Abstract

Due to the small size of structures in modern microdevices, surface forces can create undesirable adhesion between microstructures, which is referred to as stiction. Prior investigations have used ultrashort-pulse lasers to recover stiction-failed microcantilevers. The current experiments study the use of a 400 ns, 1064 nm, Nd:YAG laser to free polycrystalline silicon microcantilevers stuck to the underlying substrate. The results show that a Nd:YAG, 1064 nm laser is capable of recovering failed microstructures with yields exceeding those reported in earlier studies. Yields of 100 percent for cantilevers up to 1 mm in length were demonstrated for several laser operating conditions. The yields are strongly dependent on laser fluence and slightly dependent on exposure time, with a single-shot at 160 mJ/cm2 resulting in yields around 60 percent.

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