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Proceedings Papers

Separation of a Molten Axisymmetric Solder Joint

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Lewis S. Goldmann
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 169-173, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0731
https://doi.org/10.1115/IMECE1996-0731
View Paper titled, Separation of a Molten Axisymmetric Solder Joint
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Topics: Separation (Technology), Solder joints, Ball-Grid-Array packaging, Displacement, Flip-chip, Flip-chip devices, Joining, Reliability
Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

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Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

Reliability Assessment of BGA Interconnects With CADMP-II

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F. P. McCluskey, A. Govind, D. Beaudet
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 93-100, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0895
https://doi.org/10.1115/IMECE1996-0895
View Paper titled, Reliability Assessment of BGA Interconnects With CADMP-II
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Topics: Ball-Grid-Array packaging, Reliability, Failure, Design, Failure mechanisms, Fatigue, Adhesives, Databases, Lead-free solders, Physics
Proceedings Papers

Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling

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Bor Zen Hong, Tsorng-Dih Yuan, Lloyd G. Burrell
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 39-46, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0888
https://doi.org/10.1115/IMECE1996-0888
View Paper titled, Anisothermal Fatigue Analysis of Solder Joints in a Convective CBGA Package Under Power Cycling
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Topics: Fatigue analysis, Solder joints, Fatigue, Temperature, Air flow, Alloys, Ball-Grid-Array packaging, Ceramics, Cycles, Deformation
Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

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Y. Li, R. L. Mahajan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1120
https://doi.org/10.1115/IMECE1997-1120
View Paper titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

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Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1110
https://doi.org/10.1115/IMECE1997-1110
View Paper titled, On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints
Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

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William T. Chen, David Questad, David Read, Bahgat Sammakia
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0515
https://doi.org/10.1115/IMECE1997-0515
View Paper titled, Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry
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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing
Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

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S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0814
https://doi.org/10.1115/IMECE1997-0814
View Paper titled, Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly
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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry
Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

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K. Ramakrishna, J. R. Trent
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1210
https://doi.org/10.1115/IMECE1997-1210
View Paper titled, Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

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Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

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Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0423
https://doi.org/10.1115/IMECE1998-0423
View Paper titled, Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing
Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

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Xiaoyuan He, Jiabin Dai, Sheng Liu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0430
https://doi.org/10.1115/IMECE1998-0430
View Paper titled, Automatic Warpage Measurement of Advanced Packages by Optical Method
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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

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Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0424
https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

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Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1089
https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

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Jianbiao Pan, Gregory L. Tonkay
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0920
https://doi.org/10.1115/IMECE1999-0920
View Paper titled, A Study of the Aperture Filling Process in Solder Paste Stencil Printing
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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging
Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

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V. H. Adams, K. Ramakrishna
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0922
https://doi.org/10.1115/IMECE1999-0922
View Paper titled, Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions
Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

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Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0924
https://doi.org/10.1115/IMECE1999-0924
View Paper titled, Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
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Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics
Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

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Bahgat Sammakia, Sanjeev Sathe
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0925
https://doi.org/10.1115/IMECE1999-0925
View Paper titled, Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging
Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

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T. M. Ying, K. C. Toh
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0967
https://doi.org/10.1115/IMECE1999-0967
View Paper titled, A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems
Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

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K. Ramakrishna, T.-Y. Lee
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24387
https://doi.org/10.1115/IMECE2001/HTD-24387
View Paper titled, Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size
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Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance