Abstract
Characterization data for polished 300mm silicon wafers has been obtained, including wafer supplier process and reclaim capability, flatness, particles, interstitial oxygen, metrology tool availability, and tool contamination. Silicon supplier-I300I correlation studies are also detailed.
Volume Subject Area:
Technological Advances in Critical Areas of Wafer and Electronics Manufacturing
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Copyright © 1998 by The American Society of Mechanical Engineers
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