For thermal management architectures wherein the heat sink is embedded close to a dynamic heat source, non-uniformities may propagate through the heat sink base to the coolant. Available transient models predict the effective heat spreading resistance to calculate chip temperature rise, or simplify to a representative axisymmetric geometry. The coolant-side temperature response is seldom considered, despite the potential influence on flow distribution and stability in two-phase microchannel heat sinks. This study uses multi-dimensional transient and steady-periodic models to predict spatial and temporal variations of temperature within the heat sink base. The response to arbitrary transient heat inputs is obtained using Duhamel’s method. For time-periodic heat inputs, the steady-periodic solution is calculated using the method of complex temperature. Solution of the coolant-side temperature response in the presence of multiple different transient heat inputs is demonstrated. The degree of spatial and temporal non-uniformity in the coolant-side temperature profiles are mapped as a function of nondimensional geometric parameters and boundary conditions. Several case studies are presented to demonstrate the utility of such maps.
Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base
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Sudhakar, S, & Weibel, JA. "Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base." Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. Phoenix, Arizona, USA. November 11–17, 2016. V010T13A055. ASME. https://doi.org/10.1115/IMECE2016-67639
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