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Proceedings Papers

Comparison of Vibrational Impacts on Tensile Strength in 3D Printing Materials

Sohail Zaidi, Vimal Viswanathan, K. C. Santosh, Shreyas Ravada, Ayati Vyas
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A110, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145575
https://doi.org/10.1115/IMECE2024-145575
View Paper titled, Comparison of Vibrational Impacts on Tensile Strength in 3D Printing Materials
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Topics: Additive manufacturing, Tensile strength, Porosity, Oscillating frequencies, Vibration, ASTM International, Bonding, Load bearing capacity, Machinery, Manufacturing
Proceedings Papers

Correlating Titanium Powder Manufacturing Methods and Resultant Particle Morphologies to Microstructural Properties, Particle Flight and Impact Velocity, and Bonding and Deposition Characteristics in Cold Spray Additive Manufacturing

Pranav Anumandla, Carlos Pfeiff, Sinan Müftü, Edward J. Garboczi, Newell H. Moser, Rachel E. Cook, Nicholas A. Derimow, Ozan Cagatay Ozdemir
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A086, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145643
https://doi.org/10.1115/IMECE2024-145643
View Paper titled, Correlating Titanium Powder Manufacturing Methods and Resultant Particle Morphologies to Microstructural Properties, Particle Flight and Impact Velocity, and Bonding and Deposition Characteristics in Cold Spray Additive Manufacturing
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Topics: Additive manufacturing, Bonding, Flight, Manufacturing, Particle collisions, Particle size, Particulate matter, Shapes, Sprays, Titanium
Proceedings Papers

Optimizing Mechanical Performance of Carbon Fiber Reinforced Polyphenylene Sulfide Thermoplastic Film Composite via Hot Press Technique

Nitin More, Ram V. Mohan
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A023, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145616
https://doi.org/10.1115/IMECE2024-145616
View Paper titled, Optimizing Mechanical Performance of Carbon Fiber Reinforced Polyphenylene Sulfide Thermoplastic Film Composite via Hot Press Technique
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Topics: Carbon fibers, Composite materials, Equipment performance, Polyphenylene sulfide, Mechanical properties, Carbon, Fibers, Pressure, Temperature, Textiles
Proceedings Papers

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

Yao Qiao, Seunghyun Ko, Yongsoon Shin, Jose L. Ramos, Justin L. Olson, Kevin L. Simmons
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A018, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139915
https://doi.org/10.1115/IMECE2024-139915
View Paper titled, Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures
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Topics: Adhesive joints, Adhesives, Bonding, Epoxy adhesives, Epoxy resins, Hardening (Curing), Plasmas (Ionized gases), Polymer composites, Pressure
Proceedings Papers

Improved De-Bonding of Composite Adhesive Joints With Bondline Inserts

Khushboo Tedlapu, Marco Gerini-Romagnoli
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A036, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145777
https://doi.org/10.1115/IMECE2024-145777
View Paper titled, Improved De-Bonding of Composite Adhesive Joints With Bondline Inserts
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Topics: Adhesive joints, Adhesives, Bonding, Composite materials, Particulate matter, Shear (Mechanics), Testing
Proceedings Papers

The Damping Characteristics of a Cantilever Structure With a Lap-Type Adhesive Joint

Takashi Kobayashi
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 63-68, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1345
https://doi.org/10.1115/IMECE1997-1345
View Paper titled, The Damping Characteristics of a Cantilever Structure With a Lap-Type Adhesive Joint
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Topics: Adhesive joints, Cantilevers, Damping, Bolted joints, Bonding
Proceedings Papers

Study of Adhesive Joints Quality Based on Multi-Camera DIC System

Bicheng Guo, Zhongfang Gao, Marco Gerini-Romagnoli, Lianxiang Yang
Proc. ASME. IMECE2023, Volume 3: Advanced Manufacturing, V003T03A035, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113687
https://doi.org/10.1115/IMECE2023-113687
View Paper titled, Study of Adhesive Joints Quality Based on Multi-Camera DIC System
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Topics: Adhesive joints, Adhesives, Bonding, Calibration, Carbon reinforced plastics, Deformation, Fracture (Materials), Fracture (Process), Carbon, Cohesion
Proceedings Papers

Multiscale Surface Force Models for Adhesive Metasurfaces

Corrisa R. Heyes, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A015, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112720
https://doi.org/10.1115/IMECE2023-112720
View Paper titled, Multiscale Surface Force Models for Adhesive Metasurfaces
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Topics: Adhesives, Modeling, Manufacturing, Nanoscale phenomena, Adhesion, Bonding, Design, Electronic packaging, Metamaterials, Microfabrication
Proceedings Papers

Error Budget of Wafer Bonding Alignment System Based on Machine Vision

Rui Wang, Sen Lu, Kaiming Yang, Yu Zhu
Proc. ASME. IMECE2023, Volume 3: Advanced Manufacturing, V003T03A090, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112938
https://doi.org/10.1115/IMECE2023-112938
View Paper titled, Error Budget of Wafer Bonding Alignment System Based on Machine Vision
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Topics: Bonding, Errors, Machinery, Semiconductor wafers
Proceedings Papers

