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Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0931
https://doi.org/10.1115/IMECE1997-0931
View Paper titled, High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching
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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics
Proceedings Papers

Digital Micromirror Device™: Commercialization of a Massively Parallel MEMS Technology

Larry J. Hornbeck, T. Russ Howell, Richard L. Knipe, Michael A. Mignardi
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 3-8, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0930
https://doi.org/10.1115/IMECE1997-0930
View Paper titled, Digital Micromirror Device™: Commercialization of a Massively Parallel MEMS Technology
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Topics: Microelectromechanical systems, Circuits, Complementary metal oxide semiconductors, Manufacturing, Reliability, Resolution (Optics), Switches
Proceedings Papers

Convection-Based Accelerometer and Tilt Sensor Implemented in Standard CMOS

Veljko Milanović, Edwin Bowen, Nim Tea, John Suehle, Beverly Payne, Mona Zaghloul, Michael Gaitan
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 487-490, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1289
https://doi.org/10.1115/IMECE1998-1289
View Paper titled, Convection-Based Accelerometer and Tilt Sensor Implemented in Standard CMOS
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Topics: Accelerometers, Complementary metal oxide semiconductors, Convection, Sensors, Temperature, Temperature sensors, Bridges (Structures), Errors, Natural convection, Thermocouples
Proceedings Papers

First Discrete Time Full-System Inertial Microsensor Performance Simulation Tool

Michael D. Pottenger, William J. Kaiser
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 519-524, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1294
https://doi.org/10.1115/IMECE1998-1294
View Paper titled, First Discrete Time Full-System Inertial Microsensor Performance Simulation Tool
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Topics: Microsensors, Simulation, Resonance, Noise (Sound), Sensors, Bridges (Structures), Circuits, Complementary metal oxide semiconductors, Dynamics (Mechanics), Feedback
Proceedings Papers

MEMS Codesign: First Full-System Inertial Microsensor Design Tool

Michael D. Pottenger, William J. Kaiser
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1304
https://doi.org/10.1115/IMECE1998-1304
View Paper titled, MEMS Codesign: First Full-System Inertial Microsensor Design Tool
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Topics: Design, Microelectromechanical systems, Microsensors, Modeling, Noise (Sound), Sensors, Simulation, Bridges (Structures), Circuits, Complementary metal oxide semiconductors
Proceedings Papers

Utilization of Standard CMOS Layers for Microchannels

Angela Rasmussen, Laurie E. Locascio, Michael Gaitan, Mona E. Zaghloul
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 407-411, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1277
https://doi.org/10.1115/IMECE1998-1277
View Paper titled, Utilization of Standard CMOS Layers for Microchannels
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Topics: Complementary metal oxide semiconductors, Microchannels, Micromachining, Actuators, Electronics, Integrated circuits, Metals, Sensors
Proceedings Papers

Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD

Chi-Te Chin, James N. Fordemwalt, Jong-I Mou
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 53-58, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1015
https://doi.org/10.1115/IMECE1998-1015
View Paper titled, Virtual Fabrication of an 0.25 um Integrated Circuit Device Using TCAD
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Topics: Circuits, Complementary metal oxide semiconductors, Computer-aided design, Delays, Diffusion (Physics), Gates (Closures), Integrated circuits, Junctions, Manufacturing, Metal oxide semiconductors
Proceedings Papers

Temperature Distribution in a VLSI Chip due to Dynamic Power Density

Shahriar Jahanian, Z. J. Delalic
Proc. ASME. IMECE99, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections, 21-24, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1183
https://doi.org/10.1115/IMECE1999-1183
View Paper titled, Temperature Distribution in a VLSI Chip due to Dynamic Power Density
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Topics: Power density, Temperature distribution, Energy dissipation, Complementary metal oxide semiconductors, Failure, Circuits, Computation, Heat, Signals
Proceedings Papers

Sputtered Silicon for Microstructures and Microcavities

Kenneth A. Honer, Gregory T. A. Kovacs
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 43-48, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0244
https://doi.org/10.1115/IMECE1999-0244
View Paper titled, Sputtered Silicon for Microstructures and Microcavities
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Topics: Silicon, Porosity, Aluminum, Annealing, Cantilevers, Cavities, Complementary metal oxide semiconductors, Density, Electrical resistivity, Film thickness
Proceedings Papers

A New Driving Principle for Micromechanical Torsional Actuators

Harald Schenk, Peter Dürr, Detlef Kunze, Heinz Kück
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 333-338, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0288
https://doi.org/10.1115/IMECE1999-0288
View Paper titled, A New Driving Principle for Micromechanical Torsional Actuators
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Topics: Actuators, Deflection, Electrodes, Oscillations, Capacitance, Complementary metal oxide semiconductors, Excitation, Finite element methods, Finite element model
Proceedings Papers

