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Proceedings Papers

Compliant Terrestrial Robot Development and Control System Design

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Trevor Harms, Minchul Shin
Proc. ASME. IMECE2024, Volume 5: Dynamics, Vibration, and Control, V005T07A061, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144691
https://doi.org/10.1115/IMECE2024-144691
View Paper titled, Compliant Terrestrial Robot Development and Control System Design
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Topics: Control systems, Design, Robots, Advanced materials, Smart materials, Ceramics, Geometry, Heating, Metals, Performance
Proceedings Papers

Preliminary Study on the Tribological Performance of Ceramic on Laser-Textured Polymer Contacts for Artificial Hip Applications

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Sandhya Vaidyanathan, Juan Manuel Vazquez, Jorge Salguero, Patricia Iglesias
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A014, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-143558
https://doi.org/10.1115/IMECE2024-143558
View Paper titled, Preliminary Study on the Tribological Performance of Ceramic on Laser-Textured Polymer Contacts for Artificial Hip Applications
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Topics: Ceramics, Friction, Hip joint prostheses, Lasers, Polymers, Tribology, Wear
Proceedings Papers

On the 3D Printing of Reinforced Concrete

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Seyed M. Allameh, Hadi Allameh, Roger Miller, Avery Lenihan, Dhruv Kota
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A044, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112719
https://doi.org/10.1115/IMECE2023-112719
View Paper titled, On the 3D Printing of Reinforced Concrete
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Topics: Additive manufacturing, Reinforced concrete, Concretes, Concrete beams, Construction, Fatigue limit, Steel, Tensile strength, Bridges (Structures), Construction industry
Proceedings Papers

Shielding of Spacecraft and Satellites From Micrometeorites and Space Debris

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Nishant Thakkar, Davide Piovesan
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A029, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-114050
https://doi.org/10.1115/IMECE2023-114050
View Paper titled, Shielding of Spacecraft and Satellites From Micrometeorites and Space Debris
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Topics: Composite materials, Satellites, Space vehicles, Ceramics, Astronauts, Hazards, Impact testing, Insulation, Molecular weight, Polymers
Proceedings Papers

Experimental Research on Photo-Induced PLZT-Based Electrostatic Micro Gripper

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Zhen Lv, Zhicheng Liu, Yujuan Tang, Xinjie Wang
Proc. ASME. IMECE2023, Volume 6: Dynamics, Vibration, and Control, V006T07A052, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112219
https://doi.org/10.1115/IMECE2023-112219
View Paper titled, Experimental Research on Photo-Induced PLZT-Based Electrostatic Micro Gripper
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Topics: Electrostatic actuators, Grippers, Actuators, Ceramics, Composite materials, Electricity (Physics), Microactuators, Photoelectric effect, Photolithography, Ultraviolet radiation
Proceedings Papers

Small Cracks and High-Cycle Fatigue

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R. O. Ritchie
Proc. ASME. IMECE96, Aerospace, 321-333, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0641
https://doi.org/10.1115/IMECE1996-0641
View Paper titled, Small Cracks and High-Cycle Fatigue
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Topics: Fracture (Materials), High cycle fatigue, Dimensions, Damage, Aircraft, Alloys, Ceramics, Design, Failure, Fatigue cracks
Proceedings Papers

Life Prediction for Composite Material Structures

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Brice N. Cassenti, Herbert Koenig
Proc. ASME. IMECE96, Aerospace, 381-388, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0648
https://doi.org/10.1115/IMECE1996-0648
View Paper titled, Life Prediction for Composite Material Structures
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Topics: Composite materials, Finite element analysis, Diffusion (Physics), Fibers, Cycles, Chemical kinetics, Manufacturing, Advanced materials, Ceramics, Damage
Proceedings Papers

Cracking in Ferroelectric and Antiferroelectric Ceramic Multilayer Actuators

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Xiaoyan Gong, Honghui Yu, Zhigang Suo, Robert M. McMeeking
Proc. ASME. IMECE96, Aerospace, 703-712, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0686
https://doi.org/10.1115/IMECE1996-0686
View Paper titled, Cracking in Ferroelectric and Antiferroelectric Ceramic Multilayer Actuators
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Topics: Actuators, Ceramics, Cracking (Materials), Fracture (Process), Electric fields, Displacement, Electrodes, Phase transitions, Stress, Breakdown (Electricity)
Proceedings Papers

New Fabrication Process for Active Micro-Sized Metal/Ceramic Devices

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James D. Ervin, Diann Brei, Charles A. Van Hoy, Jennifer R. Mawdsley, John W. Halloran
Proc. ASME. IMECE96, Aerospace, 695-702, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0685
https://doi.org/10.1115/IMECE1996-0685
View Paper titled, New Fabrication Process for Active Micro-Sized Metal/Ceramic Devices
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Topics: Ceramics, Manufacturing, Metals, Shapes, Actuators, Composite materials, Electrodes, Extruding, Fire, Laminates
Proceedings Papers

