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Proceedings Papers

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

Yao Qiao, Seunghyun Ko, Yongsoon Shin, Jose L. Ramos, Justin L. Olson, Kevin L. Simmons
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A018, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-139915
https://doi.org/10.1115/IMECE2024-139915
View Paper titled, Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures
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Topics: Adhesive joints, Adhesives, Bonding, Epoxy adhesives, Epoxy resins, Hardening (Curing), Plasmas (Ionized gases), Polymer composites, Pressure
Proceedings Papers

Multiscale Investigation of Interfacial Adhesion Strength of Epoxy Resin Adhesives Over a Wide Range of Loading Rate

Aoi Takagi, Yuto Kasuya, Masayoshi Ogawa, Yuichi Hosoya, Akio Yonezu
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A007, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-144839
https://doi.org/10.1115/IMECE2024-144839
View Paper titled, Multiscale Investigation of Interfacial Adhesion Strength of Epoxy Resin Adhesives Over a Wide Range of Loading Rate
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Topics: Adhesion, Adhesives, Epoxy resins, Finite element methods, Lasers, Molecular dynamics, Pressure, Shock waves
Proceedings Papers

Lamb Wave-Based Inspection of Solar Cell Arrays

Mattie Green, Fadhel Alsaffar, Ajit Mal, Christoph Schaal
Proc. ASME. IMECE2024, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T05A013, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145068
https://doi.org/10.1115/IMECE2024-145068
View Paper titled, Lamb Wave-Based Inspection of Solar Cell Arrays
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Topics: Inspection, Nondestructive evaluation, Solar cell arrays, Waves, Solar cells, Adhesives, Damage, Failure, Errors, Finite element analysis
Proceedings Papers

Improved De-Bonding of Composite Adhesive Joints With Bondline Inserts

Khushboo Tedlapu, Marco Gerini-Romagnoli
Proc. ASME. IMECE2024, Volume 2: Advanced Manufacturing, V002T03A036, November 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2024-145777
https://doi.org/10.1115/IMECE2024-145777
View Paper titled, Improved De-Bonding of Composite Adhesive Joints With Bondline Inserts
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Topics: Adhesive joints, Adhesives, Bonding, Composite materials, Particulate matter, Shear (Mechanics), Testing
Proceedings Papers

Three-Dimensional Finite Element Analysis of Stress Response in Adhesive Butt Joints Subjected to Impact Bending Moments

Toshiyuki Sawa, Hirohisa Okuno, Izumi Higuchi, Shinya Kato
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 37-42, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1341
https://doi.org/10.1115/IMECE1997-1341
View Paper titled, Three-Dimensional Finite Element Analysis of Stress Response in Adhesive Butt Joints Subjected to Impact Bending Moments
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Topics: Adhesives, Finite element analysis, Stress, Shapes, Finite element methods, Young's modulus, Wave propagation, Flanges, Strain gages, Stress concentration
Proceedings Papers

Axisymmetric Stress Analysis of Bonded Shrink Fitted Joints Subjected to Torsional Loads

Masahiro Yoneno, Toshiyuki Sawa, Youichi Motegi
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 69-76, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1346
https://doi.org/10.1115/IMECE1997-1346
View Paper titled, Axisymmetric Stress Analysis of Bonded Shrink Fitted Joints Subjected to Torsional Loads
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Topics: Stress, Stress analysis (Engineering), Torsion, Adhesives, Elasticity, Rupture, Stiffness
Proceedings Papers

Axisymmetrical FEM Analysis of Adhesive Butt Joint of Finite Circular Pipe Subjected to Internal Pressure

Masahide Katsuo, Toshiyuki Sawa, Fumito Nakagawa
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 51-56, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1343
https://doi.org/10.1115/IMECE1997-1343
View Paper titled, Axisymmetrical FEM Analysis of Adhesive Butt Joint of Finite Circular Pipe Subjected to Internal Pressure
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Topics: Adhesives, Finite element methods, Pipes, Pressure, Flanges, Rupture, Stress, Stress singularity, Adhesive joints, Hydraulic pumps
Proceedings Papers

Stress Analysis and Strength of Adhesive Lap Joints of Dissimilar Hollow Shafts Subjected to Axial Load

Yuichi Nakano, Masataka Kawawaki, Toshiyuki Sawa
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 43-49, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1342
https://doi.org/10.1115/IMECE1997-1342
View Paper titled, Stress Analysis and Strength of Adhesive Lap Joints of Dissimilar Hollow Shafts Subjected to Axial Load
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Topics: Adhesives, Stress, Stress analysis (Engineering), Young's modulus, Elasticity, Tensile strength
Proceedings Papers

A Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joints Containing Some Hole Defects

Fumito Nakagawa, Toshiyuki Sawa, Yuichi Nakano, Masahide Katsuo
Proc. ASME. IMECE97, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design, 57-62, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1344
https://doi.org/10.1115/IMECE1997-1344
View Paper titled, A Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joints Containing Some Hole Defects
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Topics: Adhesive joints, Finite element analysis, Thermal stresses, Adhesives, Finite element methods, Stress, Temperature, Young's modulus
Proceedings Papers

Study of Adhesive Joints Quality Based on Multi-Camera DIC System

Bicheng Guo, Zhongfang Gao, Marco Gerini-Romagnoli, Lianxiang Yang
Proc. ASME. IMECE2023, Volume 3: Advanced Manufacturing, V003T03A035, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113687
https://doi.org/10.1115/IMECE2023-113687
View Paper titled, Study of Adhesive Joints Quality Based on Multi-Camera DIC System
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Topics: Adhesive joints, Adhesives, Bonding, Calibration, Carbon reinforced plastics, Deformation, Fracture (Materials), Fracture (Process), Carbon, Cohesion
Proceedings Papers