Tunable Phase Grating Using CMOS Processes

Yu-Sheng Yang, Cheng-Hsien Liu, Bruce C. S. Chou
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 77-82, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23811
https://doi.org/10.1115/IMECE2001/MEMS-23811
View Paper titled, Tunable Phase Grating Using CMOS Processes
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Topics: Complementary metal oxide semiconductors, Diffraction gratings, Microelectromechanical systems, Design, Aluminum, Dry etching, Electrodes, Electrostatic actuators, Modeling, Reactive-ion etching
Proceedings Papers

A New Assembly-Transferred Microwave Switch With Suspended CMOS-Compatible Coplanar Waveguides

Jen-Yi Chen, Long-Sun Huang, Chia-Hua Chu, I-Yin Li, Yao-Hui Kuo, Peizen Chang
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 65-69, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23809
https://doi.org/10.1115/IMECE2001/MEMS-23809
View Paper titled, A New Assembly-Transferred Microwave Switch With Suspended CMOS-Compatible Coplanar Waveguides
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Topics: Complementary metal oxide semiconductors, Manufacturing, Microelectromechanical systems, Microwaves, Switches, Waveguides, Microassembling, Micromachining, Resonance, Transmission lines
Proceedings Papers

A CMOS-MEMS Micromirror With Large Out-of-Plane Actuation

Huikai Xie, Yingtian Pan, Gary K. Fedder
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 89-92, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23813
https://doi.org/10.1115/IMECE2001/MEMS-23813
View Paper titled, A CMOS-MEMS Micromirror With Large Out-of-Plane Actuation
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Topics: Complementary metal oxide semiconductors, Microelectromechanical systems, Mirrors, Silicon, Aluminum, Bonding, Capacitance, Capacitors, Crystals, Displacement
Proceedings Papers

Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism

M. Adrian Michalicek, Victor M. Bright
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 57-64, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23808
https://doi.org/10.1115/IMECE2001/MEMS-23808
View Paper titled, Flip-Chip Fabrication of Advanced MEMS Using a Novel Latching Off-Chip Hinge Mechanism
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Topics: Flip-chip, Hinges, Manufacturing, Microelectromechanical systems, Bonding, Design, Micromachining, Adhesives, Ceramics, Complementary metal oxide semiconductors
Proceedings Papers

Micromachined Flexible Interconnect for Wafer Level Packaging

Yeun-Ho Joung, Mark G. Allen
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 745-749, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23905
https://doi.org/10.1115/IMECE2001/MEMS-23905
View Paper titled, Micromachined Flexible Interconnect for Wafer Level Packaging
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Topics: Microelectromechanical systems, Micromachining, Packaging, Semiconductor wafers, Stress, Bonding, Complementary metal oxide semiconductors, Deflection, Density, Finite element analysis
Proceedings Papers

High Density Through-Wafer Electrical Interconnects for Direct-Chip-Attach, Device-Scale MEMS Packaging

Jordan Neysmith, Daniel F. Baldwin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 595-599, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1151
https://doi.org/10.1115/IMECE2000-1151
View Paper titled, High Density Through-Wafer Electrical Interconnects for Direct-Chip-Attach, Device-Scale MEMS Packaging
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Topics: Density, MEMS packaging, Semiconductor wafers, Solders, Complementary metal oxide semiconductors, Manufacturing, Metallurgy, Signals
Proceedings Papers

RF-Switches in MEMS Technology for the Integration in Communication Applications

Sven Michaelis, Florian Ploetz, Robert Aigner, Hans-Joerg Timme, Josef Binder, Reinhold Noe
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 75-80, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1074
https://doi.org/10.1115/IMECE2000-1074
View Paper titled, RF-Switches in MEMS Technology for the Integration in Communication Applications
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Topics: Microelectromechanical systems, Switches, Assembly lines, Complementary metal oxide semiconductors, Design, Filters, Micromachining, Torsion
Proceedings Papers

A Visually Servoed Active Camera for Miniature Mobile Robots

Kemal B. Yesin, Bradley J. Nelson
Proc. ASME. IMECE2000, Dynamic Systems and Control: Volume 2, 965-972, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2400
https://doi.org/10.1115/IMECE2000-2400
View Paper titled, A Visually Servoed Active Camera for Miniature Mobile Robots
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Topics: Actuators, Algorithms, Complementary metal oxide semiconductors, Mobile robots, Motors, Robots, Sensors, Weight (Mass)
Proceedings Papers

The Moving Liquid Mirror (MLM) Spatial Light Modulator: Simulation and Measurement of the Optical Performance

Alexander Wolter, Detlef Kunze, Wolfgang Doleschal, Hubert Lakner, Günter Zimmer
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 437-442, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1128
https://doi.org/10.1115/IMECE2000-1128
View Paper titled, The Moving Liquid Mirror (MLM) Spatial Light Modulator: Simulation and Measurement of the Optical Performance
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Topics: Mirrors, Simulation, Actuators, Complementary metal oxide semiconductors, Aluminum, Circuits, Electrodes, Electro-optics, Generators, Microscopes