The increase in the power of chips and microchips has resulted in the generation of heat fluxes to be dissipated of the order of 100 W/cm2 in very small areas [1], therefore, dissipating this heat has become a priority for the proper functioning of these dispositives. Thus, the proposition of new geometries and dissipation methods has become an area of great interest in scientific research. This research presents the analysis of a new geometry for a heat sink capable of dissipating very high energy flows by means of liquid cooling. The analyzes are based on previous analyzes of serpentine type geometries, where the heat flux to dissipate was 10 W/cm2 [2]. The operating conditions, such as velocity and pressure drop, as well as heat transfer are analyzed. Water is used as the dissipation fluid at an inlet velocity of 0.1 m/s. The geometry to be analyzed, called “Aztec Geometry,” is a radial type geometry that was originally designed for fuel cells, and has small fins arranged in three radial stripes. The results indicate that the pressure drop is on the order of 85 Pa, which is less than the pressure drop when radial coil microchannels are used (between 100 and 870 Pa). The dissipated heat is larger than the heat dissipated in radial coil microchannels (205 W versus 145 and 194 W), proving that the proposed radial geometry has a greater dissipation capacity at a lower cost than previously proposed geometries in the market.

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