Combustors for Micro-Gas Turbine Engines

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Ian A. Waitz, Gautam Gauba, Yang-Sheng Tzeng
Proc. ASME. IMECE96, Aerospace, 777-788, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0694
https://doi.org/10.1115/IMECE1996-0694
View Paper titled, Combustors for Micro-Gas Turbine Engines
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Topics: Combustion chambers, Gas turbines, Combustion, Hydrogen, Ceramics, Cooling, Design, Flames, Fossil fuels, Heat transfer
Proceedings Papers

Control of Machining Induced Edge Chipping on Glass Ceramics

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Stanley J. Ng, Dung T. Le, Shelly R. Tucker, Guangming Zhang
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 229-236, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0789
https://doi.org/10.1115/IMECE1996-0789
View Paper titled, Control of Machining Induced Edge Chipping on Glass Ceramics
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Topics: Glass ceramics, Machining, Ceramics, Damage, Finite element methods, Glass
Proceedings Papers

Grinding of Reaction Bonded Silicon Nitride (RBSN) Ceramic

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John E. Mayer, Jr., Gwo-Ping Fang, James P. Edler
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 267-271, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0794
https://doi.org/10.1115/IMECE1996-0794
View Paper titled, Grinding of Reaction Bonded Silicon Nitride (RBSN) Ceramic
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Topics: Ceramics, Grinding, Silicon nitride ceramics, Wheels, Bending strength, Finishes, Machinery
Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

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Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

A Systems Approach for Simulation and Production Implementation of Thru-Feed Centerless Grinding of Ceramics

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Darryl J. Gust, Albert J. Shih, Marc Tricard, K. Subramanian
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 281-290, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0796
https://doi.org/10.1115/IMECE1996-0796
View Paper titled, A Systems Approach for Simulation and Production Implementation of Thru-Feed Centerless Grinding of Ceramics
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Topics: Ceramics, Grinding, Simulation, Diamonds, Grinding wheels, Finishes, Wheels, Machine tools, Abrasives, Composite materials
Proceedings Papers

Three Dimensional Simulation Method for the Analysis of a Ceramic Grinding Process

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I-Chung Joseph Lin, Guruswami Sathyanarayanan, Louis J. Plebani, William L. Buehler
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 251-258, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0792
https://doi.org/10.1115/IMECE1996-0792
View Paper titled, Three Dimensional Simulation Method for the Analysis of a Ceramic Grinding Process
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Topics: Ceramics, Grinding, Simulation, Cutting, Diamonds, Electrons, Grinding wheels, Kinematic analysis, Wheels
Proceedings Papers

An Analytical Study of Investment Casting With Webbed Epoxy Patterns

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W. L. Yao, H. Wong, M. C. Leu, D. H. Sebastian
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 11-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0770
https://doi.org/10.1115/IMECE1996-0770
View Paper titled, An Analytical Study of Investment Casting With Webbed Epoxy Patterns
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Topics: Epoxy adhesives, Epoxy resins, Investment casting (Process), Investment castings, Finite element analysis, Geometry, Stress, Thermal expansion, Buckling, Ceramics
Proceedings Papers

Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling

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Bor Zen Hong, Tsorng-Dih Yuan, Lloyd G. Burrell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 39-46, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0888
https://doi.org/10.1115/IMECE1996-0888
View Paper titled, Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling
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Topics: Fatigue analysis, Solder joints, Fatigue, Temperature, Air flow, Alloys, Ball-Grid-Array packaging, Ceramics, Cycles, Deformation
Proceedings Papers

Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits

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Nickolaos Strifas, Aris Christou
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 109-114, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0897
https://doi.org/10.1115/IMECE1996-0897
View Paper titled, Polymer Based Flip Chip Interconnect Materials for Monolithic Integrated Circuits
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Topics: Flip-chip, Flip-chip devices, Integrated circuits, Polymers, Anisotropy, Ceramics, Finite element analysis, Heat, Simulation results, Stress
Proceedings Papers

Thermal Management of Flip Chips on Printed Circuit Boards

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Ron Zhang, Darrel Peugh, Bruce Myers
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 73-79, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0892
https://doi.org/10.1115/IMECE1996-0892
View Paper titled, Thermal Management of Flip Chips on Printed Circuit Boards
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Topics: Flip-chip devices, Printed circuit boards, Thermal management, Ceramics, Electronics, Energy dissipation, Power density, Reliability, Shrinkage (Materials)
Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

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Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure