Electrically conductive epoxies have become attractive alternatives to traditional tin-lead solder as bonding media for electronic interconnections. However, these materials, being of a different nature than solder, have not undergone as extensive material and mechanical characterization as the latter. Subsequently, a comprehensive, multi-phase evaluation is warranted prior to approving a direct substitution. Such an evaluation would include several key mechanical studies such as basic material properties, fatigue, creep, and fracture. This paper reports on results of fracture property studies, namely determination of the J-Integral on samples of conductive adhesive epoxies. In addition, testing was also performed on eutectic or near eutectic solder, to provide a benchmark for comparison.

This content is only available via PDF.
You do not currently have access to this content.