings Papers

Emerging Technologies and Research Issues in Nontraditional Manufacturing

Y. Lawrence Yao, Richard N. Smith, Ralph L. Resnick, K. P. Rajurkar, John H. Givens, Warren E. Maher, Bin Wei
Proc. ASME. IMECE2001, Manufacturing Engineering, 469-472, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MED-23352
https://doi.org/10.1115/IMECE2001/MED-23352
View Paper titled, Emerging Technologies and Research Issues in Nontraditional Manufacturing
Open the PDF for Emerging Technologies and Research Issues in Nontraditional Manufacturing in another window
Topics: Manufacturing, Packaging, Simulation, Electronics, Modeling, Adhesives, Computer cooling, Concurrent engineering, Hardening (Curing), Lamination
Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23820
https://doi.org/10.1115/IMECE2001/MEMS-23820
View Paper titled, Microscale Liquid Impingement Cooling
Open the PDF for Microscale Liquid Impingement Cooling in another window
Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices
Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe
Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MED-23350
https://doi.org/10.1115/IMECE2001/MED-23350
View Paper titled, Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages
Open the PDF for Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages in another window
Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes