The thermal-mechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep and fatigue, are carried out on a computer controlled 6-axis mini fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study it is clear that the new lead free solder alloy is a potential replacement for the currently used Sn-Pb solders for electronics packaging applications.

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