In this paper, a miniature loop heat pipe (mLHP) with a flat evaporator is illustrated and investigated experimentally, with water as the working fluid. The mLHP can be applied for the mobile electronics cooling, such as tablet computers and laptop computers, with a 1.2 mm thick ultra-thin flat evaporator and a thickness of 1.0 mm for the vapor line, liquid line and condenser. A narrow sintered copper mesh in the liquid line and a part of the condenser as the secondary wick can promote the flow of the condensed working fluid back to the evaporator. The experimental results showed that the mLHP could start up successfully and operate stably at low heat load of 3 W in the horizontal orientation, and transport a high heat load of 12 W (the heat flux of 4 W/cm2) with the evaporator temperature below 100 °C in different test orientations by natural convection, showing good operational performance against gravity field. The minimum mLHP thermal resistance of 0.32 K/W was achieved at the input heat load of 12 W in the horizontal orientation.
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ASME 2016 International Mechanical Engineering Congress and Exposition
November 11–17, 2016
Phoenix, Arizona, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5062-6
PROCEEDINGS PAPER
Experimental Study on Heat Transfer Capability of a Miniature Loop Heat Pipe
Guohui Zhou,
Guohui Zhou
University of Chinese Academy of Sciences, Beijing, China
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Ji Li,
Ji Li
University of Chinese Academy of Sciences, Beijing, China
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Lucang Lv
Lucang Lv
University of Chinese Academy of Sciences, Beijing, China
Search for other works by this author on:
Guohui Zhou
University of Chinese Academy of Sciences, Beijing, China
Ji Li
University of Chinese Academy of Sciences, Beijing, China
Lucang Lv
University of Chinese Academy of Sciences, Beijing, China
Paper No:
IMECE2016-66566, V008T10A047; 7 pages
Published Online:
February 8, 2017
Citation
Zhou, G, Li, J, & Lv, L. "Experimental Study on Heat Transfer Capability of a Miniature Loop Heat Pipe." Proceedings of the ASME 2016 International Mechanical Engineering Congress and Exposition. Volume 8: Heat Transfer and Thermal Engineering. Phoenix, Arizona, USA. November 11–17, 2016. V008T10A047. ASME. https://doi.org/10.1115/IMECE2016-66566
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