Modeling of Rate Effects in Detachment of Mushroom-Shaped Adhesive Structures

Ruozhang Li, Dongwu Li, Wenming Zhang
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A026, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112383
https://doi.org/10.1115/IMECE2023-112383
View Paper titled, Modeling of Rate Effects in Detachment of Mushroom-Shaped Adhesive Structures
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Topics: Adhesion, Adhesives, Modeling
Proceedings Papers

Multiscale Surface Force Models for Adhesive Metasurfaces

Corrisa R. Heyes, Joseph J. Brown
Proc. ASME. IMECE2023, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A015, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112720
https://doi.org/10.1115/IMECE2023-112720
View Paper titled, Multiscale Surface Force Models for Adhesive Metasurfaces
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Topics: Adhesives, Modeling, Manufacturing, Nanoscale phenomena, Adhesion, Bonding, Design, Electronic packaging, Metamaterials, Microfabrication
Proceedings Papers

On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)

Aoi Takagi, Yuichi Hosoya, Shotaro Yasuda, Kazuma Ogata, Tomo Takeda, Akio Yonezu
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A059, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113400
https://doi.org/10.1115/IMECE2023-113400
View Paper titled, On the Delamination of CFRP and Epoxy Adhesive Interface Using Laser Shock Adhesion Test (LaSAT)
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Topics: Adhesion, Adhesives, Bonding, Carbon reinforced plastics, Delamination, Epoxy adhesives, Epoxy resins, Lasers, Shock (Mechanics)
Proceedings Papers

Free Bending Vibrations of Partially Stiffened, Stepped-Thickness, Bonded Composite Plates and Panels

U. Yuceoglu, V. Özerciyes
Proc. ASME. IMECE96, Noise Control and Acoustics: Volume 2 — Advanced Materials for Vibro-Acoustic Applications, 191-202, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0221
https://doi.org/10.1115/IMECE1996-0221
View Paper titled, Free Bending Vibrations of Partially Stiffened, Stepped-Thickness, Bonded Composite Plates and Panels
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Topics: Composite materials, Plates (structures), Vibration, Adhesives, Shear (Mechanics), Boundary-value problems, Deflection, Deformation, Equations of motion, Mode shapes
Proceedings Papers

Adhesive Yielding in Single Lap Joints With Voids

John. N. Rossettos, Samuel. C. Sturtevant
Proc. ASME. IMECE96, Development, Validation, and Application of Inelastic Methods for Structural Analysis and Design, 297-302, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0584
https://doi.org/10.1115/IMECE1996-0584
View Paper titled, Adhesive Yielding in Single Lap Joints With Voids
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Topics: Adhesives, Stress, Design, Load bearing capacity, Shear (Mechanics), Shear stress
Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep

Anthony J. Rafanelli
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 45-58, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0722
https://doi.org/10.1115/IMECE1996-0722
View Paper titled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep
Open the PDF for A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part II — Thermal Stability and Thermo-Mechanical Creep in another window
Topics: Creep, Epoxy adhesives, Epoxy resins, Reliability, Thermal stability, Thermomechanics, Solders, Adhesives, Bonding, Fatigue
Proceedings Papers

Micro Manipulation Based on Micro Physics: Micro Pyramids on Endeffector Surface for Attractive Force Reduction

Fumihito Arai, Daisuke Andou, Yukio Nonoda, Toshio Fukuda
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 367-372, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1376
https://doi.org/10.1115/IMECE1996-1376
View Paper titled, Micro Manipulation Based on Micro Physics: Micro Pyramids on Endeffector Surface for Attractive Force Reduction
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Topics: Micromanipulation, Physics, Adhesives, Van der Waals forces, Grippers, Engineering prototypes, Machinery, Maintenance, Micromachining, Surface roughness
Proceedings Papers

Stress Analysis and Strength of Joints Combining Adhesives With Bolts Subjected to Torsions

Masahiro Yoneno, Toshiyuki Sawa, Hidekazu Nishijima, Motohiro Matsuo
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 23-29, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0856
https://doi.org/10.1115/IMECE1996-0856
View Paper titled, Stress Analysis and Strength of Joints Combining Adhesives With Bolts Subjected to Torsions
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Topics: Adhesives, Stress analysis (Engineering), Torsion, Stress, Adhesive joints, Bolted joints, Contact mechanics, Cylinders, Elasticity, Strain gages
Proceedings Papers

Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments

Toshiyuki Sawa, Katsuyuki Nakano, Hiroshi To Ratani
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 9-15, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0854
https://doi.org/10.1115/IMECE1996-0854
View Paper titled, Two-Dimensional Stress Analysis of Single-Lap Joints of Dissimilar Adherends Subjected to External Bending Moments
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Topics: Adhesive joints, Adhesives, Contact mechanics, Elasticity, Strain measurement, Stress, Stress analysis (Engineering), Stress concentration, Stress singularity, Strips
Proceedings Papers

Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joint in Steady Temperature State

Fumito Nakagawa, Toshiyuki Sawa, Yuichi Nakano, Masahide Katsuo
Proc. ASME. IMECE96, Reliability, Stress Analysis, and Failure Prevention Issues in Fastening and Joining, Composite and Smart Structures, Numerical and FEA Methods, and Risk Minimization, 17-22, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0855
https://doi.org/10.1115/IMECE1996-0855
View Paper titled, Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joint in Steady Temperature State
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Topics: Adhesive joints, Finite element analysis, Temperature, Thermal stresses, Adhesives, Finite element methods, Epoxy resins, Resins, Thermal conductivity