Heat pipe vapor chamber cold plates (HPVCCP) utilize highly efficient two-phase flow heat transfer to distribute concentrated heat to larger surface areas for effective dissipation. Because of the isothermal heat transfer characteristics, the HPVCCP is particularly suited for effective cooling of electronics. This paper presents the results of a recently completed study by Thermacore, Inc. on HPVCCP modeling, analysis, design, fabrication, processing, and testing. A two-dimensional numerical model was developed to calculate the liquid flow pressure distribution in the porous wick structure that is critical to determining the wick capillary limitation. A thermal network model was developed to calculate the temperature differences between the heating and cooling surfaces. Prototype, large size HPVCCP design, fabrication and testing issues are also discussed in the paper.

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