Abstract

A blister-like local buckling of polysilicon microbeams is observed at the end of the fabrication process. This buckling mode is a result of the capillary forces, developed during the drying stage, and the compressive residual stress in the polysilicon beams. A variety of microbeams were fabricated to study this phenomenon. The major parameters controlling the blister-like buckling have been identified experimentally. Furthermore, a model equation is derived to predict the blister properties as a function of the initial conditions. The agreement between the predictions and the measurements is found to be satisfactory.

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