On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)

Aoi Takagi, Yuichi Hosoya, Shotaro Yasuda, Kazuma Ogata, Tomo Takeda, Akio Yonezu
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A059, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113400
https://doi.org/10.1115/IMECE2023-113400
View Paper titled, On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)
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Topics: Adhesion, Adhesives, Bonding, Carbon reinforced plastics, Delamination, Epoxy adhesives, Epoxy resins, Lasers, Shock (Mechanics)
Proceedings Papers

Characterization of Inelastic Deformation During the Transverse Loading of Weakly-Bonded Unidirectional Metal Matrix Composites

Richard W. Neu, Joseph L. Kroupa
Proc. ASME. IMECE96, Aerospace and Materials, 141-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0474
https://doi.org/10.1115/IMECE1996-0474
View Paper titled, Characterization of Inelastic Deformation During the Transverse Loading of Weakly-Bonded Unidirectional Metal Matrix Composites
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Topics: Deformation, Metal matrix composites, Bond strength, Temperature, Bonding, Experimental analysis, Fibers, Composite materials, Finite element analysis, Separation (Technology)
Proceedings Papers

Adaptive Composites for Active Flight Control Surfaces

Ron Barrett, James Stutts
Proc. ASME. IMECE96, Aerospace, 471-477, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0657
https://doi.org/10.1115/IMECE1996-0657
View Paper titled, Adaptive Composites for Active Flight Control Surfaces
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Topics: Composite materials, Flight, Actuators, Temperature, Aluminum, Bonding, Design, Fracture toughness, Heat, Laminates
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
Open the PDF for A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep in another window
Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Micromanipulation Using Distributed Electromagnetic Actuators

Tadanobu Inoue, Yukio Hamasaki, Isao Shimoyama, Hirofumi Miura
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 361-366, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1375
https://doi.org/10.1115/IMECE1996-1375
View Paper titled, Micromanipulation Using Distributed Electromagnetic Actuators
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Topics: Electromagnetic actuators, Micromanipulation, Magnets, Permanent magnets, Bonding, Linkages, Manufacturing, Trajectories (Physics)
Proceedings Papers

Membrane Micromotors Based on Piezoelectric Properties of PVDF Polymer Films

Zhang Jian, De Xin Shen, Wei Yuan Wang
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 387-392, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1379
https://doi.org/10.1115/IMECE1996-1379
View Paper titled, Membrane Micromotors Based on Piezoelectric Properties of PVDF Polymer Films
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Topics: Membranes, Micromotors, Polymer films, Stators, Diaphragms (Mechanical devices), Diaphragms (Structural), Electrodes, Pressure, Rotation, Aluminum
Proceedings Papers

Studies of Artificial Cracks at Simulated Rocket Motor Liners by the Frozen Stress Method

C. W. Smith, E. F. Finlayson, C. T. Liu
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 1-8, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0138
https://doi.org/10.1115/IMECE1996-0138
View Paper titled, Studies of Artificial Cracks at Simulated Rocket Motor Liners by the Frozen Stress Method
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Topics: Engines, Fracture (Materials), Motors, Rockets, Stress, Temperature, Aluminum powders, Bonding, Elastic moduli
Proceedings Papers

Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 121-127, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1037
https://doi.org/10.1115/IMECE1996-1037
View Paper titled, Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study
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Topics: Epoxy adhesives, Epoxy resins, Silver, Bonding, Flow (Dynamics)
Proceedings Papers

A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 129-136, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1038
https://doi.org/10.1115/IMECE1996-1038
View Paper titled, A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging
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Topics: Bonding, Flames, Microelectronic packaging, Wire, Heat transfer, Temperature, Transients (Dynamics), Copper, Electric discharge, Grain boundaries
Proceedings Papers

The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates

B. Chandran, W. F. Schmidt, M. H. Gordon, R. Djkaria
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 61-66, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1003
https://doi.org/10.1115/IMECE1996-1003
View Paper titled, The Determination and Utilization of AuSn Solder Creep Properties to Bond GaAs Dice to Diamond Substrates
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Topics: Creep, Diamonds, Gallium arsenide, Solders, Bonding, Cooling, Stress, Fracture (Process), Relaxation (Physics), Fracture toughness
Proceedings Papers

A Closed Loop Pressure Assisted Boiling Point (PABP) Control System for Thermal Fusion Bonding of Thermoplastics

Kavya Dathathreya, Daniel S. Park, Taehyun Park, Steven A. Soper, Michael C. Murphy
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A017, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-96219
https://doi.org/10.1115/IMECE2022-96219
View Paper titled, A Closed Loop Pressure Assisted Boiling Point (PABP) Control System for Thermal Fusion Bonding of Thermoplastics
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Topics: Bonding, Control systems, Phase transition temperature, Pressure, Closed loop systems, Microchannels, Temperature, Rupture, Boiling, Boundary-value problems